Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

Articles

Page Path

Cu 배선의 평탄화를 위한 ECMD에 관한 연구

정석훈, 서헌덕, 박범영, 박재홍, 박성민, 정문기, 정해도, 김형재

Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

, , , , , , ,

J Electr Electron Mater 2005;18(9):793-797.
Published online: September 1, 2005

8 Views
0 Download
0 Crossref
0 Scopus

prev next

Full Article

Download PDF

Keywords: ECMD, electro-chemical mechanical deposition, Cu, Mechanism

Cite

CITE

export

Copy Download

Format

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
BibTeX — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

J Electr Electron Mater. 2005;18(9):793-797. Published online September 1, 2005

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

J Electr Electron Mater. 2005;18(9):793-797. Published online September 1, 2005

Articles

Page Path

Cu 배선의 평탄화를 위한 ECMD에 관한 연구

Electro-chemical Mechanical Deposition for Planarization of Cu Interconnect

Full Article

CITE

Download Citation

Format:

Include:

Related articles

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS