High-density crossbar arrays based on storage class memory (SCM) are ideally suited to handle an exponential increase in data storage and processing as a central hardware unit in the era of AI-based technologies. To achieve this, selector devices are required to be co-integrated with SCM to address the sneak-path current issue that indispensably arises in such crossbar-type architecture. In this perspective, we first summarize the current state of tellurium-based threshold-switching devices and recent advances in the material, processing, and device aspects. We thoroughly review the physicochemical properties of elemental tellurium (Te) and representative binary tellurides, their tailored deposition techniques, and operating mechanisms when implemented in two-terminal threshold switching devices. Lastly, we discuss the promising research direction of Te-based selectors and possible issues that need to be considered in advance.
The ferroelectricity in Hf0.5Zr0.5O2 (HZO) thin films is one of the most interesting topics for next-generation nonvolatile memory applications. It is known that a crystallization process is required at a temperature of 400℃ or higher to form an orthorhombic phase that results in the ferroelectric properties of the HZO film. However, to realize the integration of ferroelectric HZO films in the back-end-of-line, it is necessary to reduce the annealing temperature below 400℃. This study aims to comprehensively analyze the ferroelectric properties according to the annealing temperature (350-500℃) and time (1-5 h) using a furnace as a crystallization method for HZO films. As a result, the ferroelectric behaviors of the HZO films were achieved at a temperature of 400℃ or higher regardless of the annealing time. At the annealing temperature of 350℃, the ferroelectric properties appeared only when the annealing time was sufficiently increased (4 h or more). Based on these results, it was experimentally confirmed that the optimization of the annealing temperature and time is very important for the ferroelectric phase crystallization of HZO films and the improvement of their ferroelectric properties.
ZnO-based transparent conductive films have been widely studied to achieve high performance optoelectronic devices such as next generation flexible and transparent display systems. In order to achieve a transparent flexible ZnO-based device, a low temperature growth technique using a flexible polymer substrate is required. In this work, high quality flexible ZnO films were grown on colorless polyimide substrate using atomic layer deposition (ALD). Transparent ZnO films grown from 80 to 200℃ were fabricated with a metal-semiconductor-metal structure photodetectors (PDs). As the growth temperature of ZnO film increases, the photocurrent of UV PDs increases, while the sensitivity of that decreases. In addition, it is found that the response times of the PDs become shorter as the growth temperature increases. Based on these results, we suggest that high-quality ZnO film can be grown below 200℃ in an atomic layer deposition system, and can be applied to transparent and flexible UV PDs with very fast response time and high photocurrent.
We report on thin-film transistors based on TiOx pre-annealed by femtosecond laser pulses. A 30-nm thick TiOx active channel layer was initially deposited by an ALD system. The TiOx semiconducting films were annealed by irradiation with a femtosecond laser (power: 3 W/cm2) for 5, 25, and 50s. Atomic force microscopy images revealed that the surface of a TiOx film without femtosecond laser pre-annealing was relatively rough, while after annealing with femtosecond laser pulses, the surface of the TiOx films became smooth. With increasing radiation time, the surrounding gas atmosphere could have a larger impact on the TiOx surface; meanwhile, the thin-film roughness decreased. Thin-film transistors with TiOx active channels pre-annealed at 50s exhibited good transfer characteristics and an on-to-off current ratio of ~103.
IZO transistors with Al2O3 as gate dielectrics have been investigated. To improve permittivity in an ambient dielectric layer, we grew Al2O3 by atomic layer deposition directly onto the substrates. Then, we prepared IZO semiconductor solutions with 0.1 M indium nitrate hydrate [In(NO3)3·xH2O] and 0.1 M zinc acetate dehydrate [Zn(CH3COO)2·2H2O] as precursor solutions; the IZO solution made with a molar ratio of 7:3 was then prepared. It has been found that these oxide transistors exhibit low operating voltage, good turn-on voltage, and an average field-effect mobility of 0.90 ㎠/Vs in ambient conditions. Studies of low-voltage driving of IZO transistors with atomic layer-deposited high-k Al2O3 as gate dielectric provide data of relevance for the potential use of these materials and this technology in transparent display devices and displays.
