β-Ga₂O₃ is an ultra-wide bandgap semiconductor promising for high-power electronic applications; however, heteroepitaxial growth on sapphire is challenging lattice and symmetry mismatch. In this study, β-Ga₂O₃ thin films were grown on C-plane sapphire substrates with various off-axis angles (0–12°) using mist-CVD, and the influence of substrate miscut on structural and optical properties was investigated. All films grown at 900°C exhibited (-201) oriented β phase. The crystal quality was strongly dependent on the off-axis angle, with intermediate off-axis angles (Δ_a = 6–8°) showing the narrowest rocking curve width. Off-axis substrates promoted step-aligned growth behavior compared to on-axis growth. Optical measurements revealed enhanced transmittance and wider bandgap values (4.92–4.95 eV) for off-axis samples compared to the on-axis film (4.69 eV). The findings provide practical guidelines for optimizing heteroepitaxial β-Ga₂O₃ growth on low-cost sapphire substrates for high-performance device applications.

The safety and stability concerns of liquid electrolytes in conventional lithium-ion batteries have accelerated the development of solid-state alternatives. NASICON type ceramics Li_1.5Al_0.5Ti_1.5(PO₄)₃ (LATP) offer promising properties, including high bulk ionic conductivity and good compatibility with lithium anodes. However, their practical application is hindered by grain boundary resistance and relatively low total ionic conductivity. This study investigates the effect of Ta₂O₅ doping on LATP to overcome these limitations. Doping with 5 wt% Ta₂O₅ improved the ionic conductivity to 2.95 × 10-4 S/cm by enhancing lattice structure, reducing grain boundary resistance, and suppressing the formation of secondary phase. Additionally, Ta₂O₅ positively influenced the sintering behavior, resulting in a denser, and more uniform microstructure. These enhancements suggest that Ta₂O₅-doped LATP is a strong candidate for next-generation all-solid-state lithium-ion batteries.

Bismuth layer-structured ferroelectrics with high Curie temperatures have recently attracted significant attention as promising candidates for high-temperature piezoelectric applications. However, the conventional solid-state reaction method entails high-temperature processing that induces bismuth volatilization, thereby degrading device reliability. In this study, we employed a co-precipitation method enabling atomic-level mixing to significantly lower the synthesis temperature of Nb/Tadoped Bi₄Ti₃O₁₂ ceramics compared to the solid-state reaction method. Experimental results demonstrated that the coprecipitation method yielded a pure single phase at 600℃ without intermediate phases. Furthermore, the synthesized nanopowders, with an average size of 100 nm, lowered the onset temperature of sintering shrinkage to 650℃, approximately 200℃ lower than that of the solid-state counterpart. The low-temperature synthesis process proposed in this work is expected to contribute to the performance enhancement of high-temperature piezoelectric devices by effectively suppressing bismuth volatilization and ensuring compositional stability.

Breakdown strength is an essential parameter for evaluating the electrical performance and degradation behavior of cable insulation and IEC 60243 also emphasizes its importance for detecting changes in insulation characteristics due to aging. However, the current IEC standards are mainly limited to specifying electrode configurations and test voltage conditions for breakdown tests, while the influence of insulating oil, is not clearly addressed. In this study, the breakdown strength of a 66 kV wet-type submarine cable was experimentally evaluated using insulating oils with different kinematic viscosities of 10, 100, 500, and 1,000 cSt in order to achieve reliable and reproducible breakdown measurements. The experimental results show that the measured breakdown strength decreases by up to approximately 20% depending on the oil viscosity. This indicates that the viscosity of the insulating oil has a significant influence on the measured breakdown strength during breakdown test. Therefore, it is necessary to perform breakdown strength measurements under identical test conditions, including the physical properties of the insulating oil, to ensure reliable comparison and accurate assessment of insulation performance and degradation characteristics.

