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"Nitridation"

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"Nitridation"

Effect of High-Temperature Post-Oxidation Annealing in Diluted Nitric Oxide Gas on the SiO2/4H-SiC Interface
In Kyu Kim, Jeong Hyun Moon
J Electr Electron Mater 2024;37(1):101-105.   Published online January 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.1.14
4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (Ron,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (Dit) at the SiO2/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO2/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N2 diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N2 gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO2/4H-SiC interface, thereby reducing the Dit.
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Thin Films and Sensors : Influence of Nitrogen Plasma Treatment on Low Temperature Deposited Silicon Nitride Thin Film for Flexible Display
Seong Jong Kim, Moon Keun Kim, Kwang Ho Kwon, Jong Kwan Kim
J Electr Electron Mater 2014;27(1):39-44.   Published online January 1, 2014
Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.
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Impact of DPN on Deep Nano-technology Device Employing Dual Poly Gate
Chang Jib Kim, Yong Han Roh
J Electr Electron Mater 2008;21(4):296-299.   Published online April 1, 2008
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A Stacked Polusilicon Strucutre by Nitridation in N2 Atmosphere for Nano-scale CMOSFETs
J Electr Electron Mater 2005;18(11):1001-1006.   Published online November 1, 2005
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Formation of TiN by Ti Nitridation in NH3 Ambient
Geun U Lee, Su Jin Park, Jeong Ju Yu, Yeong Ho Kwon, Ju Yeon Kim, Hyeong Tag Jeon, Gyu Sig Bae
J Electr Electron Mater 2004;17(2):150-155.   Published online February 1, 2004
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