Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP

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Cu CMP에서 Citric Acid가 재료 제거에 미치는 영향

정원덕, 박범영, 이현섭, 정해도

Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP

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J Electr Electron Mater 2006;19(10):889-893.
Published online: October 1, 2006

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Keywords: Chemical mechanical polishing, Complexing agent, X-ray photoelectron spectroscopy, H/E ratio

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Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP

J Electr Electron Mater. 2006;19(10):889-893. Published online October 1, 2006

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

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Citation for the content below
Citation and abstract for the content below

Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP

J Electr Electron Mater. 2006;19(10):889-893. Published online October 1, 2006

Articles

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Cu CMP에서 Citric Acid가 재료 제거에 미치는 영향

Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP

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