(La0.7Sr0.3)(Mn1-xFex)O3 (LSMFO) (x = 0.03, 0.06, 0.09, 0.12) precursor solution are prepared by sol-gel method. LSMFO thin films are fabricated by the spin-coating method on Pt/Ti/SiO2/Si substrate, and the sintering temperature and time are 800℃ and 1 hr, respectively. The average thickness of the 6-times coated LSMFO films is about 181 to 190 nm and average grain size is about 18 to 20 nm. As the amount of Fe added in the LSMFO thin film increased, the resistivity decreased, and the TCR and B25/65-value increased. Electrical resistivity, TCR and B25/65-value of the (La0.7Sr0.3)(Mn0.88Fe0.12)O3 thin film are 0.0136 mΩ-cm, 0.358%/℃, and 328 K at room temperature, respectively. The resistivity properties of LSMFO thin films matched well with Mott’s VRH model.

La_0.7Sr_0.3-xMg_xMnO₃ (LSMMO) (x=0.05~0.20) specimens are fabricated by a solid phase sintering method, and the sintering temperature and time are 1,300℃ and 2 hours, respectively. The dependence of the crystalline structure according to the amount of Mg²⁺ contents is not observed, and all specimens show a polycrystalline rhombohedral crystal structure, the X-ray diffraction (110) peaks move to the high angle side with increasing the amount of Mg²⁺ contents. LSMMO specimens exhibit a granule-shaped microstructure with an average grain size of 1 μm or less. Resistivity gradually decrease as the amount of Mg²⁺ contents increased. And in the La_0.7Sr_0.1Mg_0.2MnO₃ specimen, resistivity and B_25/65-value are 36.7 Ω-cm and 394 K at room temperature, respectively. LSMMO specimens show a variable-range hopping (VRH) electrical conduction mechanism, and the negative temperature of coefficient of resistance (NTCR) is approximately 0.37~0.38%/℃.

La_0.7Sr_0.3MnO₃ precursor solution were prepared by a sol-gel method. La_0.7Sr_0.3MnO₃ thin films were fabricated by a spin-coating method on a Pt/Ti/SiO₂/Si substrate. Structural and electrical properties with the variation of sintering temperature were measured. All specimens exhibited a polycrystalline orthorhombic crystal structure, and the average thickness of the specimens coated 6 times decreased from about 427 nm to 383 nm as the sintering temperature increased from 740℃ to 830℃. Electrical resistance decreased as the sintering temperature increased. In the La_0.7Sr_0.3MnO₃ thin films sintered at 830℃, electrical resistivity, TCR, B-value, and activation energy were 0.0374 mΩㆍcm, 0.316%/℃, 296 K and 0.023 eV, respectively.

(La_0.5Nd_0.2Sr_0.3)MnO₃ specimens were prepared by a solid-state reaction. In all specimens, X-ray diffraction patterns of an orthorhombic structure were shown. The fracture surfaces of (La_0.5Nd_0.2Sr_0.3)MnO₃ specimens showed a transgranular fracture pattern be possibly due to La ions (0.122 nm) as a perovskite A-site dopant substituting for Nd ions (0.115 nm) having a small ionic radius. The full-width at half maximum (FWHM) of the Mn 2p XPS spectra showed a value greater than that [8] of the single valence state, which is believed to be due to the overlapping of Mn²⁺, Mn³⁺, and Mn⁴⁺ ions. The dependence of Mn 2p spectra on the Mn³⁺/Mn⁴⁺ ratio according to sintering time was not observed. Electrical resistivity resulted in the minimum value of 100.7 Ω-cm for the specimen sintered for 9 hours. All specimens show a typical negative temperature coefficient of resistance (NTCR) characteristics. In the 9-hour sintered specimen, TCR, activation energy, and B25/65-value were -1.24%/℃, 0.19 eV, and 2,445 K, respectively.

