Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at 150°C was carried out for 14 days (336 h). After aging, the intermetallic compound Cu₆Sn₅ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force，even in metallurgical changes such as those where intermetallic compounds form at solder joints.

Various process technologies for manufacturing power inductors are under development. The core goal is to increase the mixing ratio of the soft magnetic powder in the epoxy, and to uniformly disperse it in a molding-type power inductor, manufactured by the injection molding method. In this study, we investigated the effect of dispersant and silane on the dispersion of soft magnetic metal powders in epoxy. We added 0.6 wt% of dispersant and 2.0 wt% of silane, and an excellent dispersibility resulted. Under the conditions of 0.3 wt% of dispersant and 0.5 wt% of silane, we added both dispersant and silane together to observe the effect of their interaction on dispersibility. Similarly, the addition of 0.3 wt% of dispersant and 0.1 wt% of silane resulted in a sharp increase in viscosity, considered to be due to the interaction of the dispersant and silane. The addition of 0.1 wt% of dispersant with 0.5 wt% of silane resulted in a sharp rise in viscosity, and sedimentation-height decreased sharply due to the dispersion optimization.

In this study, we prepared 40, 45, 50, 55, 60, 65, and 70 wt% content composites filled in epoxy matrix for two micro silica and three micro alumina types for use as a GIS heavy electric machine. As a filler type of epoxy composite, micro silica composites showed excellent AC breakdown strength properties compared to micro alumina composites in the case of electrical properties of micro silica and alumina. The electrical breakdown properties of micro silica composites increased with increasing filler content, whereas those of micro alumina decreased with increasing filler content. In the case of mechanical properties, the micro silica composite showed improved tensile strength and flexural strength compared with the micro alumina composite. In addition, mechanical properties such as tensile strength and flexural strength of micro silica and alumina composites decreased with increasing filler content. This is probably because O-H groups are present on the surface of silica in the case of micro silica but are not present on the surface of alumina in the case of micro alumina.

A molding-type power inductor is an inductor that uses a hybrid material that is prepared by mixing a ferrite metal powder coated with an insulating layer and an epoxy resin, which is injected into a coil-embedded mold and heated and cured. The fabrication of molding-type inductors requires various techniques such as for coil formation and insertion, improving the magnetic properties of soft magnetic metal powder, coating an insulating film on the magnetic powder surface, and increasing the packing density by well dispersing the powder in the epoxy resin. Among these aspects, researches on additives that can disperse the metal soft magnetic powder having the greatest performance in the epoxy resin with high charge have not been reported yet. In this study, we investigated the effect of silanes, KBM-303 and KBM-403, and a commercial dispersant on the dispersion of metal soft magnetic powders in epoxy resin. The sedimentation height and viscosity were measured, and it was confirmed that the silane KBM-303 was suitable for dispersion. For this silane, the packing density was as high as about 72.49%. Moreover, when 1.2 wt% of dispersant BYK-103 was added, the packing density was about 80.5%.

There is growing interest in power inductors in which metal soft magnetic powder and epoxy resin are combined. In this field, the process technology for increasing the packing density of magnetic particles in an injection molding process is very important. However, little research has been reported in this regard. In order to improve the packing density, we investigated and compared the sedimentation heights of pastes for three types of soft magnetic alloy powders as a function of the mixing ratios and the type of resin used. Experimental results showed that the packing density was the highest (71.74%) when the mixing ratio was 80：16：4 (Sendust：Fe-Si：CIP) according to the particle size using an SE-4125 resin. In addition, the packing density was found to be inversely related to the layer separation distance. As a result, it was confirmed that the dispersion of solid particles in the paste was important for curing; however, the duration of the curing process can greatly affect the packing density of the final composite.

In order to develop an electrical insulation material for gas GIS (insulation switch gear) spacer, 4 types of epoxy/micro-alumina (40, 50, 60, 70 wt%) composites and 9 types of epoxy/nano-alumina (1, 3, 5 g)/micro-alumina (40, 50, 60, 70 wt%) composites were prepared and tensile test was carried out. In here, nano-alumina was previously surface-treated with GDE (glycerol diglycidyl ether). As micro-alumina and GDE-treated nano-alumina contents increased, tensile strength increased and the highest value was shown in the system with 3 g GDE-treated nano-alumina.

