The growing demand for miniaturized, lightweight, and sustainable electronic devices has intensified the need for advanced bonding materials. Existing electrically conductive adhesives (ECAs) often rely on high silver (Ag) content, resulting in elevated costs and environmental concerns. This study successfully developed a novel ECA with significantly reduced Ag content without compromising essential electrical conductivity and adhesion performance. Experimental results revealed that the optimized ECA demonstrates electrical conductivity comparable to that of commercial products, with notable advantages in cost reduction and eco-friendliness. These advancements position the developed ECA as a promising solution for next-generation electronic manufacturing, contributing to low-carbon technologies and sustainable practices. Future applications could further broaden its use across diverse electronic systems, driving progress in environmentally conscious technologies.

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.

We investigated the tribological properties of amorphous carbon (a-C) films deposited with CrC interlayers of various thicknesses as the adhesive layer. A-C and CrC thin films were deposited using the unbalanced magnetron (UBM) sputtering method with graphite and chromium as the targets. CrC films as the interlayer were fabricated under a-C films, and various structural, surface, and tribological properties of a-C films deposited with various CrC interlayer thicknesses were investigated. With various CrC interlayer thicknesses under a-C films, the tribological properties of CrC/a-C films were improved; the increased film thickness exhibited a maximum high hardness of over 27.5 GPa, high elastic modulus of over 242 GPa, critical load of 31 N, residual stress of 1.85 GPa, and a smooth surface below 0.09 nm at the condition of 30-nm CrC thickness.

With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and O₂gas. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

Using both EVA and POE encapsulants, we fabricated polycrystalline Si PV modules and performed a set of reliability tests of PID, DH, TC, and Complex prior to outdoor installation. The power output with temperatures and insolation as well as I-V characteristics had been monitored under outdoor environments for 18 months. In the entire period, the total power of 3,576 kWh from POE PV modules was observed larger than 3,449 kWh from EVA PV modules by 3.5%. All the PV modules showed a 5.6~9.2% drop in the conversion efficiency. As for the solar power generation, the PV modules performed through PID, TC test revealed distinct difference in between EVA and POE for which the POE PV module produced more power by +11.4% and +6.6%, respectively, as measured in the 18^th month. In addition, POE was proved to protect better the solar cells under PID influence.

In this study, the effect of vanadium oxide (V₂O₅) content and pre-sintering atmosphere on sealing property of glass frit that consisted of V₂O₅-BaO-ZnO-P₂O₅-TeO₂-CuO-Fe₂O₃ SeO₂ was investigated by XPS (X-ray photoelectron spectroscopy). The content of V₂O₅ was changed to 15, 30, and 45 mol%, and the pre-sintering was carried out in air and N₂ condition, respectively. XPS analysis conducted before and after laser irradiation with identical sample. Before laser treatment, glass frits that were pre-sintered at air condition showed both V₄₊and V₅₊, but the valence state was changed to V₅₊ after laser irradiation when the glass frits contained 30 and 45 mol% V₂O₅; this change led to non-adhesive property. On the other hand, glass frits that were pre-sintered at N₂ condition exhibited only V₄₊ and it showed fine adhesion irrespective of the V₂O₅ content. As a result, the existence of V₄₊ seems to be a major factor for controlling the adhesive property of glass frit for laser sealing.

The Ti adhesion layers were deposited onto the glass substrate for transparent capacitors using Bi2Mg2/3Nb4/3O7 (BMNO) dielectric thin films. Graphene was transferred onto the Ti/glass substrate after growing onto the Ni/SiO2/Si using rapid-thermal pulse CVD (RTPCVD). The BMNO dielectric thin films were investigated for the microstructure, dielectric and leakage properties in the case of capacitors with and without Ti adhesion layers. Leakage current and dielectric properties were strongly dependent on the Ti adhesion layers grown for graphene bottom electrode.