The advantage of OTFT technology is that large-area circuits can be manufactured on flexible substrates using a lowcost solution process such as inkjet printing. Compared to silicon-based inorganic semiconductor processes, the process temperature is lower and the process time is shorter, so it can be widely applied to fields that do not require high electron mobility. Materials that have utility as electrode materials include carbon that can be solution-processed, transparent carbon thin films, and metallic nanoparticles, etc. are being studied. Recently, a technology has been developed to facilitate charge injection by coating the surface of the Al electrode with solution-processable titanium oxide (TiOx), which can greatly improve the performance of OTFT. In order to commercialize OTFT technology, an appropriate method is to use a complementary circuit with excellent reliability and stability. For this, insulators and channel semiconductors using organic materials must have stability in the air. In this study, carbon-doped Mo (MoC) thin films were fabricated with different graphite target power densities via unbalanced magnetron sputtering (UBM). The influence of graphite target power density on the structural, surface area, physical, and electrical properties of MoC films was investigated. MoC thin films deposited by the unbalanced magnetron sputtering method exhibited a smooth and uniform surface. However, as the graphite target power density increased, the rms surface roughness of the MoC film increased, and the hardness and elastic modulus of the MoC thin film increased. Additionally, as the graphite target power density increased, the resistivity value of the MoC film increased. In the performance of an organic thin film transistor using a MoC gate electrode, the carrier mobility, threshold voltage, and drain current on/off ratio (Ion/Ioff) showed 0.15 cm2/V·s, -5.6 V, and 7.5×104, respectively.
Generally, diamond-like carbon films (a-C:H, DLC) have been shown to have a low coefficient of friction, a high hardness and a low wear rate. Pd-doped C thin film was fabricated using a dual magnetron sputtering with two targets of graphite and palladium. Graphite target RF power was fixed and palladium target RF power was varied. The structural, physical, and surface properties of the deposited thin film were investigated, and the correlation among these properties was examined. The doping ratio of Pd increased as the RF power increased, and the surface roughness of the thin film decreased somewhat as the RF power increased. In addition, the hardness value of the thin film increased, and the adhesive strength was improved. It was confirmed that the value of the contact angle indicating the surface energy increases as the RF power increases. It was concluded that the increase in RF power contributed to the improvement of the physical properties of Pd-doped C thin film.
In the case of ZnO:Al thin films, it is the best material that can replace ITO that is mainly used as a transparent electrode in electronic devices such as solar cells and flat-panel displays. In this study, ZnO:Al films were fabricated by using the RF dual magnetron sputtering method at various substrate temperatures. As the substrate temperature increased, the crystallinity of the ZnO:Al thin films was improved, and the electrical conductivity and electrical properties of the thin film improved owing to the increase in grain size. In addition, the surface roughness of the ZnO:Al thin films increased due to changes in the surface and density of the thin films. Moreover, the substrate temperature increased the density of thin films and improved their transmittance. To be applied to solar cells and other several electronic devices in the future, the hardness and adhesion properties of the thin film improve as the substrate temperature increases.
Using facing target magnetron sputtering (FTMS) with a graphite target source, carbon nitride thin films were deposited on silicon and glass substrates at different substrate temperatures to confirm the tribological, electrical, and structural properties of thin films. The substrate temperatures were room temperature, 150℃, and 300℃. The tribology and electrical properties of the carbon nitride thin films were measured as the substrate temperature increased, and a study on the relation between these results and structural properties was conducted. The results show that the increase in the substrate temperature during the fabrication of the carbon nitride thin films increased the hardness and elastic modulus values, the critical load value was increased, and the residual stress value was reduced. Moreover, the increase in the substrate temperature during thin-film deposition was attributed to the improvement in the electrical properties of carbon nitride thin film.
In this study, we tried finding new materials to improve the stain resistance properties of polymer insulating materials. Using the filtered vacuum arc source (FVAS) with a graphite target source, DLC thin films were deposited on silicon and polymer insulator substrates depending on their thickness to confirm the surface properties, physical properties, and structural properties of the thin films. Subsequently, the possibility of using a DLC thin film as a protective coating material for polymer insulators was confirmed. DLC thin films manufactured in accordance with the thickness of various thin films exhibited a very smooth and uniform surface. As the thin film thickness increased, the surface roughness value decreased and the contact angle value increased. In addition, the elastic modulus and hardness of the DLC thin film slightly increased, and the maximum values of elastic modulus and hardness were 214.5 GPa and 19.8 GPa, respectively. In addition, the DLC thin film showed a very low leakage current value, thereby exhibiting electrical insulation properties.
The effects of compaction methods on the sintering density, microstructures, and mechanical properties were investigated in α-alumina ceramics. α-Alumina powders were granulated with a 10% aqueous solution of polyvinyl alcohol (PVA). Uniaxially pressed (UAP) and cold isostatic-pressed (CIP) samples were prepared by pressing uniaxially at a pressure of 1 ton for 1 min, and isostatically at 200 MPa for 15 min, respectively. Subsequently, both types of samples were sintered at 1,200℃, 1,300℃, 1,400℃, 1,450℃, 1,500℃, 1,550℃, and 1,600℃ at a rate of 5℃/min for 2 h. The CIP samples were better than the UAP samples for all properties measured, such as the sintering density, Vicker’s hardness, and toughness. The CIP sample sintered at 1,400℃ showed the maximum Vicker’s hardness and toughness; this may be attributed to the competing effects of a decrease in porosity and the growth of grains with increasing sintering temperature.
