Among several types of energy saving smart window technologies, the leader, the dynamic EC (electrochromic) window one needs integrated PV (photovoltaics), to minimize expensive electrical wiring as well as to obviate the need for external energy. Self-powered smart windows were reviewed according to PV types used. DSSCs (dye sensitized solar cells) were found to be compatible with EC cells, to have several categories of next generation smart windows such as PECCs (photoelectrochromic cells), PVCCs (photovoltachromic cells), EC polymer PECCs. In addition silicon solar cells and third generation solar cells were investigated. They are summarized in a table showing their advantages and disadvantages respectively for a fast comparison. The strategy to expedite the commercialization of these next generation smart windows includes developing retrofit smart window coverings for use on flexible polymer substrates adhered to the inside surface of a window and easily replaced after use for upto 10 years.

Thermal batteries are heat-activated primary reserve power sources that use inorganic salt as electrolytes and specially designed to meet extremely long or environmentally severe storage requirements. They are primarily used to deliver high power for relatively short periods in such applications as fuzes, missiles, ordnance and other military applications. In this paper, we describe a general overview and research trends on electrode materials for thermal batteries.

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with 10 ㎛ linewidth are fabricated on 180 ㎜ × 180 ㎜ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with 10 ∼ 20 ㎛, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

In this paper, we have studied the effect of mechanical polishing to Ga-polar face for reducing the wafer bowing and strain in free-standing GaN. After the mechanical polishing to Ga-polar face, the bowing of the free-standing GaN substrate significantly decreased with increasing the size of diamond slurry, and eventually changed the bowing direction from concave to convex. Furthermore, the full width at half maximum (FWHM) of high-resolution X-ray diffraction (HR-XRD) were decreased, especially the FWHM of (1 0 2) reflection for 1.0 μm size of diamond slurry was significantly decreased from 630 to 203 arcsec. In the case, we confirmed that the compressive strain in Ga-polar face was fully released by Raman measurement.

It is necessary for ferrite sheets to be fabricated with high packing density for excellent electrical properties and high strength. In this study, the relationship between the warpage and the packing density of ferrite green sheet, was investigated with amount variation of organic additives. With 0.4 wt% of dispersant, the packing density was about 48% and warpage appeared 0.5~1.3 ㎜ high. With 1.4 wt% of dispersant, the packing density increased up to 57% and warpage appeared 0.8~2.1 ㎜ high. With high packing density, warpage appeared along the edges of specimen, while with low packing density, deformation appeared over whole specimen inhomogeneously. It is thought that inhomogeneous deformation after sintering came from the inhomogeneity in green sheet prepared with badly dispersed slurry. With good homogeneity in green sheet from well-dispersed slurry, isotropic shrinkage is thought to have occurred along the distance from center to edges of specimen during sintering.

In this paper, the growing orientation of PMN-PT single crystal is analyzed using the Laue-Back Reflection Method. Two kinds of PMN-PT single crystals are grown using the Bridgman growing method in the [001] and [111] directions and their the Laue photographs are simulated assuming cubic crystal systems. From the comparison between simulation and test results, it can be concluded that the single crystals are grown in the desired crystal orientations.

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed ‘Modified slurry preparation process’ to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

In this study ensuring a filming technology is attempted through dispersion technologies and mixing polymer scaffolds in order to produce films based on the nanowaires obtained from chitin. In addition this study proposes technologies in measuring and improving characteristics of films produced using nanowires and for applying electric conductivity to the films as a chemical and physical manner. Also, a possibility in applications of mass productive films or substrates to producing flexible and transparent films is proposed. In the experiment implemented in this study, it is verified that developments of high strength, high transparency, and high flexibility films can be developed through combining it with producing flexible and transparent films.

This paper describes the development of a piezoelectric level switch, which aims to effectively monitor the level status in high ambient temperatures. In order to adjust the impedance near the resonant frequency and temperature characteristics, the effect of the case and backing layer materials on its performance was analyzed using the finite element method (FEM). The suggested prototype new level switch has three heat-sink plates attached to SUS bar of 230 mm long, and case of PEEK which contains PZT sensing part. To illustrate the validity of this level switch, 10 samples are prepared and investigated the sensing performance through the high and low temperature ambient.

Highly optical transparent photoelectric devices were realized by using a transparent metal-oxide semiconductor heterojunction of p-type NiO and n-type ZnO. A functional template of ITO nanowires (NWs) was applied to this transparent heterojunction device to enlarge the light-reactive surface. The ITO NWs/n-ZnO/p-NiO heterojunction device provided a significant high rectification ratio of 275 with a considerably low reverse saturation current of 0.2 nA. The optical transparency was about 80% for visible wavelengths, however showed an excellent blocking UV light. The nanostructured transparent heterojunction devices were applied for UV photodetectors to show ultra fast photoresponses with a rise time of 8.3 mS and a fall time of 20 ms, respectively. We suggest this transparent and super-performing UV responser can practically applied in transparent electronics and smart window applications.

