Metamaterials, as artificially engineered structures with unconventional mechanical and acoustic properties, have recently emerged as a transformative platform for enhancing the capabilities of triboelectric nanogenerator (TENG) systems. Since the invention of TENG devices, extensive efforts have been devoted to improving charge density, output stability, and overall performance. Conventional performance optimization strategies mainly rely on device-level improvements such as surface chemistry modification, microstructuring, and nanopatterning. However, limited emphasis has been given to system-level development of smart self-powered intelligent systems. The integration of metamaterials into TENG devices opens a new era by enabling frequency-selective localization, mechanical impedance matching, and controllable deformation pathways. These engineered mechanical structures not only improve energy harvesting efficiency but also introduce new functionalities into the system. This review systematically summarizes recent advances in metamaterial-integrated TENG systems across four major application domains: (i) energy harvesting, (ii) acoustic telecommunication and acoustic-to-electric conversion, (iii) self-powered sensing, and (iv) vibration suppression and monitoring. Overall, the integration of metamaterials into TENG systems will pave the way for next-generation sustainable, intelligent, self-powered devices with diverse functionalities.
Cellulose nanofiber (CNF) has attracted significant attention as a next-generation insulating material due to its ecofriendly nature and outstanding functionalities. However, conventional kraft insulation paper suffers from limited dielectric breakdown strength and long-term reliability under high-voltage conditions, highlighting the need for alternative materials. In this study, kraft pulp was combined with five types of CNFs (A, B, C: wood-based / D, E: non-wood-based) to fabricate composite insulation papers, and their electrical and mechanical properties were systematically evaluated. The results showed that CNF incorporation generally enhanced density and tensile strength, while certain types contributed to lowering dielectric constant and improving breakdown strength. Among the wood-based CNFs, type C exhibited the most balanced performance in terms of dielectric stability and mechanical reinforcement. Among the non-wood-based CNFs, type E demonstrated notable improvements in structural compactness and tensile strength, suggesting favorable reliability. Therefore, this study identifies CNF C among wood-based types and CNF E among non-wood-based types as the most promising candidates for insulation performance enhancement, suggesting their applicability as next-generation insulating materials for power equipment and ecofriendly electronic devices.
Abstract In this study, to develop composition ceramics for energy harvesting devices, Pb(Ni1/3Nb2/3)O₃-Pb(Zr Ti)O₃ system ceramics substituted with Pb(Mg1/2W1/2)O₃ were manufactured by conventional mixed oxide method using Li₂CO₃ and Na₂CO₃ (LNCO) as sintering aids. Their microstructure and piezoelectric properties were also investigated. At the specimen sintered at 930℃, high values of piezoelectric properties appeared: the dielectric constant (εr) of 2,522 planar electromechanical coupling factor kp of 0.602, and k31 of 0.385, d31 = 229 [pC/N], g31 = 10.13 [mV.m/N], Qm of 70, respectively. These values were suitable for the application of devices such as energy harvesting devices and ultrasonic devices.
This study investigates the insulation performance of a 66 kV dry-type submarine cable used in offshore wind farms under mechanical aging. During installation and operation, submarine cables are subjected to various mechanical stresses, including tension, compression, and bending, which can lead to insulation deterioration. In this study, XLPE samples extracted from a submarine cable were prepared and subjected to controlled tensile strain below the yield strain to evaluate their mechanical and electrical performance. Changes in tensile strength, elongation, and tan δ (dielectric loss factor) were measured to assess the extent of aging. The results indicate that as the applied strain and exposure duration increased, tensile strength and elongation decreased, while tan δ values increased, signifying a decline in electrical insulation performance. A strong negative correlation (R = -0.809) was observed between tan δ and tensile strength, demonstrating that mechanical aging significantly affects electrical properties. These findings highlight the importance of minimizing excessive mechanical stress during the installation and operation of submarine cables. The results provide valuable insights for enhancing the reliability of submarine cables in offshore wind farms and emphasize the necessity of optimized design and maintenance strategies to mitigate the effects of mechanical aging.
