One of the important issues for fabricating the microelectronic display devices such as FED, PDP, and VFD is to obtain a high vacuum level inside the panel. In addition, sustaining the initial high vacuum level permanently is also very important. In the conventional packing technology using a tabulation method, it is not possible to obtain a satisfiable vacuum level for a proper operation. In case of FED, the poor vacuum level results in the increase of operating voltage for electron emission from field emitter tips and an arcing problem, resultantly shortening a life time. Furthermore, the reduction of a sealing process time in the PDP production is veryimportant in respect of commercial product. The most probable method for obtaining the initial high vacuum level inside the space with such a miniature and complex geometry is a vacuum in-line sealing which seals two glass plates within a high vacuum chamber. The critical solution for the vacuum sealing is to develop a frit glass to avoid the bubbling or crack problems during the sealing process at high temperature of about 400℃ under the vacuum environment. In this study, the suitable frit power was developed using a mixture of vitreous and crystalline type frit powders, and a vacuum sealed CNT FED with 2 inch diagonal size was fabricated and successfully operated.

As the temperature of the panel increases in AC-PDPs, the minimum driving voltage increases. Also, as the more the number of discharge increases in cells, the probability of the strong dark discharge in the reset period increases. In this study, we investigated the relationship between the lag time of the discharge and the mechanism of mis-discharges which are the black noise and bright noise. We conclude that the variation of time lag characterizes the properties of exo-electron emission from MgO. Thus, we found that the main factor of the mis-discharges is the rate of change of the electron emission ability from the MgO surface.

The effect of address discharge characteristics by selective reset method is investigated to prevent the weakness of address discharge in the middle of a TV-field without increase of the black luminance. To reduce black luminance in AC PDP usually, the first subfield during one TV frame adopted the conventional rising ramp-reset waveform, whereas the other subfields adopted the subsidiary reset waveform without rising ramp type. As the wall charge for the address discharge was accumulated by only the rising ramp waveform during the first reset period, the wall charge on three electrodes was disappeared as time passed and the address discharge would be weakened in the rear subfields. To prevent a reduction of the address discharge characteristics without decrease the black luminance, the modified rising ramp reset waveform was adopted only in the sixth subfield. As a result, a modified driving method could improve the address discharge characteristics compared with selective reset driving scheme with almost the same black luminance.

The address discharge characteristics of a open dielectric structure compared with the conventional panel structure are investigated by measuring the discharge firing voltage. The open dielectric structure could easily produce the discharge between the scan and the sustain electrodes by erasing the dielectric layer between two electrodes. Due to the changes in the discharge firing characteristics of the open dielectric structure between the two sustain electrodes, the conventional reset waveform including the address waveform needs to be modified. The modified driving waveform suitable for the open dielectric structure is proposed and examined in AC PDP.

The TiO2/Si3N4/Ag/Si3N4/TiO2 multi layered structure was designed for the possible application of transparent electrodes in PDP (Plasma Display Panel). Multi layered film was deposited on a glass substrate at room temperature by DC/RF magnetron sputtering system and EMP (Essential Macleod Program) was adopted to optimize the optical characteristics of film. During the deposition process, the Ag layer in TiO2/Ag/TiO2 became heavily oxidized and the filter characteristic was degraded easily. In thus study, Si3N4 layer was used as a diffusion buffer layer between TiO2 and Ag. in order to prevent the oxidation of Ag layer in TiO2/Si3N4/Ag/Si3N4/TiO2 structure. It was confirmed that Si3N4 layer is one of candidate materials acting as diffusin barrier between TiO2/Ag/TiO2.

The TiO2/ZnS/Ag/ZnS/TiO2 multilayered structure for the transparent electrodes in plasma display panel was designed by essential macleod program (EMP) and the multilayered film was deposited on a glass substrate by direct-current (DC)/radio-frequency (RF) magnetron sputtering system. During film deposition process, the Ag layer in TiO2/Ag/TiO2 structure became oxidized and the filter characteristic was degraded easily. In this study, ZnS layer was adopted as a diffusion blocking layer between TiO2 and Ag to prevent the oxidation of Ag layer efficiently in TiO2/ZnS/Ag/ZnS/TiO2 structure. Based on the AES depth profiling analysis, the Ag layer was effectively protected by the ZnS layer as compared with the TiO2/Ag/TiO2 multilayered films without ZnS as an antioxidant layer. The 3 times stacked TiO2/ZnS/Ag/ZnS/TiO2 films have low sheet resistance of 1.22 Ω/□ and luminous transmittance was as high as 62% in the visible ranges.