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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성

서용진, 박창준, 최운식, 김상용, 박진성, 이우선

Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry

Yong Jin Seo, Chang Jun Park, Woon Shik Choi, Sang Yong Kim, Jin Sung Park, Woo Sun Lee
J Electr Electron Mater 2003;16(6):465-470.
Published online: June 1, 2003
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Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry
J Electr Electron Mater. 2003;16(6):465-470.   Published online June 1, 2003
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry
J Electr Electron Mater. 2003;16(6):465-470.   Published online June 1, 2003
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