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산화막 CMP에서 패드 두께가 연마율과 연마 불균일도에 미치는 영향

배재현, 이현섭, 박재홍, 니시자와히데키, 키노시타마사하루, 정해도

Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP

Jae Hyun Bae, Hyun Seop Lee, Jae Hong Park, Hideaki Nishizawa, Masaharu Kinoshita, Hae Do Jeong
J Electr Electron Mater 2010;23(5):358-363.
Published online: May 1, 2010
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Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP
J Electr Electron Mater. 2010;23(5):358-363.   Published online May 1, 2010
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP
J Electr Electron Mater. 2010;23(5):358-363.   Published online May 1, 2010
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