TiN thin films were fabricated using an unbalanced magnetron sputtering (UBMS) system, and their structure and surface characteristics as well as their optical and tribological properties were evaluated. The hardness, elastic modulus, adhesive force, surface roughness, and transmittance of the Ti thin films fabricated using the UBMS system were 11.5 GPa, 103 GPa, 27.5 N, 2.45 nm and 20%, respectively. The TiN films prepared with various proportions of nitrogen as the reaction gas exhibited maximum values for the hardness, elastic modulus, critical load, RMS roughness and transmittance of approximately 19.2 GPa, 182 GPa, 27.3 N, 0.98 nm, and 85%, respectively. Moreover, the TiN thin film fabricated under the condition of 30 sccm nitrogen gas showed the optimal physical properties. In summary, the TiN thin films fabricated using the UBMS system exhibited excellent hardness, elastic modulus, adhesion, and smooth surface in addition to good hydrophilic properties.
We investigated the tribological properties of amorphous carbon (a-C) films deposited with CrC interlayers of various thicknesses as the adhesive layer. A-C and CrC thin films were deposited using the unbalanced magnetron (UBM) sputtering method with graphite and chromium as the targets. CrC films as the interlayer were fabricated under a-C films, and various structural, surface, and tribological properties of a-C films deposited with various CrC interlayer thicknesses were investigated. With various CrC interlayer thicknesses under a-C films, the tribological properties of CrC/a-C films were improved; the increased film thickness exhibited a maximum high hardness of over 27.5 GPa, high elastic modulus of over 242 GPa, critical load of 31 N, residual stress of 1.85 GPa, and a smooth surface below 0.09 nm at the condition of 30-nm CrC thickness.
Various Ni-doped carbon (C：Ni) thin films were fabricated using different Ni target power densities by unbalanced magnetron sputtering (UBM). The effects of target power density on the structural, physical, surface, and electrical properties of C：Ni films were investigated. The UBM C：Ni thin films exhibited uniformly smooth surfaces. The rms surface roughness and friction coefficient values of the C：Ni films decreased with the increase in target power density. The physical properties of the films such as hardness and elastic moduli increased while their electrical properties such as resistivity decreased with the increase in the target power density. These results show that an increase of the power density leads to an increase in the proportion of Ni and nanocrystallization of the amorphous carbon film; this contributes to the changes observed in the physical and electrical characteristics.
3YSZ + (x) Al2O3 composites (x = 20, 40, 60, 80 wt%) were fabricated and the influences of particle sizes of Al2O3 on their microstructures and mechanical properties were investigated with XRD, SEM, vickers hardness and fracture toughness. Al2O3-3YSZ composites containing Al2O3 powder of a 0.3 μm and an 1.0 μm, which are here in after named as Al2O3(0.3 μm)-3YSZ and Al2O3 (1.0 μm)-3YSZ, respectively, were made by mixing raw materials, uni-axial pressing and sintering at 1,400℃, 1,500℃, and 1,600℃. Al2O3 (0.3 μm)-3YSZ composites show the higher density and the better mechanical properties than Al2O3 (1.0 μm)-3YSZ composites. The Vickers hardness of the Al2O3 (0.3 μm)-3YSZ composites show a peak value of 1,997 Hv at the content of 60 wt% Al2O3, which is a slightly higher value in comparison with 1,938 Hv of the Al2O3(1.0 μm)-3YSZ composite. However, the fracture toughness of Al2O3-3YSZ composites monotonically increases with decreasing the content of Al2O3 without any peak values. Al2O3 (0.3 μm)-3YSZ and Al2O3 (1.0 μm)-3YSZ composites sintered at 1,600℃ have a maximum value of a 6.9 MPa·m1/2 and a 6.2 MPa·m1/2, respectively at the composition of containing 20 wt% Al2O3. It should be noticed that the mechanical properties and the sintering density of the Al2O3-3YSZ composites can be enhanced by using more fine Al2O3 powder due to their denser microstructure and smaller grain size.
Transparent color coating films were fabricated on a glass substrate by using sol-gel hybrid binder and organic dye. Sol-gel hybrid binder coating film fabricated with PTMS of 0.03 mole showed a very high pencil hardness of 9 H. As the withdrawal speed increased from 1.0 mm/s to 5.0 mm/sec, The yellowness (b*) of coating glass also gradually increased. The transmittance of yellow color coating glass was 82.6% and the haze of coating glass was 0.35%. Red and blue color coating glasses also showed the high transmittance of 62.4% and 80.6% respectively. The surface hardness of color coating films was 6 H.
Transparent Ag nanowire conducting thin films with high surface hardness were fabricated by bar coating method. When coating speed was changed from 35 mm/sec to 50 mm/sec, the transmittance of coated glass increased from 65.3% to 80.8% in visible light range and the surface resistance was changed from 10.1 Ω/sq to 23.3 Ω/sq. The surface hardness and adhesion of thin film were 5H and 5B.
