Porous polymeric structures with piezoelectric properties have attracted considerable attention in the fields of biomaterials and tissue engineering due to their ability to convert mechanical stimuli into electrical signals. However, conventional fabrication methods for porous structures often face limitations in controlling pore architecture, maintaining structural uniformity, and achieving process reproducibility, in addition to requiring complex processing conditions. To address these issues, we propose a facile and reproducible fabrication method for porous poly (vinylidene fluoride) (PVDF) piezoelectric sponges using molded sugar cubes as sacrificial pore templates. By adjusting the particle size of the sugar templates, the pore size and distribution of the sponges could be effectively controlled, and a uniform open-pore network was achieved. The fabricated sponges were evaluated with a focus on pore morphology, mechanical behavior, and piezoelectric performance depending on the sugar particle size, and these evaluations confirmed the structural properties and functional efficacy. This study presents a simple and reproducible fabrication strategy along with a quantitative analysis method for porous structures, which is expected to enhance process accessibility and practical applicability in the development of piezoelectric polymer-based biomaterial platforms.

Flexible micro-supercapacitors (MSCs) based on 2D MXenes offer strong potential for next-generation energy storage in wearable and integrated electronics, yet still face critical challenges such as limited energy density, mechanical reliability, and scalable large-area manufacturing. This review surveys recent strategies to address these limitations, with a particular focus on fabrication techniques and wafer-level integration approaches. Wafer-scale processing on both rigid and flexible substrates has emerged as a key milestone toward scalable, high-yield industrial production of flexible MSCs. By examining the strengths and drawbacks of current fabrication strategies, this review highlights essential directions for advancing MXene-based flexible MSCs toward practical and widespread application.

The laser (LASER), originating from the principle of stimulated emission proposed by Albert Einstein, has been a catalyst for substantial advancements across numerous industrial and scientific domains. Initially confined to research and laboratory applications, the scope of laser technology has expanded rapidly over time. This expansion is primarily due to the laser's unique characteristics, such as high-density energy output and precise beam control, which have facilitated its widespread integration into contemporary industrial practices. Specifically, laser materials processing technology enables the machining of diverse materials, including metals, ceramics, and polymers, in a non-contact manner, thereby achieving high precision without the risk of wear or contamination. As a result, laser processing has become indispensable in fields such as advanced electronics manufacturing, medical device production, aerospace, and the automotive industry. Furthermore, laser materials processing exhibits significant potential for high-precision applications that demand minimal thermal deformation of materials, such as microfabrication and the production of complex geometries. This paper provides a comprehensive examination of the development and necessity of laser processing technology, explores various laser types and their possible applications, and elucidates why laser technology has emerged as a fundamental component of modern manufacturing, alongside its trajectory for future development.

High pressure deuterium (HPD) annealing is an advancing technology for the fabrication of modern semiconductor devices. In this work, gate-enclosed FETs are fabricated on a silicon substrate as test vehicles. After a cycle for the HPD annealing, the device parameters such as threshold voltage (V_TH), subthreshold swing (SS), on-state current (I_ON), off-state current (I_OFF), and gate leakage (I_G) were measured and compared depending on the HPD. The HPD annealing can passivate the dangling bonds at Si-SiO₂ interfaces as well as eliminate the bulk trap in SiO₂. It can be concluded that adding the HPD annealing as a fabrication process is very effective in improving device reliability, performance, and variability.

We propose a fabrication process of a 3-electrode type reflective display and ascertain the realized color panel. The first design is proceeded with basis on Ti electrode for fast panel fabrication, easy align process, and high reflection of a white image. To observe the particle movement at the lower electrodes and optimize the space between electrodes, we design the second patterns, from which we establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, driving, and packaging. After aging process, we ascertain a normally driving panel with black, white, and blue color.

In this paper, we designed a charge pump circuit using level shifter for LED driver IC. The designed circuit makes the 15 V output voltage from the 5 V input in condition of 50 kHz switching frequency. The prototype chip which include the proposed charge pump circuit and its several internal sub-blocks such as oscillator, level shifter was fabricated using a 0.35 um 20 V BCD process technology. The size of the fabricated prototype chip is 2,350 um × 2,350 um. We examined performances of the fabricated chip and compared its measured results with SPICE simulation data.