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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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반도체 : 임프린트 공정을 이용한 연성동박적층필름(FCCL)의 마이크로 패턴 제작

민철홍, 김태선

Regular Paper : Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process

Chul Hong Min, Tae Seon Kim
J Electr Electron Mater 2015;28(12):771-775.
Published online: December 1, 2015
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In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with 10 ㎛ linewidth are fabricated on 180 ㎜ × 180 ㎜ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with 10 ∼ 20 ㎛, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

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Regular Paper : Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process
J Electr Electron Mater. 2015;28(12):771-775.   Published online December 1, 2015
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Design and Fabrication of Micro Patterns on Flexible Copper Clad Laminate (FCCL) Using Imprinting Process
J Electr Electron Mater. 2015;28(12):771-775.   Published online December 1, 2015
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