Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and 2.82 kg/㎡, thermal conductivity is 20 and 92 W/(m·K) for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was 3℃ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.
Optimization of a SiOx/SiNxOyCz multilayer structure for a reliable gas diffusion barrier via low-temperature plasma-enhanced atomic layer deposition Ju-Hwan Han, Su Ho Lim, Jin-Myung Choi, Seong-Hyeon Lee, Woojin Jeon, Jin-Seong Park Ceramics International.2019; 45(6): 7407. CrossRef
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