The increasing demand for renewable energy is driving the rapid expansion of the offshore wind industry, leading to intensified research on subsea cables. These cables endure combined thermal, electrical, and mechanical stresses, with mechanical stress being a critical failure factor. Environmental changes, such as seabed scouring, free spans, and seismic activity, accelerate cable degradation by introducing additional dynamic loads. Conventional monitoring systems primarily track thermal stress, lacking the ability to assess mechanical impacts. This study develops a system to simultaneously measure thermal and mechanical stress in subsea cables. Laboratory experiments confirm the system’s reliability, showing a temperature measurement error within 0.8% at 60℃ and a strain measurement error within 13% at 378 με. The proposed system aims to enhance failure prediction and maintenance strategies for offshore wind subsea cables.
In this study, Pb(Ni1/3Nb2/3)O3-Pb(Zr,Ti)O3 ceramics substituted with Pb(Mg1/2W1/2)O3 were fabricated with the variation of CuO for application to ultrasonic cleaning of removable orthodontic appliances (ROA). And their piezoelectric and dielectric properties were investigated. At the 0.12 wt% CuO added ceramics sintered at 930℃, the excellent values of dielectric constant=2,519, density=7.82 g/㎤, kp=0.64, d33=536 pC/N, Qm=57 were obtained, respectively. These values were suitable for application to ultrasonic cleaning of ROA.
As complementary metal-oxide semiconductor (CMOS) is scaled down to achieve higher chip density, thin-film layers have been deposited iteratively. The poor film uniformity resulting from deposition or chemical mechanical planarization (CMP) significantly affects chip yield. Therefore, the development of novel fabrication processes to enhance film uniformity is required. In this context, high-pressure deuterium annealing (HPDA) is proposed to reduce the surface roughness resulting from the CMP. The HPDA is carried out in a diluted deuterium atmosphere to achieve cost-effectiveness while maintaining high pressure. To confirm the effectiveness of HPDA, time-of-flight secondary-ion mass spectrometry (ToF-SIMS) and atomic force microscopy (AFM) are employed. It is confirmed that the absorbed deuterium gas facilitates the diffusion of silicon atoms, thereby reducing surface roughness.
Multilayered actuators using Pb(Mg1/3Nb2/3)O3-Pb(In1/2Nb1/2)O3-PbTiO3 (PMN-PIN-PT) crystals have demonstrated excellent properties, but are costly and lack mechanical strength. Textured PMN-PIN-PT ceramics exhibit robust mechanical strength and comparable properties to their single crystals form. However, the development of multilayered actuators using textured PMN-PIN-PT ceramics has not been achieved until now. This study presents the development of a multilayered actuator using textured 0.37PMN-0.29PIN-0.34PT ceramics with an Ag0.9/Pd0.1 inner electrode, co-fired at 950℃. A random 0.37PMN- 0.29PIN-0.34PT ceramics multilayered actuator was also developed for comparison. The multilayered actuator consisted of 9 ceramic layers (36 μm thickness) with an overall actuator thickness of 0.401 mm. The textured and random 0.37PMN-0.29PIN- 0.34PT ceramics-based multilayered actuators achieved displacements of 0.61 μm (0.15% strain) and 0.23 μm (0.057% strain) at a low applied peak voltage of 100 V. These results suggest that the developed multilayered actuator using high-performance textured 0.37PMN-0.29PIN-0.34PT ceramics has the potential to replace expensive single crystal-based actuators costeffectively.
In this paper, for the application of ultrasonic cleaners for cleaning dentures and transparent braces, Pb(Mn1/3Nb2/3)O3-Pb(Ni1/3 Nb2/3)O3-Pb(Zr,Ti)O3 [PMN-PNN-PZT] system ceramics were manufactured and their dielectric and piezoelectric properties were investigated. Overall the best properties suitable for the device applications such as ultrasonic cleaner were obtained from the ceramics sintered at 920℃: bulk density of 7.8 g/㎤, the dielectric constant (εr) of 1,689, piezoelectric charge constant (d33) of 433 pC/N, planar electromechanical coupling factor (kp) of 0.64, mechanical quality factor (Qm) of 835, S11E of 13.37 (10-12 N/㎡), and Curie temperature of 315℃ By using the physical properties of this composition, the ultrasonic cleaner was designed and simulated using the commercial ATILA software. For the three-layered ceramics with the dimension of 25 mm × 25 mm × 2.5mm, an excellent displacement of 8.998 ×10-3 m) and the sound pressure of 147.68 dB were recorded.