We investigated the characterizations of carbon films fabricated by dual magnetron sputtering under various RF powers for the improvement of physical properties in carbon fiber (CF). All sputtered carbon films exhibited amorphous structure, regardless of RF powers, resulting in uniform and smooth surfaces. The hardness and elastic modulus are increased with the increase of RF power, and the adhesion and friction properties of carbon films were improved with the increase of RF power. In the results, The increase of RF power in the sputtering method improved tribological properties of the carbon films, and these attributes can be expected to improve the physical properties of the carbon fiber reinforcement plastics.
Composite ceramics of alumina-TZP(3Y) have good mechanical and electrical properties. So, They have been used as high strength refractory materials and thick film substrates, etc. In this study, Composite ceramics of alumina-TZP(3Y) were fabricated by uniaxial pressing and sintering at 1,400, 1,500, and 1,600℃, and their microstructures and mechanical properties were investigated. As the TZP(3Y) content in composite ceramics increases from 20 wt.% to 80 wt.%, the fracture toughness increases monotonically, which seems to be related to the higher relative density and/or toughening mechanism by means of stabilized tetragonal zirconia phase at room temperature. In contrast to the fracture toughness, Vickers hardness of the composite ceramics shows maximum value (1,938 Hv) at a 40 wt.% of TZP(3Y). The result of Vickers hardness is likely to be due to more dense sintered microstructure of composite ceramics than pure alumina and reinforcement of composite ceramics with TZP(3Y), considering that Vickers hardness of pure Al2O3 is greater than that of TZP(3Y). It is also shown that the ZrO2 particles are 1°Cated between Al2O3 grains and suppress grain growth each other.
Glass ceramic has a high mechanical strength and low sintering temperature. So, it can beused as a thick film substrate or a high strength insulator. A series of glass ceramic samples based onMgO-Al2O3-SiO2-ZrO2 (MASZ) were prepared by melting at 1,600℃, roll-quenching and heat treatment atvarious temperatures from 900℃ to 1,400℃. Dependent on the heat treatment temperature used, glassceramics with different crystal phases were obtained. Their nucleation behavior, microstructure andmechanical properties were investigated with differential thermal analysis (DTA), X-ray diffraction (XRD),scanning electron microscopy (SEM), and Vicker`s hardness testing machine. With increasing the heattreatment temperature of MASZ samples, their hardness and toughness initially increase and then reachthe maximum points at 1,300℃, and begin to decrease at above this temperature, which is likely to bedue to the softening of glass ceramics. As the content of ZrO2 in MAS glass ceramics increases from 7.0wt.% to 13 wt.%, Vicker`s hardness and fracture toughness increase from 853 Kg/mm2 to 878 Kg/mm2and 1.6 MPa??m1/2 to 2.4 MPa??m1/2 respectively, which seems to be related with the nucleation of elongatedphases like fiber.
In this research, the structural, physical and electrical characteristics of Ni-Fe core chosen tominimize the errors of the Hall current sensors were investigated and Hall current sensor using Ni-Fecore was fabricated. In the result, the fabricated Ni-Fe sample exhibited the maximum hardness about29.5 GPa and the low friction coefficient about 0.35, and electrical resistivity over 90 mOhm·cm. And alsoHall current sensor using the fabricated Ni-Fe core showed linear current-voltage properties for DCcurrent at 25℃ temperature.
TiC thin films were deposited on Si wafer by unbalanced magnetron sputtering (UBMS) system with two targets of graphite and titanium. During the TiC sputtering, the RF power was varied from 100 W to 175 W and the physical and electrical properties of TiC films were investigated. The hardness and rms surface roughness of TiC films were improved with increasing RF power and the maximum hardness about 24 GPa and the minimum rms surface roughness about 1.2 nm were obtained. The resistivity of TiC films was decreased with increasing RF power. Consequently, the physical and electrical properties of TiC film wewe improved with increasing RF power.
In this paper, we present a novel hydrophilic coating material (Wellture Finetech, Korea) which can be utilized as a coating layer for anti-contamination for electrical and electronic system. The coating material was deposited on 4 inch silicon wafer with several different film thickness. The film thickness was controlled by spin coating speed. After curing of the film, we have scratched by permanent marker to check self-cleaning property of the film. Also we have executed several mechanical tests of the films. As the spin coating speed is increased, the film thickness was thickness was thinned from 230 nm to 125nm. Contact angle of the film lowered from 30° to 12° as the spin coating speed is increased from 700 to 2,500rpm. On permanent marker scratched film surface coated at 1,000 rpm. We have poured regular city water to investigate self cleaning property of the film. The scratches were gradually separated from the film surface due to super-hydrophilicity of the film. Hardness of coated film was 9H measured by ASTM D3363 method. And adhesion of all film was 5B tested by D3359 method. Also, to get exact hardness value of the film, we have utilized a nano-indenter. As spin speed is increased, the hardness of film was increased from 3 Gpa to 5 Gpa.
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