Bonding Property of Silicon Wafer Pairs with Annealing Method

Hong Seok Min; Sang Hyun Lee; Oh Sung Song; Young Chang Joo

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열처리 방법에 따른 실리콘 기판쌍의 접합 특성

민홍석, 이상현, 송오성, 주영창

Bonding Property of Silicon Wafer Pairs with Annealing Method

Hong Seok Min, Sang Hyun Lee, Oh Sung Song, Young Chang Joo

J Electr Electron Mater 2003;16(5):365-371.
Published online: May 1, 2003

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Keywords: Silicon on insulator, SOI, Wafer direct bonding, Fast linear annealing, Furnace annealing

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Bonding Property of Silicon Wafer Pairs with Annealing Method

J Electr Electron Mater. 2003;16(5):365-371. Published online May 1, 2003

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Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Bonding Property of Silicon Wafer Pairs with Annealing Method

J Electr Electron Mater. 2003;16(5):365-371. Published online May 1, 2003

Articles

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열처리 방법에 따른 실리콘 기판쌍의 접합 특성

Bonding Property of Silicon Wafer Pairs with Annealing Method

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