The increasing global demand for renewable energy has accelerated the deployment of offshore wind farms, thereby highlighting the need for advanced development and performance assessment techniques for dynamic submarine cables used in floating offshore wind systems. These cables are continuously subjected to combined thermal, electrical, and mechanical stresses, with mechanical loading playing a particularly dominant role. As a result, dynamic submarine cables exhibit degradation behaviors that differ significantly from those of conventional fixed submarine cables. This paper presents the design and implementation of a comprehensive evaluation system capable of applying combined thermal, electrical, and mechanical stresses to dynamic submarine cables. The system was validated using a 66 kV wet type submarine cable through commissioning tests and insulation performance measurements. Electrical stress of 72 kV, thermal stress exceeding 95°C, and mechanical stress corresponding to a bending radius of 20 times the cable diameter over 20 cycles were applied to verify system reliability. The subsequent insulation assessments quantitatively confirmed performance variations induced by the combined stresses. The results demonstrate that the proposed platform is the first system capable of simultaneously applying thermal, electrical, and mechanical stresses to dynamic submarine cables, and its operational performance has been successfully validated. This platform enables realistic reliability evaluation of dynamic cables used in floating offshore wind farms and is expected to improve the overall operational reliability of offshore wind power systems.

Organic photovoltaics (OPVs) are attractive candidates for sustainable energy conversion due to their flexibility, lowcost processing, and compatibility with large-area fabrication. However, their efficiency is hindered by interfacial defects and vertical phase separation in the active layer, which induce charge imbalance and recombination losses. This work presents an interfacial engineering approach to overcome these limitations in P3HT:PC₇₀BM-based OPVs. Two key strategies were employed: (i) reducing the post-deposition annealing time of the active layer to suppress PC₇₀BM accumulation at the bottom electrode, and (ii) using a DCB:DCM mixed solvent system to regulate solvent evaporation, thereby promoting uniform film formation during PC₇₀BM overlay deposition. Devices fabricated with these optimizations exhibited notable enhancements, achieving short-circuit current density up to 15.83 mA/cm² and a 58.1% increase in power conversion efficiency compared to control devices. X-ray photoelectron spectroscopy confirmed reduced surface aggregation of PC₇₀BM, while X-ray diffraction indicated improved P3HT crystallinity and molecular ordering. These results highlight the critical role of interfacial and morphological control in enhancing charge separation and transport, offering a practical route toward efficient, reproducible, and stable OPVs.

κ-phase Ga₂O₃ is a wide-bandgap semiconductor that has attracted attention for power and optoelectronic device applications. However, its crystal quality and optical properties are highly dependent on the growth temperature, which motivates the need for a systematic study. In this work, κ-Ga₂O₃ thin films were grown on AlN/sapphire templates using mist-CVD at different temperatures. At lower temperatures (400℃), films exhibited incomplete crystallization and partial opacity, whereas higher growth temperatures (500-700℃) produced transparent films with improved properties. The bandgap was found to increase with temperature, consistent with reported values for 600-700℃, and XRD/XRC analysis confirmed that crystal quality improved with higher growth temperature. AFM analysis further revealed reductions in surface roughness and grain size variation at elevated temperatures. These findings indicate that an optimal growth window of 600-700℃ enables high-quality κ-Ga₂O₃ films, with potential implications for integrating this material on other hexagonal substrates such as SiC and GaN.

Citations

• Growth of Beta-Phase Gallium Oxide Thin Films on Off-Axis Sapphire Substrates by Mist Chemical Vapor Deposition
  Jae-Hyeok Lim, Tae-Yong Park, Yun-Ji Shin, Seong-Min Jeong, Chang-Mo Kang, Si-Young Bae
  Journal of Electrical and Electronic Materials.2026; 39(3): 302.     CrossRef

The continuous and long-lasting monitoring of physiological signals induced from the human body is crucial for health monitoring, disease diagnosis, and treatment. In this study, we have reported the Seebeck effect-based flexible selfpowered temperature sensor which can convert the electric signals from lateral temperature difference. For demonstrating temperature sensor arrays, the p-type thermoelectric (TE) composite films were fabricated by dispersing the Bi_0.5Sb_1.5Te₃ (BST) powders inside poly-vinylidene fluoride matrix and subsequently attached to the patterned electrode foils. The inorganic BST powders-embedded TE composite films with activated area of 0.5 × 1 cm² harvest a maximum voltage of 1.7 mV, a maximum current of 5.6 mA, and an output power of 2.6 nW from the temperature gradient (ΔT) of 20 K. Finally, the fabricated selfpowered temperature sensor array well detected the pattern images of external thermal source of ΔT = 20 K. This study manifests flexible temperature sensor array which paves the way for further advancements in this field.

