Skip to main navigation Skip to main content
  • KIEEME

J Electr Electron Mater : Journal of Electrical and Electronic Materials

OPEN ACCESS
ABOUT
BROWSE ARTICLES
EDITORIAL POLICIES
FOR CONTRIBUTORS

Page Path

4
results for

"TCP"

Keywords

Publication year

Authors

"TCP"

Thermal Characteristics of 20 W LED Module on Light Thermal Conductive Plastic Heat Sink: Comparison with that on Aluminum Die Casting Alloy (ADC-12)
Jung-kyu Yeo, In-sung Her, Seung-min Lee, Hee-lack Choi, Young-moon Yu
J Electr Electron Mater 2016;29(6):380-385.   Published online June 1, 2016
Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and 2.82 kg/㎡, thermal conductivity is 20 and 92 W/(m·K) for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was 3℃ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.
  • 7 View
  • 0 Download
Thin Films and Sensors : Application of Si3N4 Thin Film as a Humidity Protection Layer for Organic Light Emitting Diode
Chang Jo Kim, Paik Kyun Shin
J Electr Electron Mater 2010;23(5):397-402.   Published online May 1, 2010
  • 6 View
  • 0 Download
  • 7 View
  • 0 Download
A Study on the Silicon Nitride for the poly-Si Thin Film Transistor
Do Yeong Kim, Chi Hyeong Kim, Jae Gyeong Go, Jun Sin Lee
J Electr Electron Mater 2003;16(12s):1175-1180.
  • 8 View
  • 0 Download