The aim of this study is to improve of dielectric properties using epoxy/nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2 g). This paper deals with the effects of dielectric properties(□´ and tan δ) for epoxy/nano alumina contents (1,3 phr) and GDE addition (1,2 g)composites. 5 kinds specimen were prepared with containing epoxy resins, epoxy nano alumina composites. Average particle size of nano used were 30 nm. The nano alumina used were gamma phase particles of spherical shape. The suppression of epoxy chain motion by addition of nano alumina+GDE decreased dielectric loss and relative permittivity magnitude.

In this work, the complex permittivity of epoxy resins is measured. Epoxy resins, epoxy with micro size fillers and epoxy with micro+nano alumina composites have been evaluated for dielectric properties according to frequency variation. The dielectric spectroscopy measurement and analyses are carried out in the frequency range of 10^-2 Hz to 1MHz and constant to room temperature. The results of dielectric loss suggest that significant improvement in the electrical performance can be expected by using samples containing nano and micro fillers mixture when compared to materials containing only microfillers. As the result, we verified the specific characteristics of dielectric permittivity and dielectric loss namely, relative permittivity become low with improving dispersibility of nano+micro mixture composites and become rise with agglomerate of nano particles.

Some insulating materials are organized and analyzed with variables to obtain the optimized profile of encapsulated three phase of epoxy barrier which is applied to gas compartment and supporting conductors for high voltage GIS (gas insulated switchgear). The high voltage GIS is used in electrical power system and operating reliability. In this paper, optimization possibility of barrier shape including both electrical insulation performance and mechanical strength, premised on that condition minimizing volume and light weight should be kept for high voltage GIS, could be achieved by analysis simulation. As a result, filling material which is lower permittivity such as SiO2 instead of Al2O3 properly to the epoxy material, can be improved to increase the electrical insulation performance and mechanical strength for an optimized profile barrier of a high voltage GIS.

A gasoline engine automobile uses high voltage generation of the ignition coil, igniting and burning mixed fuel in the combustion chamber, which drives the engine. When the electronic control unit intermits a current supplied to the power transistor, counter electromotive force with a low voltage is generated by self induction action in the ignition primary coil and a high voltage is induced by mutual induction action with the primary ignition coil in the second ignition coil. The high voltage is supplied to the ignition plug in the combustion chamber, causing a spark, igniting the compressed mixed fuel. If a very small defect occurs inside the insulating material when a voltage is applied in said ignition coil, the performance of the insulation material will get worse and breakdown by a partial discharge of corona discharge. Thus, in this experiment, we are to contribute to improve the performance and ensure the reliability of the ignition coil by investigating partial discharge characteristics according to the change of voltage and temperature when a voltage is applied to the specimen of the epoxy molding ignition coil.

For the semiconductor device safety from over current in the digital electronic circuit systemmust be surely designed that it`s surface mount type micro fuse device. In this paper, We has analysedto the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To thechange of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusingtest in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25multiple over current) of micro fuse has been tested. According to the electrically character result,changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both endresistance changes. Also, because high thermal energy in the micro fuse test of over current wasoccurred to effect such as thermal runaway and explosion. Therefore, screen printing process in thedesign of micro fuse using thermosetting ink epoxy is very important for production quality improvement.

In order to develop a high voltage insulation material, spherical silicas with two average particle sizes of 5 μm and 20 μm were mixed in different mixing ratios (1:0, 0.7:0.3, 0.5:0.5, 0.3:0.7, 0:1) and their total filling content was fixed at 65 wt%. In order to observe the dispersion of the spherical silicas and the interfacial morphology between silica and epoxy matrix, field emission scanning electron microscope (FE-SEM) was used. The electrical insulation breakdown strength was estimated in sphere-plate electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of 5/20 μm and the thickness dependence of the breakdown strength was also observed. The tensile strength of the neat epoxy was 82.8 MPa as average value and its increased with decreasing particles size and that of epoxy/silica (2 μm) was 107 MPa, which was 130.8% higher value.

Reported here are results of the mechanical and electrical properties of both of intact and thermally degraded epoxy-coated copper busducts that are made by fluidized bed process. To elucidate and compare the properties mentioned above, electrical breakdown by thermal and water aging, v-t characteristic, bending test, impact test and cross cut test are carried out. Although the performance of electrical and mechanical properties are gradually decreased in increasing the severe conditions such as temperature, aging time, and so forth, sample C has a better performance in both mechanical and electrical properties.

