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MOCVD 방법으로 증착된 TaN 와 무전해도금된 Cu 박막 계면의 열적 안정성 연구

이은주, 황응림, 오재응, 김정식

Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless - plated Cu Film

Eun Joo Lee, Eung Rim Hwang, Jae Eung Oh, Jung Sik Kim
J Electr Electron Mater 1998;11(12):1091-1098.
Published online: December 1, 1998
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Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless - plated Cu Film
J Electr Electron Mater. 1998;11(12):1091-1098.   Published online December 1, 1998
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless - plated Cu Film
J Electr Electron Mater. 1998;11(12):1091-1098.   Published online December 1, 1998
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