Aggressive device scaling has severely degraded the switching characteristics of CMOS transistors. This issue has led to the development of tunneling FETs (TFETs) as an alternative. TFETs, with their asymmetric doping of the source and drain regions, offer improved subthreshold swing (SS) compared to conventional MOSFETs. However, despite this advantage, TFETs still suffer from ambipolar current, which increases off-state current (IOFF). This paper introduces an approach to applying hetero gate dielectrics (HGDs) in nanosheet (NS) TFETs to reduce ambipolar current characteristics. The magnitude of the drain electric field is reduced by selectively forming a high-k dielectric near the source region This configuration allows the TFETs to avoid unintended band-to-band tunneling (BTBT) and suppress ambipolar current during the off-state.

This paper presented an analytical SS model to determine the subthreshold swing (SS) of an elliptic junctionless Gate- All-Around (GAA) FET using ferroelectric. Analyzing a GAA FET with an elliptic cross-section was essential because it is difficult to manufacture a perfectly circular GAA FET. The results of the proposed SS model agreed well with 2D numerical simulation. Using this analytical SS model, SS was analyzed for the eccentricity and the ratio (P_r/E_c) of permanent polarization P_r and coercive electric field E_c in an elliptic junctionless GAA FET with an MFMIS (Metal-Ferroelectric-Metal-Isulator- Semiconductor) structure using ferroelectric. As a result, the changing rate of the average surface potential due to the gate voltage increased and SS decreased as the eccentricity increased. It was found that the inner gate voltage amplified more than the outer gate voltage due to the ferroelectricity, better controlling the carriers in the channel, thereby reducing SS. As the P_r/E_c decreased, the changing rate of the ferroelectric charge for the outer gate voltage increased and SS decreased. As the eccentricity increased, the changing rate of SS for P_r/E_c decreased. There was no significant change in SS until the eccentricity was about 0.5. The SS began to decline above 0.5 due to the changes in ferroelectric charge, inner gate voltage, and average surface potential for the outer gate voltage.

Piezoelectric materials, which convert mechanical energy into electrical signals, are widely used in various industrial applications such as sensors, actuators, and energy harvesting devices. This study aims to enhance the performance of Pb(Mg_1/3Nb_2/3)O₃-Pb(Al_1/2Nb_1/2)O₃-Pb(Zr_0.52Ti_0.48)O₃ (PMN-PAN-PZT) piezoelectric ceramics by investigating the effects of varying PAN and PMN content and adding Nb₂O₅ on their piezoelectric properties. The results show that with 2 mol% of PMN and PAN, the morphotropic phase boundary (MPB) region exhibits the highest piezoelectric properties. Additionally, excess Nb₂O₅ positively influenced the piezoelectric properties, maximizing electro-mechanical coupling factor (k_p=63%, d₃₃=440 pC/N). These findings contribute to developing next-generation high-performance piezoelectric materials, with potential for improved efficiency and performance in various industries.

This review addresses the development trends of dielectric ceramics, the key material for Multilayer Ceramic Capacitors (MLCCs), which are essential components in high-performance electronic devices. Traditional MLCCs have employed BaTiO₃ (BT)-based dielectrics to achieve high dielectric constant and low resistance. By minimizing oxygen vacancies and suppressing grain growth in BT materials, the temperature and voltage stability of MLCCs have been improved, leading to the development of MLCCs with diverse properties. However, the maximum dielectric constant of approximately 3000 in BT materials poses a limitation in overcoming the trade-off between rated voltage and capacitance density. Therefore, ultra-high permittivity dielectric materials have gained attention to meet the requirements of ultra-high-performance MLCCs, and ongoing research focuses on enhancing the temperature and frequency stability of these materials. This review analyzes the characteristics and limitations of conventional BT materials and explores recent research trends and future potential in developing new MLCCs based on ultra-high dielectric constant materials.

