The low-temperature coefficient of resistance (TCR) is a crucial factor in the development of space-grade resistors for temperature stability. Consequently, extensive research is underway to achieve zero TCR. In this study, resistors were deposited by co-sputtering nickel-chromium-based composite compositions, metals showing positive TCR, with SiO2, introducing negative TCR components. It was observed that achieving zero TCR is feasible by adjusting the proportion of negative TCR components in the deposited thin film resistors within certain compositions. Additionally, the correlation between TCR and deposition conditions, such as sputtering power, Ar pressure, and surface roughness, was investigated. We anticipate that these findings will contribute to the study of resistors with very low TCR, thereby enhancing the reliability of space-level resistors operating under high temperatures.
Multilayer Ceramic Capacitors (MLCCs) are essential passive components in the electronics industry, known for their high capacitance due to the multilayer structure comprising inner electrodes and dielectric layers. Nickel electrodes are commonly used in MLCCs as the inner electrodes, and to prevent oxidation during the co-firing of the dielectric layers with nickel electrodes, reducing atmosphere is required. However, reducing atmosphere sintering can also induce a reduction of the dielectric, necessitating precise control of oxygen partial pressure. To explore the possibility of using oxide electrodes that do not require reducing atmosphere sintering, we analyze the electrical properties of nickel oxide (NiO) as a potential candidate. As a preliminary study on its use as an alternative inner electrode, the correlation between microstructure and electrical properties of bulk NiO under different sintering conditions was investigated to gain insights into the conduction mechanisms of the material.
Gallium Oxide (Ga2O3) is preferred as a material for next generation power semiconductors. The Ga2O3 should solve the disadvantages of low thermal resistance characteristics and difficulty in forming an inversion layer through p-type ion implantation. However, Ga2O3 is difficult to inject p-type ions, so it is being studied in a heterojunction structure using p-type oxides, such as NiO, SnO, and Cu2O. Research the lateral-type FET structure of NiO/Ga2O3 heterojunction under the Gate contact using the Sentaurus TCAD simulation. At this time, the VG-ID and VD-ID curves were identified by the thickness of the Epi-region (channel) and the doping concentration of NiO of 1 × 1017 to 1 × 1019 cm-3. The increase in Epi region thickness has a lower threshold voltage from -4.4 V to -9.3 V at ID = 1 × 10-8 mA/mm, as current does not flow only when the depletion of the PN junction extends to the Epi/Sub interface. As an increase of NiO doping concentration, increases the depletion area in Ga2O3 region and a high electric field distribution on PN junction, and thus the breakdown voltage increases from 512 V to 636 V at ID =1 × 10-3 A/mm.
Nickel oxide is a nonstoichiometric transparent conductive oxide with p-type conductivity, a wide-band energy gap of 3.4~4.0 eV, and excellent chemical stability, making it a very important candidate as a material for bipolar devices.P-type conductivity in Transparent Conductive Oxides (TCO) is controlled by the oxygen vacancy concentration. During the TCO film deposition process, additional oxygen diffusing into the NiO structure causes the formation of Ni 3p ions and Ni vacancies. This eventually affects the hole concentration of the p-type oxide thin film. In this work, the surface morphology and the electrical characteristics were confirmed in accordance with the annealing atmosphere of the nickel oxide thin film.
We demonstrate an alignment technology using an imprinting process on an inorganic NiOx film. The aligned nanopattern was fabricated on a silicon wafer by laser interference lithography. The aligned nano pattern was then imprinted onto the sol-gel driven NiOx film using an imprinting process at an annealing temperature of 150℃. After the imprinting process, parallel grooves had been formed on the NiOx film. Atomic force microscopy and water contact angle measurements were performed to confirm the parallel groove on the NiOx film. The grooves caused liquid crystal alignment through geometric restriction, similar to grooves formed by the rubbing process on polyimide. The liquid crystal cell exhibited a pretilt angle of 0.2°, which demonstrated homogeneous alignment.
Thin thermistor films of solutions with nickel and manganese oxides were prepared by metal-organic decomposition (MOD). The structural properties of the thin films were investigated as a function of annealing temperature. Field emission scanning electron microscope (FE-SEM) results indicated that the thin films had a thin thickness, smooth and dense surface. The crystallization temperature of 414.9℃ was confirmed from thermogavimetric-differential thermal analysis (TG-DTA)curve. A single phase of cubic spinel structure was obtained for the thin film annealed from 700℃ to 800℃,which was confirmed from the X-ray diffraction (XRD). From the selected area electron diffraction(SAED) in high resolution transmission electron microscope (HRTEM), the nano grains (2∼3 nm) of spinel phase with (311) and (222) planes were detected for the thin film annealed at 500℃, which could be applicable to read-out integrated circuit (ROIC) substrate of the uncooled microbolometer with low processing temperature.
Numerical analysis on RF (Radio Frequency) thermal plasma treatment of micro-sized Ni metal was carried out to understand the synthesis mechanism of nano-sized Ni powder by HF thermal plasma. For this puipose, the behaviors of Ni metal particles injected into HF plasma torch were investigated according to their diameters (1 100 pin). RF input power (6~12 kW) and the flow rates of carrier gases (2 and 5 slpm). From the numerical results, it is predicted firstly that the velocities of carrier gases need to be minimized because the strong injection of carrier gas can cool down the central column of RF thermal plasma significantly, which is used as a main path for RF thermal plasma treatment of micro-sized Ni metal. In addition, the residence time of the injected particles in the high temperature region of RF thermal plasma is found to be also reduced in proportion to the flow rate of the carrier gas In spite of these effects of carrier gas velocities, however, calculation results show that a Ni metal particle even with the diameter of 100 pin can be completely evaporated at relatively low power level of 10 kW during its flight of HF thermal plasma torch (< 10 ms) due to the relatively low melting point and high thermal conductivity. Based on these observations, nano-sized Ni metal powders are expected to be produced efficiently by a simple treatment of micro-sized Ni metal using HF thermal plasmas.
The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.
Nickel wires of 0.8 mm in diameter and 80 mm in length were electrically exploded in liquid media such as water, ethyl alcohol. The distribution of particle sizes was broad from a few micrometers to tens of nanometer. It was identified that the particles could be classified according to its sizes by using centrifugal separator. The powder prepared in distilled water showed mainly pure metallic Ni phase although a little oxide phase was observed. The powders prepared in ethyl alcohol showed complicated unknown phases, which is attributed to the compound of carbon in the organic liquid. This unknown phase was turned to pure metallic Ni phase after heat treatment.
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