Wafer Burn-in Method for SRAM in Multi Chip Package

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Multi Chip Package의 SRAM을 위한 웨이퍼 Burn-in 방법

윤지영, 유장우, 김후성, 성만영

Wafer Burn-in Method for SRAM in Multi Chip Package

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J Electr Electron Mater 2005;18(6):506-509.
Published online: June 1, 2005

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Keywords: Burn-in, Multi chip package, SRAM, Stress, Reliability

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Wafer Burn-in Method for SRAM in Multi Chip Package

J Electr Electron Mater. 2005;18(6):506-509. Published online June 1, 2005

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Wafer Burn-in Method for SRAM in Multi Chip Package

J Electr Electron Mater. 2005;18(6):506-509. Published online June 1, 2005

Real-time Temperature Monitoring Technology for Offshore Wind Farm Submarine Cables

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Multi Chip Package의 SRAM을 위한 웨이퍼 Burn-in 방법

Wafer Burn-in Method for SRAM in Multi Chip Package

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