As the operating environment in semiconductor processes becomes demanding, research is being conducted to manufacture dense alumina substrates without defects after sintering to ensure high durability of electrostatic chucks, which are critical components in semiconductor equipment. Therefore, in this study, in order to manufacture green sheets with a high filling ratio for implementing a high-density substrate, alumina powders with average particle sizes of 2.07 μm (L) and 0.37 μm (S) were mixed in ratios of 9:1, 8:2, 7:3, and 6:4, respectively, and green sheets were manufactured and the filling ratio and sintering behavior were observed. Green sheets were fabricated by preparing a slurry using organic materials in Al2O3 powders of different particle sizes. The packing density of the green sheet mixed with L and S alumina powders with different average particle sizes in a ratio of 7:3 before and after binder burn-out showed the highest values of 3.19 g/cm3 and 2.87 g/cm3, respectively. As a result of observing the sintered density based on the mixing ratio of alumina powders revealed that the alumina sheet mixed at a 6:4 ratio of L and S powders, sintered at 1,700℃, exhibited the best sintering characteristics with a density of 3.96 g/cm³.
