In this study, effects of ICP (inductively coupled plasma) treatment on PAR thin film have been investigated. A maximum etch rate of the PAR thin films and the selectivity of PAR to PR were obtained as 110 nm/minand 1.1 in the CF₄/O₂ (5:15 sccm) gas mixture. We present the surface properties of PAR thin film with various treatment conditions. The surface morphology and cross section of the PAR thin film was observed by AFM (atomic force microscopy) and FE-SEM (filed emission scanning electron microscopy).

Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.

Al:ZnO thin films were deposited using the radio frequency magnetron sputtering technique at various temperatures and sputtering powers. With the increase in the deposition temperature and the decrease in the radio frequency sputtering power, the crystallinity was increased and the surface roughness was decreased, which lead to the decrease in the electrical resistivity of the film. It is also clearly observed that, the intensity of the (002) XRD peak increases with increasing the substrate temperature [1, 2]. The electrical resistivity and optical transmittance of the Al:ZnO thin film were analyzed as a function of the post-annealing temperature. It can be seen that with the annealing temperature set at 400℃, the resistivity decreases to a minimum value of 4.1×10-3 Ωcm and the transmittance increases to a maximum value of 85% of the Al:ZnO thin film.

In this paper, we investigated the etching characteristics of the TaN thin films and the surface reaction of TaN thin films after etching process. The etching characteristics of the TaN thin films were carried out using inductively coupled plasma (ICP). The etch rate and the selectivity of TaN to SiO2 and TaN to PR were measured by varying the gas mixing ratio, RF power, DC-bias voltage, and process pressure in CF-based plasma. The surface reaction of TaN thin films were determined by x-ray photoelectron spectroscopy (XPS).

We investigated the dry etching characteristics of TiN in TiN/A12O3: gate stack using a inductively coupled plasma system. TiN thin film is etched by BCI3/He plasma. The etching parameters are the gas mixing ratio, the RF power, the DC-bias voltages and process pressures. The highest etch rate is in BClilHe (25%:75%) plasma. The selectivity of TIN thin film to Al2O3 is pretty similar with BCI3/He plasma, The chemical reactions of the etched TiN thin films arc investigated by X - ray photoelectron spectroscopy, The intensities of the Ti 2p and the N is peaks are modified by BCl3: plasma, Intensity and binding energy of Ti and N could be changed due to a chemical reaction on the surface of TiN thin films. Also we investigated that the non volatile byproducts such as TiClx formed by chemical reaction with CI radicals on the surface of TiN thin films.

The optical losses associated with the reflectance of incident radiation are among the most important factors limiting the efficiency of a solar cell. Therefore, photovoltaic cells normally require special surface structures or materials, which can reduce reflectance. In this study, nano-scale textured structures with anti-reflection properties were successfully formed on silicon. The surface of sicon wafer was etched by the inductively coupled plasma process using the gaseous mixture of SF6+O2. We demonstrate that the reflection characteristic has significantly reduced by ∼0% compared with the flat surface. As a result, the power efficiency Pmax of the nano-scale textured silicon solar cell were enhanced up to 20%, which can be ascribed primarily to the improved light trapping in the proposed nano-scale texturing.

The etching characteristics of ZnO and etch selectivities of ZnO to SiO2 in SF6/Ar plasma were investigated using Inductively-coupled-plasma (ICP). The maximum etch rates of ZnO were 6.5 nm/min at SF6(50%)/Ar(50%), Source power (700 W), Bias power (250 W), Working pressure(8 mTorr). The etch rate of ZnO showed a non-monotonic behavior with increasing from 0% to 50% Ar fraction in SF6/ Ar plasma. The plasma diagnostic were characterized using Optical Emission Spectroscopy (OES) analysis measurements.