In this study, the effect of thickness on the Sn-doped β-Ga₂O₃ thin films was investigated. β-Ga₂O₃ is a next-generation material for power semiconductors and optoelectronics owing to its remarkable properties, such as an ultra-wide bandgap, excellent thermal and chemical stability, and large breakdown voltage. However, its inherently low conductivity can be limiting in applications that require high conductivity; therefore, improving the conductivity of β-Ga₂O₃ is important. In this study, Sn-doped β-Ga₂O₃ thin films with various thicknesses were deposited on β-Ga₂O₃ substrates. All the fabricated samples exhibited β-phase with a uniform and dense surface and transmittance of above 80% in the visible region. In particular, the 100 nm samples showed the highest carrier concentration and mobility and the lowest resistivity. Thus, these findings are expected to play an important role in improving the performance of devices by controlling the thickness of thin films.

Citations

• Growth of Beta-Phase Gallium Oxide Thin Films on Off-Axis Sapphire Substrates by Mist Chemical Vapor Deposition
  Jae-Hyeok Lim, Tae-Yong Park, Yun-Ji Shin, Seong-Min Jeong, Chang-Mo Kang, Si-Young Bae
  Journal of Electrical and Electronic Materials.2026; 39(3): 302.     CrossRef

Cu₂O metal oxide was synthesized using NaBH₄ as a reducing agent in this study. The transformation of Cu composite with the pH adjustment was investigated, and the conditions for Cu₂O synthesis were analyzed. As pH of the solution was changed, the synthesized Cu composite evolved into Cu/Cu₂O and Cu/Cu₂O/CuO composites. The Cu₂O composite synthesized under conditions closest to pure Cu₂O was heat-treated at 200℃. The remaining minor Cu metal was oxidized, resulting in pure Cu₂O particles with enhanced crystallinity. The synthesized Cu₂O exhibited various morphology with particle sizes of about 160~720 nm, and the shape and size of the Cu₂O particles remained significantly unchanged after heat treatment. Surface analysis was conducted to compare the changes before and after heat treatment. No significant changes were observed, except for those attributed to water evaporation. The Cu₂O synthesized via this simple chemical reduction method can be utilized in various application fields, including catalysts, optical devices, and sensors.

This study investigates the effects of chemical etching for anti-glare (AG) treatment and the subsequent deposition of a TiZrO₂/SiO₂ double-layer anti-reflection (AR) coating on glass surfaces. The AG treatment was performed using ammonium fluoride in gel form via screen printing, followed by electron beam deposition of SiO₂/TiZrO₂ layers. The surface roughness, optical transmittance, and refractive index were analyzed. The results revealed that while the surface roughness increased with larger screen patterns during the AG treatment, it was reduced by the deposition of the AR layers. Additionally, the gloss caused by external light was higher with lower surface roughness, but it was effectively reduced by the AR coating. The optical reflectance showed minimal changes during the AG treatment, remaining similar to that of bare glass substrates. However, the AR coating significantly decreased reflectance. The combination of AG treatment and AR coating improved optical transmittance and reduced gloss, making this method beneficial for enhancing visibility in automotive displays. The findings suggest that this approach can mitigate the impact of external light and improve the clarity of displayed information, making it suitable for automotive display applications.