Localized heat can be generated using electrically conductive word-lines built into a 3D NAND flash memory string. The heat anneals the gate dielectric layer and improves the endurance and retention characteristics of memory cells. However, even though the electro-thermal annealing can improve the memory operation, studies to investigate material failures resulting from electro-thermal stress have not been reported yet. In this context, this paper investigated how applying electro-thermal annealing of 3D NAND affected mechanical stability. Hot-spots, which are expected to be mechanically damaged during the electro-thermal annealing, can be determined based on understanding material characteristics such as thermal expansion, thermal conductivity, and electrical conductivity. Finally, several guidelines for improving mechanical stability are provided in terms of bias configuration as well as alternative materials.
Global warming is accelerating due to the use of fossil fuels that have been used continuously for centuries. Now, humankind recognizes its seriousness, and is conducting research on searching for eco-friendly and sustainable energy. In the field of solar energy, which is a kind of eco-friendly and sustainable, many studies are being conducted to enhance the output performance of the module. In this study, the output improvement for the shingled module structure was studied. In order to improve the output performance of the module, the thickness of the encapsulant was increased, and the lamination process conditions have been improved accordingly. After that, the crosslinking rate was analyzed, and the suitability of the lamination process conditions was judged using this. In addition, a peeling test was conducted to analyze the correlation between the adhesion of the encapsulant and the output performance of the module. Finally, the optimization for the encapsulant material and the lamination process conditions for high-power shingled modules was established, and accordingly, the market share of high-power shingled modules in the solar module market can be expected to rise.
Reliability of CMOS has been severed under aggressive device scaling. Conventional technologies such as lightly doped drain (LDD) and forming gas annealing (FGA) have been applied for better device reliability, but further advances are modest. Alternatively, electro-thermal annealing (ETA) which utilizes Joule heat produced by electrodes in a MOSFET, has been newly introduced for gate dielectric curing. However, concerns about mechanical stability during the electro-thermal annealing, have not been discussed, yet. In this context, this paper demonstrates the mechanical stability of nanosheet FET during the electro-thermal annealing. The effect of mechanical stresses during the electro-thermal annealing was investigated with respect to device design parameters.
Liquid-based Triboelectric nanogenerator (L-TENG) is one of the alternatives to solid-based Triboelectric nanogenerator (S-TENG) because of the absence of surface damage which can decrease the durability of the generator. However, the L-TENG also has an obvious drawback of significantly lower output than that of S-TENG. This article produces water-sloshing-based electricity generating device (W-ED) with a new design of L-TENG that improves electrical output in portable form. The dual-electrode system, consisting of closed-loop circuit and inner electrode which enables water to contact directly in the bottle, can generate the open-circuit voltage and the short-circuit current of up to 348 V and 5.1 mA, respectively. By investigating the motion of water for each frequency, we propose that W-ED is suitable device for a variety of human motions. We expect that W-ED can be applied in small electrical devices or sensors in daily-use items.
IEEE Standard on Piezoelectricity has been utilized for decades though it has shown significant issues that prevent researchers from obtaining accurate materials coefficients. To resolve these issues, our research group recently proposed partial electrode (PE) method. PE method utilizes samples that consist of the center part covered with electrode, and the side part either covered or not covered with electrode for obtaining both intensive and extensive elastic parameters. In this review, we introduce our PE method, along with physical phenomenology and background, such as issues of IEEE standard, to bolster readers understanding of needs for developing new measurement method that can compensate the standard method. It is shown that development of the PE method not only provides technological benefits, but also gives scientific importance for the piezoelectric research community from its extremely high data accuracy.
We studied the change of photovoltaic properties of a flexible CuInxGa(1-x)Se2 (CIGS) solar cell fabricated on polyimide by mechanical bending with curvature radii of 75 mm (75R) and 20 mm (20R). The flexible CIGS cells were flattened on a PET film, then placed and forced against the surface of a curved block fabricated with pre-designed curvatures. Both up (compressive) and down (tensile) bending were applied to a specimen of CIGS on PET with curvatures of 75R and 20R for 10,000 times and 2,000 times, respectively. From J-V measurements, we found that the conversion efficiency (Eff.) was reduced by 3% and 4% for up-and down-bending, respectively, at curvature 75R; it was greatly reduced by 15% for curvature 20R in the up-bending. However, the open circuit voltage (Voc) and short-circuit current density (Jsc) seemed to change little, within 3%, for the applied mechanical stresses. The degradation in Eff. resulted from the deterioration of the series (Rs) and shunt (Rsh) resistances of the solar cell.