In this study, the surface modification for a silicon(Si) mold using CHF3 inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to CF(x)(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

In this work, we investigated to the etching characteristics of the TiN thin film in He/BCl3/Cl2 plasma. The etch rate was measured by the gas mixing ratio, the RF power, the DC bias voltage and the process pressure. The maximum etch rate in He/BCl3/Cl2 plasma was 59 nm/min. The etch rate increased as the RF power and the DC-bias voltage was increased. The chemical reaction on the surface of the etched the TiN thin films was investigated with X-ray photoelectron spectroscopy (XPS). The intensity of Ti 2p and N 1s peaks are varied during etching process. A new peak was appeared in He/BCl3/Cl2 plasma. The new peak was revealed Ti-Clx by Cl 2p peak of XPS wild scan spectra analysis.

The silicon nitride films were prepared by chemical vapor deposition using inductively coupled plasma. During the deposition, the substrate was heated at 150℃ and power 1,000 W. To evolution low temperature manufacture, we have studied the role of source gases, SiH4, NH3, N2, and H2, to produce Si-N and N-H bond in a-SiNx:H film growth. SiH4, NH3, and N2 flow rate fixed at 100, 10, and 10 sccm, H2 flow rate varied from 0 to 10 sccm by small scale. To get the electrical characteristics, we make MIM structure, and analysis surface bonding state. Experimental data show that Si-N and N-H bond is increased and hence electrical characteristics is showed 3 MV/cm breakdown-voltage, and leakage-current 10(-7) A/cm2.

In this study, the etching characteristics of Al2O3 thin films were investigated using an ICP (inductively coupled plasma) of BCl3/Ar gas mixture. The etch rate of Al2O3 thin films as well as the SiO2/Al2O3 etch selectivity were measured as functions of BCl3/Ar mixing ratio (0∼100% Ar) at a constant gas pressure (10 mTorr), total gas flow rate (40 sccm), input power (800 W) and bias power (100 W). The behavior of the Al2O3 etch rate was shown to be quite typical for ion-assisted etch processes with a dominant chemical etch pathway. To analyze the etching mechanism using DLP (double langmuir probe), OES (optical emission spectroscopy) and surface analysis using XPS (x-ray photoelectron spectroscopy) were carried out.

This work, the etching characteristics of Ba2Ti9O20(BTO) thin films were investigated using an inductively coupled plasma (ICP) of Ar/Cl2 gas mixture. The etch rate of BTO thin films as well as the BTO/SiO2 and BTO/PR etch selectivity were measured as functions of Ar/Cl2 mixing ratio (0∼100% Ar) at a constants gas pressure (6 mTorr), total gas flow rate (50 sccm), input power (700 W) and bias power (200 W). The etch rate of BTO thin films decreased with increasing Ar fraction. To analyze the etching mechanism an optical emission spectroscopy (OES), double Langmuir probe(DLP) and surface analysis using X-ray photoelectron spectroscopy (XPS) were carried out.

In this work, the etching characteristics of ZnO thin films were investigated using an inductively coupled plasma(ICP) of HBr/Ar/CHF3 gas mixtures. The plasma characteristics were analyzed by a quadrupole mass spectrometer (QMS) and double langmuir probe (DLP). The surface reaction of the ZnO thin films was investigated using X-ray photoelectron spectroscopy (XPS). The etch rate of ZnO was measured as a function of the CHF3 mixing ratio in the range of 0-15% in an HBr:Ar=5:2 plasma at a fixed gas pressure (6mTorr), input power (700 W), bias power (200 W) and total gas flow rate(50sccm). The etch rate of the ZnO films decreased with increasing CHF3 fraction due to the etch-blocking polymer layer formation.

In this study, HfAlO3 thin films using gate insulator of MOSFET were etched in inductively coupled plasma. The etch characteristics of the HfAlO3 thin films has been investigated by varying O2/BCl3/Ar gas mixing ratio, a RF power, a DC bias voltage and a process pressure. As the O2 concentration increases further, HfAlO3 was redeposited. As increasing RF power and DC bias voltage, etch rates of the HfAlO3 thin films increased. Whereas, as decreasing of the process pressure, etch rates of the HfAlO3 thin films increased. The chemical reaction on the surface of the etched the HfAlO3 thin films was investigated with X-ray photoelectron spectroscopy (XPS). These peaks moved a binding energy. This chemical shift indicates that there are chemical reactions between the HfAlO3 thin films and radicals and the resulting etch by-products remain on the surface.