4H-Silicon carbide (4H-SiC) is a promising material for power and harsh environment devices owing to its superior material properties, including wide bandgap, high critical electric field, and high thermal conductivity. However, despite the advantages of 4H-SiC, its channel mobility is reduced due to the high interface defect density between SiC and the oxide film, leading to increased device switching loss. Therefore, it is necessary to develop new fabrication methods to improve the quality of the SiO₂/4H-SiC interface. According to recent research, the effect of high-temperature (1,250~1,300℃) nitric oxide (NO) annealing on the interface states of SiO₂/4H-SiC and the channel mobility of 4H-SiC metal-oxide-semiconductor-field-effect transistors (MOSFETs) were investigated. Previous studies have optimized the NO post-oxidation annealing (POA) process, using N₂ diluted NO at 1,300℃ to reduce the high SiO₂/4H-SiC interface trap density (D_it). This paper focuses on high-temperature (1,250℃) 10% NO annealing to reduce interface defects by integrating nitrogen atoms into the oxide layer near the SiC interface, potentially increasing the channel mobility. Electrical properties such as D_it, threshold voltage (V_th), field-effect mobility (μ_FE), and specific on-resistance (R_on,sp) were assessed through capacitance-voltage (C-V) and current-voltage (I-V) measurements. It has been confirmed that the interface defect density of the gate oxide film was effectively improved under the POA conditions of 10% NO for 1 hour at 1,250℃.

Memristors, as next-generation memory devices, have garnered significant academic interest. Among them, TiO₂/TiO_2-x based memristors have particularly attracted substantial scholarly attention. Research on the activation and stability of TiO2 based memristor devices through process parameters is essential. Here, to determine the impact of process parameters on the activation of TiO₂/TiO_2-x based memristor devices, we fabricated the memristor devices using a sputtering system andconducted annealing at 400℃. Additionally, to analyze the electrical characteristics of the devices, we measured the I-V curves and C-V curves. Also, we examined TiO₂/TiO_2-x based memristor devices surface using SEM. Consequently, it was observed that the devices subjected to annealing exhibited improved hysteresis curves in the I-V characteristics, a reduced bandgap, and changes in resistance compared to the non-annealed devices. The retention test results further demonstrated that the set/reset characteristics of the devices were stable, confirming their potential applicability as memory devices.

Citations

• Pulse Response Measurement Optimization of ReRAM-Based Neuromorphic Devices
  Soon Joo Yoon, Yoon Kyeung Lee
  Journal of Electrical and Electronic Materials.2026; 39(3): 258.     CrossRef

The possibility of a dye-sensitized solar cell (DSSC) submodule was evaluated as an independent power source that can drive a smart liquid crystal window (SLW) that selectively blocks sunlight when electricity is applied. In order to save energy and increase the functionality of buildings, SLW operation was supplied directly from DSSC submodule, rather than connecting to the existing power system and external power sources. It was confirmed that the SLW can control light transmittance through self-generation using the DSSC submodule composed of 6 cells at low light of 2,500 lux. These results imply that there is a high possibility of combining smart windows and DSSCs suitable for window-type building-integrated photovoltaic (BIPV) systems. DSSCs, which can self-generate power in low light, are expected to increase their usability in urban BIPV systems through combination with smart window technology.

In this study, we fabricated single grain YBCO bulk superconductors with control of the distance between the seed and the upper surface of the YBCO compacts. The magnetic levitation force of the YBa₂Cu₃O₇ superconducting bulk, which corresponds to the energy amount of the superconducting bulk, was measured to be 32.634 N at the center of the bulk where the seed was placed. Under field cooling conditions, a capture magnetic force of 2.17 kG was observed at the center of the bulk. The trapped magnetic force curve corresponding to the stability of the superconducting bulk means that the superconducting specimens were well grown in the form of single grains.

In this study, KTN heterolayer thin films were fabricated by alternately stacking films of K(Ta_0.70Nb_0.30)O₃ and K(Ta_0.55Nb_0.45)O₃ synthesized using the sol-gel method. The sintering temperature and time were 750℃ and 1 hour, respectively. All specimens exhibited a polycrystalline pseudo-cubic crystal structure, with a lattice constant of approximately 0.398 nm. The average grain size was around 130~150 nm, indicating relatively uniform sizes regardless of the number of coatings. The average thickness of a single-coated film was approximately 70 nm. The phase transition temperature of the KTN heterolayer films was found to be approximately 8~12℃. Moreover, the 6-coated KTN heterolayer film displayed an excellent dielectric constant of about 11,000. As the number of coatings increased, and consequently the film thickness, the remanent polarization increased, while the coercive field decreased. The 6-coated KTN heterolayer film exhibited a remanent polarization and coercive field of 11.4 μC/cm² and 69.3 kV/cm at room temperature, respectively. ΔT showed the highest value at a temperature slightly above the Curie temperature, and for the 6-coated KTN heterolayer film, the ΔT and ΔT/ΔE were approximately 1.93 K and 0.128×10^-6 K·m/V around 40℃, respectively.