Titanium oxide (TiO2) thin films were synthesized on polymer insulator and Si substrates by atomic layer deposition (ALD) method. The surface and electrical properties of TiO2 films synthesized at various ALD cycle numbers were investigated. The synthesized TiO2 films exhibited higher contact angle and smooth surface. The contact angle of TiO2 films was increased with the increase of ALD-cycle number. Also, the rms surface roughness of films was slightly rough with the increase of ALD-cycle number. The leakage current on TiO2 film surface synthesized at various conditions were uniformed, and the values were decreased with the increase of ALD-cycle number. In the results, the performance of TiO2 films for self-cleaning critically depended on a number of ALD-cycle.
We have investigated the properties of Al-doped ZnO (AZO) thin films as functions of atomic layer deposition (ALD) oxidants. AZO transparent conducting oxides (TCOs) layer was deposited by ALD with adding trimethylaluminum (TMA) and diethylzinc (DEZn). AZO films were deposited at low temperature with H2O and O3 as oxidants. Electrical, optical and structural properties of AZO thin films were investigated by 4-point probe, Hall effect measurement, UV-VIS, and AFM. Microstructure and atomic bonding states were investigated by HRXRD and XPS. The resistivity of AZO films grown using H2O was lower than the films grown using H2O and O3, by approximately two orders of magnitude. The differences in oxygen vacancy peak intensity of AZO films were correlated to the optical and electrical properties.
In this paper, TiO2 based thin-film transistors (TFTs) were fabricated using by an atomic layer deposition with high aspect ratio and excellent step coverage. Ti02 semiconducting layer was deposited showing a rutile phase through the rapid thermal annealing process, and exhibited TFT characteristics with a 200 pm channel length of low-leakage currents (none of current flow during off-state), stable threshold voltages (-10 V - 0 V), and a much higher on/off current ratio (
For feasible study of opto-electrical application regarding to oxide semiconductor, weimplemented the N doped ZnO growth using a atomic layer deposition technique. The p-type ZnOdeposition, necessary for ZnO-based optoelectronics, has considered to be very difficulty due tosufficiently deep acceptor location and self-compensating process on doping. Various sources of N such asN2, NH3, NO, and NO2 and deposition techniques have been used to fabricate p-type ZnO. Hallmeasurement showed that p-type ZnO was prepared in condition with low deposition temperature anddopant concentration. From the evaluation of photoluminescence spectroscopy, we could observe defectformation formed by N dopant. In this paper, we exhibited the electrical and optical properties of N-dopedZnO thin films grown by atomic layer deposition with NH3OH doping source.
Aluminum oxide(Al2O3) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surfaces. Since Al2O3 has fixed negative charge, it forms effective surface passivation by field effect passivation on the rear side in p-type silicon solar cell. However, Al2O3 layer formed by ALD process needs very long process time, which is not applicable in mass production of silicon solar cells. In this paper, plasma-assisted ALD(PA-ALD) was applied to form Al2O3 to reduce the process time. Al2O3 synthesized by ALD on c-Si (100) wafers contains a very thin interfacial SiO2 layer, which was confirmed by FTIR and TEM. To improve passivation quality of Al2O3layer, the deposition temperature was changed in range of 150∼350℃, then the annealing temperature and time were varied. As a result, the silicon wafer with aluminum oxide film formed in 250℃, 400℃ and 10min for the deposition temperature, the annealing temperature and time, respectively, showed the best lifetime of 1.6ms. We also observed blistering with nanometer size during firing of Al2O3 deposited on p-type silicon.
Al-doped ZnO film on glass substrate is deposited by ALD in low temperature, using 4-step process (DEZ-H2O-TMA-H2O). To find out the optimal film condition for TCO material, we fabricate Al-doped ZnO films by increasing Al doping concentration at 100℃, so that the Al-doped film of 5 at% shows the lowest resistivity (1.057×10(-2) Ω·cm) and the largest grain size (38.047 nm). Afterwards, the electrical and physical characteristics in Al-doped films of 5 at% are also compared in accordance with increasing deposition temperature. All the films show the optical transmittance over 80% and the film deposited at 250℃ demonstrates the superior resistivity (1.237×10(-4) Ω·cm).
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