Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
Search
Advanced Search
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Articles

Page Path

Chemical Mechanical Polishing ( CMP ) 공정을 이용한 Mutilevel Metal 구조의 광역 평탄화에 관한 연구

김상용, 서용진, 김태형, 이우선, 김창일, 장의구

A Study for Global Planarization of Mutilevel Metal by CMP

Sang Yong Kim, Yong Jin Seo, Tae Hyung Kim, Woo Sun Lee, Chang Il Kim, Eui Goo Chang
J Electr Electron Mater 1998;11(12):1084-1090.
Published online: December 1, 1998
  • 3 Views
  • 0 Download
  • 0 Crossref
  • 0 Scopus
prev next

Full Article

Download PDF Download PDF

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

Include:

A Study for Global Planarization of Mutilevel Metal by CMP
J Electr Electron Mater. 1998;11(12):1084-1090.   Published online December 1, 1998
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
Format:
Include:
A Study for Global Planarization of Mutilevel Metal by CMP
J Electr Electron Mater. 1998;11(12):1084-1090.   Published online December 1, 1998
Close

Related articles

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS

© The Korean Institute of Electrical and Electronic Materials Engineers.