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

Anti-reflective (AR) thin film was fabricated on a glass substrate by sol-gel method. The coating solution was synthesized with TEOS (tetraethlyorthosilicate) and poly ethylene glycol (PEG, 4.0 wt%). As the withdrawal speed of coating was changed from 0.1 mm/sec to 0.3 mm/sec, the thickness and refractive index of prepared thin films were changed. The reflectance and transmittance of coating glass fabricated by the withdrawal speed of 0.1 mm/sec were 0.62% and 95.0% in visible light range. The refractive index and thickness of single layer thin film were n= 1.29 and ca. 99.0 nm.

Transparent Ag nanowire conducting thin films with high surface hardness were fabricated by bar coating method. When coating speed was changed from 35 mm/sec to 50 mm/sec, the transmittance of coated glass increased from 65.3% to 80.8% in visible light range and the surface resistance was changed from 10.1 Ω/sq to 23.3 Ω/sq. The surface hardness and adhesion of thin film were 5H and 5B.

This paper dealt with the PD (partial discharge) characteristics produced by metallic particles presented in a gas insulated switchgear. Four types of metallic particles such as a ball, a trapezoid, a rectangle, and a twist were fabricated and placed in a PD cell filled with SF6 gas. PD pulses were detected through a 50 Ω non-inductive resistor. Calibration was carried out according to IEC 60270 and the sensitivity was calculated as 4 mV/pC. Apparent charge, pulse count, DIV (discharge inception voltage), DEV (discharge extinction voltage), and TRPD (time resolved partial discharge) were analyzed. Among the metallic particle types, the twist frequently occurred PD pulse at the lowest DIV, while the rectangle showed the highest. DEV of the twist was about 2 times lower than that for the rectangle. Kurtosis of ball clustered at high value, and skewness of other three metallic particles distributed at low value. TRPD showed different distribution by metallic particle types.

In this study, the characteristics of electrostatic attenuation in plain shape glass filament sample (0.29 mm thickness, cross section of 12.25 cm2, 16 cm2, 20.25 cm2) for insulator has been measured at temperature of 5℃∼ 38℃, humidity of 50%∼90%. The results of this study are as follows. In case of samples that the cross section is 12.25 cm2, 16 cm2, 20.25 cm2 at humidity of 50%∼90%, it found that the electrification voltage of electrostatic increased with increasing temperature, with a return to decrease at 20℃. In case of samples that the cross section is 12.25 cm2, 16 cm2, 20.25 cm2 at temperature of 5℃~38℃, it found that the electrification voltage of electrostatic decreased with increasing humidity. In case of the sample at temperature of 20℃ and humidity of 65%, 75%, it found that the electrification voltage of electrostatic increased with increasing cross section. In case of the sample at humidity of 65% and cross section of 12.25 cm2, the time that it takes to reduce electrification voltage of electrostatic in half decreased to 0.912s, 0.736s, 0.673s with increasing temperature to 10℃ 20℃, 30℃.

In this paper, the failure mechanism of PTC heater were examined closely by failure analysis and based on it, accelerated life test were conducted. Finally, life distribution and acceleration model were established. The failure mechanism of PTC heater such as crack, increase of resistance due to heating were identified. Two acceleration factors such as temperature, humidity were chosen with two levels each and accelerated life test were done. Life distribution were identified as Weibull distribution with shape parameter 5.4 and Temperature-Humidity model was fitted as an acceleration model.

The effects of Al-substitution on thermoelectric and charge transport properties of BiCuOSe compounds were investigated. The compounds were prepared by a solid-state reaction and consolidated by SPS (spark plasma sintering). In spite of the increase in the hole concentration with increasing Al amounts in BiCuOSe compound, the electrical conductivity at room temperature was kept constant due to the reduction of mobility. However, electrical conductivities of Al-substituted BiCuOSe compounds at elevated temperature (> 600 K) were higher than those of BiCuOSe, and this result was discussed in terms of it``s the band gap energy. The Seebeck coefficient was drastically reduced when Al was substituted in Bi site, which indicated that the electronic structure was influenced by the Al-substitution into Bi-site.

In this study, we investigate the effect of high-energy ball milling on thermoelectric transport properties in double-filled CoSb3 skutterudite (In0.2Yb0.1Co4Sb12). In0.2Yb0.1Co4Sb12 powders are milled using high-energy ball milling for different periods of time (0, 5, 10, and 20 min), and the milled powders are consolidated into bulk samples by spark plasma sintering. Microstructure analysis shows that the high-energy ball milled bulk samples are composed of nano- and micro-grains. Because the filling fractions are reduced in the bulk samples due to the kinetic energy of the high-energy ball milling, the carrier concentration of the bulk samples decreases with the ball milling time. Furthermore, the mobility of the bulk samples also decreases with the ball milling time due to enhanced grain boundary scattering of electrons. Reduction of electrical conductivity by ball milling has a decisive effect on thermoelectric transport in the bulk samples, power factor decreases with the ball milling time.