Porcelain insulators have been used for a long time in 154 kV power transmission lines. They are likely to be exposed to sudden failure because of product deterioration. This study was conducted to evaluate the quality of porcelain insulators. After stresses were applied, the damaged regions of aged insulators were investigated in terms of chemical composition, material structure, and other properties. For porcelain insulators that were in service for a long time, the mechanical failure load was 126 kN, whereas the average mechanical failure load was 167.3 kN for new products. It was also determined that corrosion occurred at the metal pin part due to the penetration of moisture into the gap between the pin and the ceramic. Statistical analyses of failure were performed to identify the portion of the insulators that were broken. Cristobalite porcelain insulators fabricated without alumina additives had a high failure rate of 54% for the porcelain component. In the case of the addition of Alumina (Al2O3) to the porcelain insulators to improve the strength of the ceramic component, a more frequent damage rate of the cap and pin of 73.3% and 27%, respectively, was observed. This study reports on the material component of SiO2 and the percentage of alumina added, with respect to the mechanical properties of porcelain insulators.
Hexagonal boron nitride particles (s-hBN) modified with 3-aminopropyl triethoxysilane (APTES) were used for the preparation of silicone composite materials. The microstructure of the composite materials was observed, and the thermal conduction and mechanical characteristics of the composite sheets were studied based on the compositions and microstructures. When a small amount of s-hBN particles was used, the thermal conductivity of the composite improved as a whole, and the tensile strength of the sheet also increased. The thermal conductivity and tensile strength of the composite in which a small amount of carbon fiber was added along with s-hBN were further improved. However, the use of carbon nanotubes with structural characteristics similar to those of carbon fiber resulted in lower thermal conductivity and tensile strength. Elastic silicone composites exhibiting 2.5 W/mK of thermal conductivity and a low hardness are expected to be used as thermally conductive interfacial sheet materials.
Mullite (3Al2O3·2SiO2) has emerged as a promising candidate for high-temperature structural materials due to its erosion resistance, chemical and thermal stabilities, relatively low thermal expansion coefficient, excellent thermal shock and creep resistances, and low dielectric constant. However, since the pure mullite sintering temperature is as high as 1,600~1,700℃, there is an increasing need for a sintering additive capable of improving the strength characteristics while lowering the sintering temperature. Herein we have tried to obtain the optimal sintering additive composition by adding MgO, Cr2O3, and Y2O3 to mullite, followed by sintering at 1,325~1,550℃ for 2 h. With additives of 2 wt% of MgO, 2 wt% of Cr2O3, 4 wt% of Y2O3, A density of 3.23 g/cm³ was obtained for the sintered body at 1,350℃ upon using 2 wt% MgO, 2 wt% Cr2O3, and 4 wt% Y2O3 as additives. The three-point flexural strength of that was 275 MPa and the coefficient of thermal expansion (CTE) was 4.15 ppm/℃.
In this study, an epoxy insulation barrier for high voltage GIS was developed using epoxy and a filler with a Young`s modulus of 11 GPa. The material was investigated using a simulation of the principal stress, displacement, and safety factors while optimizing the profile shape. The simulation showed that thelarger Young`s modulus of the Al2O3 filler compared to the SiO2 in the epoxy insulation can contribute to an increase in resistance to mechanical fracturing for theoptimized profile barrier in high voltage GIS. In addition, the safety factor was improved by 10%. It can be concluded that the mechanical fracturing properties of the insulation barrier can be enhanced by increasing the content of the elastic filler, Al2O3, for high voltage GIS applications.
