Journal of Electrical and Electronic Materials

A Study on Tribological Properties of Diamond-Like Carbon Thin Film for the Application to Solid Lubricant of MEMS Devices: J Korean Inst Electr Electron Mater Eng 2006;19(11):1010-1013. Published online November 1, 2006; DOI: https://doi.org/10.4313/JKEM.2006.19.11.1010

An Analysis of Tribological Properties of Metal Interlayered DLC Films Prepared by PECVD Method: J Korean Inst Electr Electron Mater Eng 2006;19(7):631-635. Published online July 1, 2006; DOI: https://doi.org/10.4313/JKEM.2006.19.7.631

A Study on the Characteristics of Stick-slip Friction in CMP: J Korean Inst Electr Electron Mater Eng 2005;18(4):313-320. Published online April 1, 2005; DOI: https://doi.org/10.4313/JKEM.2005.18.4.313

Citations

Citations to this article as recorded by

Effect of Slurry Film Thickness Variation according to Spray Range Using Ultrasonic Spray Nozzle on Material Removal Rate
Seongnyeong Heo, Seonho Jeong, Minji Kim, Youngwook Park, Haedo Jeong
Journal of the Korean Society for Precision Engineering.2022; 39(9): 675. CrossRef

Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP): J Korean Inst Electr Electron Mater Eng 2004;17(10):1049-1055. Published online October 1, 2004; DOI: https://doi.org/10.4313/JKEM.2004.17.10.1049

Citations

Citations to this article as recorded by

Two-Step Chemical Mechanical Polishing of 4H-SiC (0001) Wafer
Weilei Wang, Weili Liu, Zhitang Song
ECS Journal of Solid State Science and Technology.2021; 10(7): 074004. CrossRef

Characteristics of Friction Affecting CMP Results: J Korean Inst Electr Electron Mater Eng 2004;17(10):1041-1048. Published online October 1, 2004; DOI: https://doi.org/10.4313/JKEM.2004.17.10.1041

Citations

Citations to this article as recorded by

Material Removal Mechanism of CMP Pad by CVD Conditioner Cutting Edges
Jiho Shin, Jongmin Jeong, Yeongil Shin, Haedo Jeong
Journal of the Korean Society for Precision Engineering.2026; 43(7): 671. CrossRef
Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality
Woong-Kirl Choi, Seong-Hyun Kim, Seung-Geon Choi, Eun-Sang Lee, Chul-Hee Lee
International Journal of Precision Engineering and Manufacturing.2014; 15(11): 2301. CrossRef
Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations
Eun-Sang Lee, Ji-Wan Cha, Seong-Hyun Kim
International Journal of Machine Tools and Manufacture.2013; 66: 82. CrossRef

Page Path