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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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Self-conditioning 고정입자패드를 이용한 CMP

박범영, 이현섭, 박기현, 서헌덕, 정해도, 김호윤, 김형재

Fixed Abrasive Pad with Self-conditioning in CMP Process

, , , , , ,
J Electr Electron Mater 2005;18(4):321-326.
Published online: April 1, 2005
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Fixed Abrasive Pad with Self-conditioning in CMP Process
J Electr Electron Mater. 2005;18(4):321-326.   Published online April 1, 2005
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Include:
Fixed Abrasive Pad with Self-conditioning in CMP Process
J Electr Electron Mater. 2005;18(4):321-326.   Published online April 1, 2005
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