Ceramic powder is an important material used for various purposes in advanced industries, and the fundamental properties of ceramic powder such as particle size, particle size distribution, and flow properties play a decisive role in determining the quality and performance of the final product. In general, these properties have been evaluated through particle size and shape analysis. However, these methods have limitations in providing a comprehensive understanding phenomena related to powder flow, coagulation, and wear. Consequently, performance evaluation based on the analysis of powder flow properties has been increasingly adopted. Previously, flow properties were primarily assessed using funnel-based methods. However, these methods have limitations, as they are challenging to apply to powders smaller than a few micrometers or those with strong coagulation tendencies, and they also suffer from low reliability. To address these issues, this paper introduces a novel piece of equipment that measures flow properties using image analysis and presents various parameters for static and dynamic flow behavior based on this technique. The proposed equipment offers exceptional versatility, as it can be applied to all types of ceramic powders regardless of their size or shape. The principles and measurement methods of the equipment are demonstrated through static and dynamic image analysis of ceramic powders with varying sizes and shapes used as examples.
Metal oxide varistors (MOVs) protect circuits and devices from transient overvoltages in electric power systems. However, a MOV continuously deteriorates owing to manufacturing defects or repetitive protective operations from transient overvoltages. A deteriorated MOV may result in a short circuit or a line-ground accident. Previous studies focused on the analysis of deterioration mechanisms and condition diagnosis techniques for MOVs owing to their recent growth of use. An accelerated deterioration experiment under the same conditions in which a MOV operates is essential. In this study, we designed and fabricated a surge generator that can apply a surge current to a MOV connected to AC mains. The coupling network operates at a low impedance against the surge current from the surge generator and transfers the surge current to the MOV under test. It also acts as a high impedance against AC mains for the AC voltage not to be applied to the surge generator. The decoupling network operates at a high impedance against the surge current and blocks the surge current from AC mains. It also acts as a low impedance against AC mains for the AC voltage to be applied to the MOV under test. The prototype surge generator can apply the 8/20 us up to 15 kA on AC voltages in the approximate range of 110~450 V, and it fully operates on a LabVIEW-based program.
Recently, inverter control systems have attracted immense attention to increase the energy efficiency. However, such systems use repeated on/off high currents for linear operation control, instead of the prevalent step variable current control method. Hence, there arise concerns of personal and property damage, especially due to the durability, explosive characteristics, and operating speed of the fuse, which is responsible for safety and is one of the internal components using current control. Therefore, in this paper, we propose an IEC60127-4 SMD sub-miniature fuse, consisting of Ag-Cu alloys and ceramic powder for arc soothing. The IEC60127-4 SMD sub-miniature fuse has high durability and cut-off capacity, and operates safely in dangerous circumstances caused by the inverter control system.
With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.
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TBP (tertiarybutylphosphine), a relatively new material for phosphorus, has been studied with EDMIn (ethyldimethylindium) as an indium source for the growth of InP by MOVPE (metalorganic vapor phase epitaxy). Mirror smooth and good crystalline InP layers were obtained at 500-600℃ with the TBP/EDMIn molar ratio as low as 21. The deposited InP layers are all n-type with the electron concentration in the range of (5-10)×10(16) cm-3, which is a lot higher than those from PH3. This high concentration is due presumably to the high concentration of donor impurities in TBP. And it has been found that the formation of adduct occurs between EDMIn and TBP at room temperature when the partial pressure of EDMIn in the reactant mixture is above 1×10(-2) Torr. The high concentration of impurities in TBP and the adduct formation between EDMIn and TBP are major obstacles in replacing PH3 and TMIn for the growth of device quality InP layers.
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