(La0.7Sr0.3)(Mn1-xFex)O3 (LSMFO) (x = 0.03, 0.06, 0.09, 0.12) precursor solution are prepared by sol-gel method. LSMFO thin films are fabricated by the spin-coating method on Pt/Ti/SiO2/Si substrate, and the sintering temperature and time are 800℃ and 1 hr, respectively. The average thickness of the 6-times coated LSMFO films is about 181 to 190 nm and average grain size is about 18 to 20 nm. As the amount of Fe added in the LSMFO thin film increased, the resistivity decreased, and the TCR and B25/65-value increased. Electrical resistivity, TCR and B25/65-value of the (La0.7Sr0.3)(Mn0.88Fe0.12)O3 thin film are 0.0136 mΩ-cm, 0.358%/℃, and 328 K at room temperature, respectively. The resistivity properties of LSMFO thin films matched well with Mott’s VRH model.

This reports the electrical properties of single-crystal β-gallium oxide (β-Ga₂O₃) vertical Schottky barrier diodes (SBDs) with a different guard ring structure. The vertical Schottky barrier diodes (V-SBDs) were fabricated with two types guard ring structures, one is with metal deposited on the Al₂O₃ passivation layer (film guard ring: FGR) and the other is with vias formed in the Al₂O₃ passivation layer to allow the metal to contact the Ga₂O₃ surface (metal guard ring: MGR). The forward current values of FGR and MGR V-SBD are 955 mA and 666 mA at 9 V, respectively, and the specific on-resistance (Ron,sp) is 5.9 mΩ·cm² and 29 mΩ·cm². The series resistance (Rs) in the nonlinear section extracted using Cheung’s formula was 6 Ω, 4.8 Ω for FGR V-SBD, 10.7 Ω, 6.7 Ω for MGR V-SBD, respectively, and the breakdown voltage was 528 V for FGR V-SBD and 358 V for MGR V-SBD. Degradation of electrical characteristics of the MGR V-SBD can be attributed to the increased reverse leakage current caused by the guard ring structure, and it is expected that the electrical performance can be improved by preventing premature leakage current when an appropriate reverse voltage is applied to the guard ring area. On the other hand, FGR V-SBD shows overall better electrical properties than MGR V-SBD because Al₂O₃ was widely deposited on the Ga₂O₃ surface, which prevent leakage current on the Ga₂O₃ surface.

This study examines a manufacturing process for the photoelectrode material of dye-sensitized solar cell (DSSC) intending to increase efficiency through the surface plasmon resonance phenomenon of nanoparticles with a composite structure made of Ag and TiO₂. This invention involves the use of Ag and TiO₂ nanoparticles in the solar cell. These nanoparticles cause surface plasmon resonance, which amplifies and scatters incident solar energy, enhancing the dye’s rate of light absorption. It also makes it possible to absorb energy in wavelength ranges that were previously difficult to do, which increases efficiency. Centrifugal separation and heat synthesis are used to create the composite metal structures, and certain combinations are used to decide the particle morphologies. To increase the efficiency of organic solar cells and DSSC, the Ag/TiO₂ composite structure is therefore quite likely to be used.