3YSZ + (x) Al2O3 composites (x = 20, 40, 60, 80 wt%) were fabricated and the influences of particle sizes of Al2O3 on their microstructures and mechanical properties were investigated with XRD, SEM, vickers hardness and fracture toughness. Al2O3-3YSZ composites containing Al2O3 powder of a 0.3 μm and an 1.0 μm, which are here in after named as Al2O3(0.3 μm)-3YSZ and Al2O3 (1.0 μm)-3YSZ, respectively, were made by mixing raw materials, uni-axial pressing and sintering at 1,400℃, 1,500℃, and 1,600℃. Al2O3 (0.3 μm)-3YSZ composites show the higher density and the better mechanical properties than Al2O3 (1.0 μm)-3YSZ composites. The Vickers hardness of the Al2O3 (0.3 μm)-3YSZ composites show a peak value of 1,997 Hv at the content of 60 wt% Al2O3, which is a slightly higher value in comparison with 1,938 Hv of the Al2O3(1.0 μm)-3YSZ composite. However, the fracture toughness of Al2O3-3YSZ composites monotonically increases with decreasing the content of Al2O3 without any peak values. Al2O3 (0.3 μm)-3YSZ and Al2O3 (1.0 μm)-3YSZ composites sintered at 1,600℃ have a maximum value of a 6.9 MPa·m1/2 and a 6.2 MPa·m1/2, respectively at the composition of containing 20 wt% Al2O3. It should be noticed that the mechanical properties and the sintering density of the Al2O3-3YSZ composites can be enhanced by using more fine Al2O3 powder due to their denser microstructure and smaller grain size.
In this paper, we have studied the effect of mechanical polishing to Ga-polar face for reducing the wafer bowing and strain in free-standing GaN. After the mechanical polishing to Ga-polar face, the bowing of the free-standing GaN substrate significantly decreased with increasing the size of diamond slurry, and eventually changed the bowing direction from concave to convex. Furthermore, the full width at half maximum (FWHM) of high-resolution X-ray diffraction (HR-XRD) were decreased, especially the FWHM of (1 0 2) reflection for 1.0 μm size of diamond slurry was significantly decreased from 630 to 203 arcsec. In the case, we confirmed that the compressive strain in Ga-polar face was fully released by Raman measurement.
In this study, some materials are organized and experimented with variables to obtain the optimum mix proportion for the mechanical property of halogen free flame resistance compound with varying addition of nano clay. Tensile strength, density and stiffness are tested in the room temperature. In this study, unlike existing layered structure, nano clay with tabular structure is used and sufficient stiffness, strength, thermal stability and gas block capability can be achieved with small amount of addition. Tensile strength and elongation test show high rupture strength only in specimens with compatibilizing agents while density test shows average measurement in all the specimens except T-9. It was confirmed that the measurement value according to the additives in compatibilizing agent or in nano clay of hardness test represents similarly.
In this paper, PZT piezoelectric ceramic specimens with 4 compositions (Zr/Ti=50/50, 53/47, 56/44, 58/42) in Pb(Zr,Ti)O3 system were fabricated. We studied effects of poling strength and thermal aging on the temperature characteristics of eletromechanical coupling factor k31 of the specimens, which were poled with the DC electric fields, 1.5, 2.5 and 3.5 kV/mm respectively and thermally aged for an hour at 200℃. The eletromechanical coupling factor k31 of the specimen with the composition Zr/Ti=53/47, nearest to the morphotropic phase boundary decreased the most greatly, irrelevant to the intensity of poling field, due to 1st thermal aging. And the temperature coefficient of eletromechaical coupling factor k31 was(-) in the ereragonal phase composition and (+) in the rhombohedral phase composition, which is reverse in the temperature coefficient of resonance frequency. It is interesting that eletromechanical coupling factor k31 of PZT ceramics is shown to be able to be able to increase as temperature increase in the interval -20~80℃.
In this paper, we have researched semiconductor optical filters to solve the problem of the high failure rate that are recognize bad of financial account, jam of financial account and the ATM service interruption due to failure of accurate location information among the operation of the ATM (automatic teller machine) systems. A semiconductor optical filters that have high resolution and less diffuse, high transmittance are able to detect the information of financial account surface accurately. Therefore, it is a stable filter that is able to minimize the incidence of disability. In this paper, we drew the determinants by element for implement an excellent semiconductor optical filters. Based on this, we had to be able to implement the semiconductor optical filter that is able to be mounted on the actual ATM system through future studies.
