We investigated and compared two methods of in-situ oxidation and chemical etching treatment (CET) to remove the boron rich layer (BRL). The BRL is generally formed during boron doping process. It has to be controlled in order not to degrade carrier lifetime and reduce electrical properties. A boron emitter is formed using BBr3 liquid source at 930℃. After that, in-situ oxidation was followed by injecting oxygen of 1,000 sccm into the furnace during ramp down step and compared with CET using a mixture of acid solution for a short time. Then, we analyzed passivation effect by depositing Al2O3. The results gave a carrier lifetime of 110.9 ㎲, an open-circuit voltage (Voc) of 635 mV at in-situ oxidation and a carrier lifetime of 188.5 ㎲, an Voc of 650 mV at CET. As a result, CET shows better properties than in-situ oxidation because of removing BRL uniformly.
