Some insulating materials are organized and analyzed with variables to obtain the optimized profile of encapsulated three phase of epoxy barrier which is applied to gas compartment and supporting conductors for high voltage GIS (gas insulated switchgear). The high voltage GIS is used in electrical power system and operating reliability. In this paper, optimization possibility of barrier shape including both electrical insulation performance and mechanical strength, premised on that condition minimizing volume and light weight should be kept for high voltage GIS, could be achieved by analysis simulation. As a result, filling material which is lower permittivity such as SiO2 instead of Al2O3 properly to the epoxy material, can be improved to increase the electrical insulation performance and mechanical strength for an optimized profile barrier of a high voltage GIS.

Aerosol deposition(AD) coating that enable fabricate films at low temperature have begun to be widely researched for the integration of ceramics as well to realize high-speed deposition rates. For application of ceramic thick film by AD to display and electronic ceramic industry, fabrication of dense structure with a no cracking is required. In this study, to fabricate dense ceramic thick film, the effect of crystal phase of starting powder was investigated. For this study, amorphous and crystalline SiO2 powders were used as starting powders. Two types of SiO2 powders were deposited on glass substrate by AD. In the case of amorphous SiO2 powder, the deposited films had extremely incompact and opaque layer, irrespective of particle size. In contrast to amorphous powder, in the case of crystalline powder, porous structure layer and dense microstructure with no cracking layer were fabricated depending on the particle size. The optimized starting powder size for dense coating layer was 1∼2 μm. The transmittance of film reached a maximum of 76% at 800 nm.

PTCR ceramics of (Ba0.998Sm0.002)TiO3 + 0.001MnCO3 + xSiO2 (x=1, 2, 3, 4, 5, 6 mol%) were fabricated by solid state method. Disk samples of diameter 5 mm and thickness about 1mm were sintered at 1,290℃ for 2 h in reduced atmosphere of 5%H2-95%N2 followed by re-oxidation at 600℃ for 30 min. in 20%O2-80%N2.and their microstructures and electrical properties were investigated with SEM and Multimeter. The color of sintered samples was strongly dependent on SiO2 content showing that the color of samples with SiO2 of 1∼2 mol% was gray but that of samples with SiO2 of 4∼6 mol% was changed from gray to blue, which seems to be related with the reduction of samples due to the oxygen vacancies created during the sintering in reduced atmosphere. SiO2 content had a great influence on the microstructure and the electrical properties. With increasing SiO2 content, the grain size of samples increased and the resistivity as well as the resistivity jump (R285/Rmin) decreased, which is considered to be attributed to the resistivity change at grain interior and grain boundary due to the fast mass transfer through SiO2 liquide phase during the sintering. Samples with 2 mol% SiO2 has the resistivity of 202 Ω cm and the resistivity jump of 3.28. It is expected that SiO2 doped BaTiO3 based PTC ceramics can be used for multilayered PTC thermistor due to the resistance to the sintering in reduced atmosphere.

Ordered mesoporous oxide films have been focused because of their low density, high interior specific surface area, and high thermal insulation. Specially, the ordered mesoporous oxide films prepared by self-assembly has many advantages due to easy process and high reproducibility. In this work, ordered mesoporous SiO2, Al2O3, and TiO2 films were synthesized by control of composition and processing parameter. Also, their structural, thermal, and mechanical properties were characterized variously. In conclusion, ordered mesoporous oxides will be one of core materials in new technology due to their excellent and unique properties.

In this paper, we have theoretically analyzed and designed a dielectric multi-layer sensor with a SPR (surface plasmon resonance) using analytical calculation and FDTD (finite difference time-domain) methods. The proposed structure is composed of periodic layer and thin metal film. It has many advantages. One of that is a high sensitivity of the SPR. Another is a high Q-factor of the characteristics in the PhC (photonic crystals) micro-cavity structure. The incident light has double resonance characteristics, because the filtered light by PhC structure, dielectric multi-layer, is met the thin metal film for SPR effect. We have also observed the change of resonance characteristics according to the variation of effective index on the metal film.

In this paper, reliability of the two sandwiched MIM capacitors of Al2O3-HfO2-Al2O3 (AHA) and SiO2-HfO2-SiO2 (SHS) with hafnium-based dielectrics was analyzed using two kinds of voltage stress; DC and AC voltage stresses. Two MIM capacitors have high capacitance density (8.1 fF/μm2 and 5.2 fF/μm2) over the entire frequency range and low leakage current density of ∼1 nA/cm2 at room temperature and 1 V. The charge trapping in the dielectric shows that the relative variation of capacitance (ΔC/C0) increases and the variation of voltage linearity (α/α0) gradually decreases with stress-time under two types of voltage stress. It is also shown that DC voltage stress induced greater variation of capacitance density and voltage linearity than AC voltage stress.

This research shows the electrical characteristic using excellent epoxy nano-composite of MgO 5.0 wt% and SiO2 0.4 wt% in mechanical strength test depending on nano-additive. First of all, volume resistance depending on nano-additive and temperature using high resistance meter (HP. 4329A) by increasing 10, 100, 1,000 V of applying voltage was measured. Moreover, temperature range of 25~120℃ with virgin sample was tested using TO-9B oven by Ando Company. The result showed that virgin and the samples added with MgO and SiO2 had similar value of volume resistance in low temperature and low electric field region and reduced with slow slope. The nano-composite`s volume resistance of sample added with MgO and SiO2 had higher value than virgin sample`s volume resistance in high temperature region more than 80℃. Moreover, the slope has steeply reduced. The volume resistance of sample added with MgO 5.0 wt% was 8.38×10(13) Ω·cm and it was 6.8 times more than virgin sample in high temperature at 120℃. The insulation characteristics were constant although filler has changed in low temperature region. But, in high temperature region, the value of volume resistance of sample with MgO 5.0 wt% was 7.6 times more than the virgin sample`s volume resistance.

Hafnium oxide (HfO2) was very advantageous for substitute material of gate on existing transistor. HfO2 has been widely studied due to high contact with polysilicon and thermal stability and also, it is easily etched by using HF solution. In this study, HfO2 and thermal oxide films were etched by wet etch method using chemical etchant. Etch rate of HfO2 and thermal oxide was linearly increased with increasing concentration of HF and temperature but etch rate of HfO2 was higher than thermal oxide due to H+, F-, and HF2- ions at below 0.5% concentration of HF. And also, etch selectivity was improved by adding Hydrazine as additive.

The cause of the thickness non-uniformity in the large area deposition of SiO2 films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the SiO2 films, it was conformed that the non-uniform deposition of SiO2 films was related with the spatial distribution of the oxygen radical density and electron temperature.