In this paper, we present a novel hydrophilic coating material (Wellture Finetech, Korea) which can be utilized as a coating layer for anti-contamination for electrical and electronic system. The coating material was deposited on 4 inch silicon wafer with several different film thickness. The film thickness was controlled by spin coating speed. After curing of the film, we have scratched by permanent marker to check self-cleaning property of the film. Also we have executed several mechanical tests of the films. As the spin coating speed is increased, the film thickness was thickness was thinned from 230 nm to 125nm. Contact angle of the film lowered from 30° to 12° as the spin coating speed is increased from 700 to 2,500rpm. On permanent marker scratched film surface coated at 1,000 rpm. We have poured regular city water to investigate self cleaning property of the film. The scratches were gradually separated from the film surface due to super-hydrophilicity of the film. Hardness of coated film was 9H measured by ASTM D3363 method. And adhesion of all film was 5B tested by D3359 method. Also, to get exact hardness value of the film, we have utilized a nano-indenter. As spin speed is increased, the hardness of film was increased from 3 Gpa to 5 Gpa.
In this study, lead-free (Na0.465K0.465Bi0.07)(Nb0.93Ti0.07)O3-0.08MnO2 ceramics were fabricated by conventional mixed oxide method. Structural and electrical properties of lead-free (Na0.465K0.465Bi0.07)(Nb0.93Ti0.07)O3-0.08MnO2 ceramics with the variation of sintering temperature were investigated. As results of x-ray diffraction analysis, all specimens showed a typical polycrystalline perovskite structure without presence of the second phase. Sintered density increased with an increases of sintering temperature and the specimen sintered at 1,020℃ showed the maximum value of 4.5 g/cm3. The average grain size of the (Na0.465K0.465Bi0.07)(Nb0.93Ti0.07)O3-0.08MnO2 specimen sintered at 1,020℃ is about 0.83 μm. Electromechanical coupling factor, relative dielectric constant and dielectric loss of (Na0.465K0.465Bi0.07)(Nb0.93Ti0.07)O3-0.08MnO2 specimens sintered at 1,020℃ were 0.252, 741 and 0.043% respectively.
We investigated the speed change of the diamond spherical abrasive during the substrate surface polishing under the pad compression by using classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. As the compressive pressure increased, the indented depth of the diamond abrasive increased and then, the speed of the diamond abrasive along the direction of the pad moving was decreased. Molecular simulation result such as the abrasive speed decreasing due to the pad pressure increasing gave important information for the chemical mechanical polishing including the mechanical removal rate with both the pad speed and the pad compressive pressure.
In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen`s bonding area below 3.5mm2, and were from 17 to 21% at specimen`s bonding area above 12 mm2. On the other hand, Specimen`s mean deviation rates were about 5% at specimen`s bonding area more than 12 mm2. Inversely, at specimen`s bonding area is less then 3.5 mm2, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.
Poly Si TFTs (poly silicon thin film transistors) with p channel those are annealed HT (high t emperature) with gate poly crystalline silicon and LT (low temperature) with metal gate electrode were fabricated on quartz substrate using the analyzed data and compared according to the activated grade silicon thin films and the size of device channel. The electrical characteristics of HT poly-Si TFTs increased those are the on current, electron mobility and decrease threshold voltage by the quality of particles of active thin films annealed at high temperature. But the on/off current ratio reduced by increase of the off current depend on the hot carrier applied to high gate voltage. Even though the size of the particles annealed at low temperature are bigger than HT poly-Si TFTs due to defect in the activated grade poly crystal silicon and the grain boundary, the characteristics of LT poly-Si TFTs were investigated deterioration phenomena those are decrease the electric off current, electron mobility and increase threshold voltage. The results of transconductance show that slope depend on the quality of particles and the amplitude depend on the size of the active silicon particles.
In this study, lead-free (K0.5Na0.5+X)(Nb0.96Sb0.04)O3+0.2mol%La2O3+1.2mol% K4CuNb8O23 (X= 0∼0.025) ceramics were fabricated by normal sintering method at 1060℃ for 5 h. Microstructures, piezoelectric and dielectric properties of specimens were investigated with special emphasis in the influence of Na excess addition. The grain size of specimen was slightly decreased with increasing Na content. In the 2 [mol%] Na excess addition of NKNS ceramics, density, electromechanical coupling factor, piezoelectric constant and electromechancal quality factor of specimen were found to reach the optimum values of 4.25 [g/cm3], 0.4357, 154.43 [pC/N] and 580, respectively.
First
Prev