In this paper, micro dried bio-potential electrodes are demonstrated for sEMG (surface ElectroMyoGraphic) signal measurement using conductive epoxy on the textile fabric. Micro dried hio-potential electrodes on the textile fabric substrate have several advantages over the conventional wetJdrv electrodes such as good feeling of wearing, possibility of extended-wearing due to the good ventilation. Also these electrodes on the textile fabric can easily apply to the curved skin surface. These electrodes are fabricated by the screen-printing process with the size of 1 mmxl0 mm and the resultant resistance of these electrodes have the average value of 0.4 Q. The conventional silver chloride electrode shows the average value of 0.3 . However, the electrode on the textile fabric are able to measure the sEMG signal without feeling of difference and this electrode shows the lower resistance of 1.03 &than conventional silver chloride electrode with 2.8 Q in the condition of the very sharp curve surface (the radius of curvature is 40 mm).

This paper presents a study on the dispersion effect of the X-Ray diffraction, glass transition and DIMA properties of organic modifier clay/epoxy nanocomposites produced in a homogenizer. Several experiments were conducted including different types of dispersion condition with varying processing conditions such as homogenizer rotor speed and applied time of homogenizer. The effects of these variables on the dispersion properties of nanocomposites were then studied. In order to fully understand the experimental results, a X-ray diffraction, DSC and DMA were used to investigate the effect of above mentioned variables on microstructure and intercalation/exfoliation of organic modifier clay/epoxy nanocomposites. The results from this work could be used to determine the best processing condition to obtain appropriate levels of d-spacing, glasss transition temperature and storage modulus in organic modifier clay/epoxy nanocomposites.

In order to develop electrical insulation materials, epoxy-nanosilica-microsilica mixture composites (ENMC) was synthesized, and mechanical properties such as their tensile and flexural strength, and AC insulation breakdown strength were investigated. Properties of mechanical strength and AC insulation breakdown strength are analyzed as scale and shape parameter with respect to weibull plot. Their tensile and flexural strength, AC insulation breakdown strength were compared original epoxy or EMC to ENMC. The 4 phr nano-silica addition and the 65 wt% micron-silica mixture composite (ENMC) was found to have the highest tensile and flexural strength. In the tensile strength was improved 29%, and flexural strength was improved 60.9% higher than those of the original epoxy. In the insulation breakdown strength, ENMC_4 phr was improved 17% and ENMC_5 phr was improved 15.8% higher than those of the EMC.

In order to application for high voltage heavy electric equipments, epoxy/microsilica 60 wt%/nano layered silicate composites (EMNC_60) and epoxy/microsilica 65 wt%/nano layered silicate composites (EMNC_65) respectively was synthesized by our electric field dispersion method and the result was obtained completely dispersion state. Thermal properties such as glass transition temperature (Tg) and thermal expansion coefficient, and DMA characteristics were studied, and mechanical properties such as tensile and flexural tests were performed. AC electrical insulation strength was also tested. The study on thermal property, EMNC_65 was better than EMNC_60 and mechanical ,electrical properties much improved EMNC_60 compared with EMNC_65.

The epoxy/micro-and nano-mixed silica composites (EMNC) systems were prepared and the AC insulation breakdown strength was evaluated. Glass transition temperature (Tg) and crosslink density were also measured by dynamic mechanical analyzer (DMA) in order to correlate them with the electrical and mechanical properties, and the effect of silane coupling agent on the electrical properties was also studied. Electrical properties and crosslink density of epoxy/micro-silica composite were noticeably improved by addition of nano-silica and silane coupling agent, and the highest breakdown strength was obtained by addition of 0.5～5phr of nano-silica and 2.5phr of silane coupling agent, and the highest tensile and flexural strength were obtained by addition of 2.5phr of nano-silica.

Lead-free piezoelectric ceramic/epoxy composites with ``0-3`` connectivity were prepared by cold-pressing with a temperature controlled curing method. A ceramic powder with a composition of (Na0.51K0.47Li0.02)(Nb0.8Ta0.2)O3 was synthesized by a conventional solid state reaction route. The dielectric and piezoelectric properties of ceramic/epoxy composites were characterized as a function of the volume fraction (φ) of piezoelectric ceramics, which was varied from 70 to 95vol%. The results indicated that the piezoelectric properties of composites were significantly affected by the volume fraction of ceramics. In terms of the piezoelectric properties, specimens showed the best performance at φ= 85vol%, resulting in the piezoelectric constant d33 of 39pC/N and the figure of merit as a piezoelectric energy harvester (d33·g33) of 1.24 pm2/N.