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전자빔 증착법으로 제작한 Cu 박막의 부착력과 저항율 특성

신중홍, 유충희, 백상봉

The Resistivity Properties and Adhesive Strength of Cu Thin Firms Fabricated by EBE Method

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J Electr Electron Mater 2005;18(1):75-80.
Published online: January 1, 2005
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The Resistivity Properties and Adhesive Strength of Cu Thin Firms Fabricated by EBE Method
J Electr Electron Mater. 2005;18(1):75-80.   Published online January 1, 2005
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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The Resistivity Properties and Adhesive Strength of Cu Thin Firms Fabricated by EBE Method
J Electr Electron Mater. 2005;18(1):75-80.   Published online January 1, 2005
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