As the demand for new and renewable energy increases due to the depletion of fossil fuels, solar power generation, a core energy source for new and renewable energy, requires research on solar modules for high output power generation. In this paper, the electrical characteristics of solar cell strip at the edge and in the center of single-crystal silicon having a semi-square shape were analyzed. The cell strip located in the center showed the efficiency increase by 0.26% compared to the cell strip at the edge of the solar cell. A shingled photovoltaic module was manufactured for each cell strip. As a result, the output power of the module using the cell strip located in the center was higher by 0.992%.

Pure BiFeO₃ (BFO) and (Eu, V) co-doped Bi_0.9Eu_0.1Fe_0.975V_0.025O_3+δ (BEFVO) thin films were deposited on Pt(111)/Ti/SiO₂/Si(100) substrates by chemical solution deposition. The effects of co-doping were observed by X-ray diffraction, Raman spectroscopy, and scanning electron microscopy (SEM). The electrical properties of the BEFVO thin film were improved as compared to those of the pure BFO thin film. The remnant polarization (2P_r) of the BEFVO thin film was approximately 26 μC/cm² at a maximum electric field of 1,190 kV/cm with a frequency of 1 kHz. The leakage current density of the co-doped BEFVO thin film (4.81×10^-5 A/cm² at 100 kV/cm) was two orders of magnitude lower than of that of the pure BFO thin film.

Pure BiFeO₃ (BFO) and codoped Bi_0.9A_0.1Fe_0.975Zn_0.025O_3-δ (A=Eu, Dy) thin films were prepared on Pt(111)/ Ti/SiO₂/Si(100) substrates by chemical solution deposition. The remnant polarizations (2Pr) of the Bi_0.9Eu_0.1Fe_0.975Zn_0.025O_3-δ (BEFZO) and Bi_0.9Dy_0.1Fe_0.975Zn_0.025O_3-δ (BDFZO) thin films were about 36 and 26 μC/cm² at the maximum electric fields of 900 and 917 kV/cm, respectively, at 1 kHz. The codoped BEFZO and BDFZO thin films showed improved electrical properties, and leakage current densities of 3.68 and 1.21×10^-6 A/cm², respectively, which were three orders of magnitude lower than that of the pure BFO film, at 100 kV/cm.

This study analyzed the change of electrical characteristics of a photocoupler when a narrow-band electromagnetic wave was combined with the photocoupler. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The EUT was Photocoupler (6N139) and the input signal was divided into two types: a square pulse and the second signal is 0 V. The malfunction of the photocoupler was confirmed by monitoring the variation in the output voltage of the photocoupler. As a result of the experiment, changes in the malfunctioning was observed as the electric field was increased. There are three types of malfunction modes: delay, output voltage off, and fluctuation. Bit errors were analyzed to verify the electrical characteristics of the photocoupler by narrow-band electromagnetic waves. The result of this study can be used as basic data for the effect analysis of photocoupler protection and impact analysis of high-power electromagnetic waves.

We have evaluated the ferroelectric and electrical properties of pure BiFeO₃ (BFO) and Bi_0.9A_0.1Fe_0.975V_0.025O_3+α(A=Nd, Tb) thin films on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method. The remnant polarization (2P_r) of the Bi_0.9Tb_0.1Fe_0.975V_0.025O_3+α (BTFVO) thin film was approximately 65 μC/㎠, with a maximum applied electric field of 950 kV/cm and a frequency of 10 kHz, where as that of the Bi_0.9Nd_0.1Fe_0.975V_0.025O_3+α (BNFVO) thin film was approximately 37 μC/㎠ with a maximum applied electric field of 910 kV/cm. The leakage current density of the co-doped BNFVO thin film was four orders of magnitude lower than that of the pure BFO thin film, at 2.75×10^-7 A/㎠ with an applied electric field of 100 kV/cm. The grain size and uniformity of the co-doped BNFVO and BTFVO thin films were improved, in comparison to the pure BFO thin film, through structural modificationsdue to the co-doping with Nd and Tb.

