Skip to main navigation
Skip to main content
KIEEME
mobile search button
mobile menu button
Search
Advanced Search
ABOUT
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
E-SUBMISSION
Article Template
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
Page Path
HOME
Search
Abrasive
WHERE t1.sid in(parameter_dbtbl_keyword '%Abrasive%') and t1.xml_status <> 99
7
results for
"Abrasive"
Filter
Keywords
chemical mechanical polishing (5)
Abrasive (4)
CMP (3)
Removal rate (2)
Slurry (2)
More +
Publication year
2005 (1)
2004 (2)
2003 (4)
Authors
Sang Yong Kim (4)
Yong Jin Seo (4)
U Seon Lee (2)
Chang Jun Park (2)
Gi Lyang Byeon (1)
More +
Keywords
chemical mechanical polishing (5)
Abrasive (4)
CMP (3)
Removal rate (2)
Slurry (2)
Abrasives concentration (1)
Abrasives size (1)
Acid Colloidal Silica (1)
Atomistic Modeling (1)
Chemical Mechanical Planarization (1)
COC (1)
Consumables (1)
COO (1)
Copper (1)
cost of consumables (1)
cost of Ownership (1)
Dishing (1)
Eros on (1)
Fixed abrasive pad (1)
Friction force (1)
Mechanical Polishing (1)
Molecular Dynamics (1)
Non-uniformity (1)
NU (1)
Overpolishing (1)
Oxidizer (1)
Pattern selectivity (1)
Reused slurry (1)
RR (1)
Semi Abrasive Free Slurry (1)
Cancel
Close
authors
Sang Yong Kim (4)
Yong Jin Seo (4)
U Seon Lee (2)
Chang Jun Park (2)
Gi Lyang Byeon (1)
Un Sig Choe (1)
Won Yeong Choe (1)
Woon Shik Choi (1)
Ho Jeong Hwang (1)
Ui Gu Jang (1)
Jeong Won Kang (1)
Nam Hun Kim (1)
Tae Hyeong Kim (1)
Woo Sun Lee (1)
Gyeong Jin Lee (1)
Jae Gyeong Lee (1)
Jin Sung Park (1)
Jin Seong Park (1)
Gi O Song (1)
Cancel
Close
Publication Year
2005 (1)
2004 (2)
2003 (4)
Cancel
Close
Funded articles
Cancel
Close
"Abrasive"
Fixed Abrasive Pad with Self-conditioning in CMP Process
J Korean Inst Electr Electron Mater Eng
2005;18(4):321-326.
Published online April 1, 2005
DOI:
https://doi.org/10.4313/JKEM.2005.18.4.321
PDF
73
View
0
Download
Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP)
J Korean Inst Electr Electron Mater Eng
2004;17(10):1049-1055.
Published online October 1, 2004
DOI:
https://doi.org/10.4313/JKEM.2004.17.10.1049
PDF
Citations
Citations to this article as recorded by
Two-Step Chemical Mechanical Polishing of 4H-SiC (0001) Wafer
Weilei Wang, Weili Liu, Zhitang Song
ECS Journal of Solid State Science and Technology.2021; 10(7): 074004.
CrossRef
64
View
0
Download
1
Crossref
A Study on Semi Abrasive Free Slurry including Acid Colloidal Silica for Copper Chemical Mechanical Planarization
Nam Hun Kim, Sang Yong Kim, Yong Jin Seo, Tae Hyeong Kim, Ui Gu Jang
J Korean Inst Electr Electron Mater Eng
2004;17(3):272-277.
Published online March 1, 2004
DOI:
https://doi.org/10.4313/JKEM.2004.17.3.272
PDF
55
View
0
Download
Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives
Yong Jin Seo, Gyeong Jin Lee, Un Sig Choe, Sang Yong Kim, Jin Seong Park, U Seon Lee
J Korean Inst Electr Electron Mater Eng
2003;16(9):759-764.
Published online September 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.9.759
PDF
56
View
0
Download
Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry
Yong Jin Seo, Chang Jun Park, Woon Shik Choi, Sang Yong Kim, Jin Sung Park, Woo Sun Lee
J Korean Inst Electr Electron Mater Eng
2003;16(6):465-470.
Published online June 1, 2003
DOI:
https://doi.org/10.4313/JKEM.2003.16.6.465
PDF
68
View
0
Download
Effects of Mixed Oxidizer on the W-CMP Characteristics
Chang Jun Park, Yong Jin Seo, Sang Yong Kim, U Seon Lee
J Korean Inst Electr Electron Mater Eng
2003;16(12s):1181-1186.
DOI:
https://doi.org/10.4313/JKEM.2003.16.12s.1181
PDF
60
View
0
Download
Atomistic Modeling of Spherical Nano Abrasive-Substrate Interaction
Jeong Won Kang, Gi O Song, Won Yeong Choe, Gi Lyang Byeon, Jae Gyeong Lee, Ho Jeong Hwang
J Korean Inst Electr Electron Mater Eng
2003;16(12s):1157-1164.
DOI:
https://doi.org/10.4313/JKEM.2003.16.12s.1157
PDF
58
View
1
Download
First
Prev
Page
of 1
Next
Last
×
TOP
First
Prev
