Aging Effects of Silica Slurry and Oxide CMP Characteristics

U Seon Lee; Pil Ju Go; Yeong Sig Lee; Yong Jin Seo; Gwang Jun Hong

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실리카 슬러리의 에이징 효과 및 산화막 CMP 특성

이우선, 고필주, 이영식, 서용진, 홍광준

Aging Effects of Silica Slurry and Oxide CMP Characteristics

U Seon Lee, Pil Ju Go, Yeong Sig Lee, Yong Jin Seo, Gwang Jun Hong

J Electr Electron Mater 2004;17(2):138-143.
Published online: February 1, 2004

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Keywords: Chemical mechanical polishing, CMP, Slurry, Removal rate, Non-uniformity

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Aging Effects of Silica Slurry and Oxide CMP Characteristics

J Electr Electron Mater. 2004;17(2):138-143. Published online February 1, 2004

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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Aging Effects of Silica Slurry and Oxide CMP Characteristics

J Electr Electron Mater. 2004;17(2):138-143. Published online February 1, 2004

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실리카 슬러리의 에이징 효과 및 산화막 CMP 특성

Aging Effects of Silica Slurry and Oxide CMP Characteristics

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