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Material removal rate
WHERE t1.sid in(parameter_dbtbl_keyword '%Material removal rate%') and t1.xml_status <> 99
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"Material removal rate"
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Chemical mechanical planarization (1)
CMP (1)
Material removal rate (1)
MRR (1)
Pad thickness (1)
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2010 (1)
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Jae Hyun Bae (1)
Hae Do Jeong (1)
Masaharu Kinoshita (1)
Hyun Seop Lee (1)
Hideaki Nishizawa (1)
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Chemical mechanical planarization (1)
CMP (1)
Material removal rate (1)
MRR (1)
Pad thickness (1)
Viscoelasticity (1)
Within wafer non-uniformiy (1)
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Jae Hyun Bae (1)
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Masaharu Kinoshita (1)
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Jae Hong Park (1)
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"Material removal rate"
Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP
Jae Hyun Bae, Hyun Seop Lee, Jae Hong Park, Hideaki Nishizawa, Masaharu Kinoshita, Hae Do Jeong
J Electr Electron Mater
2010;23(5):358-363.
Published online May 1, 2010
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