This paper introduces an optimized oxygen (O₂) plasma surface treatment technique to enhance sphere lithography on hydrophobic photoresist surfaces. The focus is on semiconductor manufacturing, particularly the creation of finer structures beyond the capabilities of traditional photolithography. The key breakthrough is a method that makes substrate surfaces hydrophilic without altering photoresist patterns. This is achieved by meticulously controlling the O₂ plasma treatment duration. The result is the consistent formation of nano and microscale patterns across large areas. From an academic perspective, the study deepens our understanding of surface treatments in pattern formation. Industrially, it heralds significant progress in semiconductor and precision manufacturing sectors, promising enhanced capabilities and efficiency.

In this study, the praseodymium-doped yttrium phosphate (YPO₄:Pr³⁺) powder, which is well known for its high luminescent efficiency, and long life in the UV range, was synthesized with various content ratios of Pr₆O₁₁ and calcination temperature. Crystal structure and luminescent properties of various phosphor powders based on different concentrations and calcination conditions were characterized by XRD (X-Ray Diffraction) and PL (photoluminescence) spectrometers. From the XRD analysis, the structure of YPO₄:Pr³⁺ which is calcinated at 1,200℃ was stable tetragonal phase and crystal size was calculated about 25 nm by Scherrer equation. PL emission of YPO4:Pr3+ with a different content ratio of Pr6O11 by excitation λexc=250 nm shows that 0.75 mol% phosphor powder has maximum PL intensity and PL decreases with the increase of the ratio of Pr₆O₁₁ up to 1.25 mol% which is caused by changes of crystallinity of phosphor powders. With increasing dopant ratio, photoluminescence Emission decreases due to Concentration quenching, which is commonly observed in phosphors. Currently, 0.75 mol% is considered the optimal doping concentration. A hybrid ultraviolet-emitting device incorporating YPO4:Pr3+ fluorescent material with plasma discharge was fabricated to enhance UV germicidal effects while minimizing ozone generation. UV emission from the plasma discharge device was shown at about 200 nm and 350 nm which caused additional emission of the regions of 250 nm, 315 nm, and 370 nm from the YPO₄:Pr³⁺ phosphor.

In this study, we successfully synthesized copper oxide (Cu₂O) particles through a hydrothermal method at a relatively low temperature (150℃). The synthesis involved the precise control of molar concentrations of NaOH. Notably, Cu₂O particles were effectively synthesized when NaOH concentrations of 0.15 M and 0.20 M were utilized. While attempts were made at different molar concentrations, the synthesis of pure Cu₂O particles was only achieved at concentrations of 0.15 M and 0.20 M. In this experimental investigation, Cu₂O synthesized under these specific conditions exhibited absorption characteristics within the wavelength range of 640 to 570 nm, consistently exhibiting a band gap energy of 1.9 eV. These Cu₂O particles, characterized by their small band gap energy and straightforward synthetic method, hold significant promise for various applications including semiconductors and solar cells.

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p- Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (R_on,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (D_it) at the SiO₂/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO₂/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N₂ diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N₂ gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO₂/4H-SiC interface, thereby reducing the Dit.

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In52Agx (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn⁴⁸In⁵² (wt%) solder was 53.6 N/mm², and that of the Sn⁴⁸In⁵²Ag1 (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In⁵² (wt%) solder was 119.2℃, and that of the Sn48In52Ag1 (wt%) solder decreased to 114.0℃.

The Ga₂O₃ thin films were deposited using an RF sputtering system and the effect of crystallographic and optical properties under rapid thermal annealing conditions on Ga₂O₃ thin film was evaluated. A rapid thermal annealing method can fabricate a crystalline Ga₂O₃ thin film which is applied to various fields with a low cost and a high efficiency compared with the conventional post-annealing method. In this study, the Ga₂O₃ treated at 900℃ for 1 min showed the beta and gamma phases in XRD measurement. In optical properties, the crystalline Ga₂O₃ represented a high transmittance of more than 80% in the visible region and was calculated with a high optical bandgap energy of 4.58 eV. The beta and gamma phases Ga₂O₃ can be obtained by adjusting the rapid thermal annealing temperatures, and the various properties such as the optical bandgap energy can be controlled. Moreover, it is expected that crystalline Ga₂O₃ can be applied to various devices by controlling not only temperature but process time.