The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were 8.57 MΩ (Vcc-GND), 14.14 MΩ (Vcc-Input1), 18.24 MΩ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as 2.5 Ω, 50 MΩ, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

A soft baking process was used to enhance the electrical characteristics of solution-processed indium-zincoxide (IZO) thin-film transistors (TFTs). We demonstrate a stable soft baking process using a hot plate in air to maintain the electrical stability and improve the electrical performance of IZO TFTs. These oxide transistors exhibited good electrical performance; a field-effect mobility of 7.9 cm²/Vs, threshold voltage of 1.4 V, sub-threshold slope of 0.5 V/dec, and a current on/off ratio of 2.9×10⁷ were measured. To investigate the static response of our solutionprocessed IZO TFTs, simple resistor load type inverters were fabricated by connecting a resistor (5 or 10 MΩ). Our IZO TFTs, which were manufactured using the soft baking process at a baking temperature of 120℃, performed well at the operating voltage, and are therefore a good candidate for use in advanced logic circuits and transparent display backplanes.

We investigated the effect of different thin-film thicknesses (25, 30, and 40 nm) on the electrical performance of solution-processed indium-zinc-oxide (IZO) thin-film transistors (TFTs). The structural properties of the IZO thin films were investigated by atomic force microscopy (AFM). AFM images revealed that the IZO thin films with thicknesses of 25 and 40 nm exhibit an uneven distribution of grains, which deforms the thin film and degrades the performance of the IZO TFT. Further, the IZO thin film with a thickness of 30 nm exhibits a homogeneous and smooth surface with a low RMS roughness of 1.88 nm. The IZO TFTs with the 30-nm-thick IZO film exhibit excellent results, with a field-effect mobility of 3.0(±0.2) cm²/Vs, high Ion/Ioff ratio of 1.1×10⁷, threshold voltage of 0.4(±0.1) V, and subthreshold swing of 0.7(±0.01) V/dec. The optimization of oxide semiconductor thickness through analysis of the surface morphologies can thus contribute to the development of oxide TFT manufacturing technology.

We investigated the rewritable operation of a non-volatile memory device composed of Al (top)/TiO₂/ indium-zinc-oxide (IZO)/Al (bottom). The oxygen-deficient IZO layer of the device was spin-coated with 0.1 M indium nitrate hydrate and 0.1 M zinc acetate dehydrate as precursor solutions, and the TiO₂ layer was fabricated by atomic layer deposition. The oxygen vacancies IZO layer of an active component annealed at 400℃ using thermal annealing and it was proven to be in oxygen vacancies and oxygen binding environments with OH species and heavy metal ions investigated by X-ray photoelectron spectroscopy. The device, which operates at low voltages (less than 3.5 V), exhibits non-volatile memory behavior consistent with resistive-switching properties and an ON/OFF ratio of approximately 3.6×10³ at 2.5 V.

In this study, ZnxMn_3-xO₄ (x=0.95~1.20) specimens were prepared by using a conventional mixed oxide method. All specimens were sintered in air at 1,200℃ for 12 h and cooled at a rate of 2℃/min to 800℃, subsequently quenching to room temperature. We investigated the structural and electrical properties of Zn_xMn_3-xO₄ specimens with variation of ZnO amount for the application of NTC thermistors. As results of X-ray diffraction patterns, all specimens showed the formation of a complete solid solution with tetragonal spinel phase. And, the second phase was observed by the solubility limit of Zn ions in x≥1.10 composition. The average grain size was increased from 2.72 μm to 4.18 μm with increasing the compositional ratio of Zn ion from x=0.95 to 1.20, respectively. Zn_1.10 Mn_1.90 O₄ specimen showed the minimum electrical resistance of 57.5 kΩ at room temperature and activation energy of 0.392 eV.

Bi0.5+x(Na0.78K0.22)0.5-3xTiO3 ceramics with an excess Bi3+ and a deficiency of Na+ and K+ were synthesized by a conventional solid state reaction method. The structure and morphology ofBi0.5+x(Na0.78K0.22)0.5-3xTiO3 ceramics were characterized by X-ray diffraction and field emission scanning electron microscopy. The electric polarization and mechanical strain induced by external electric field, and the temperature dependence of dielectric constant were investigated. These results demonstrated that anergodic relax or phase can be induced by controls of the mole ratio of Bi3+, Na+ and K+. A phase boundary between non-ergodic and ergodic relaxor phases can be observed at ambient temperature. Theergodic relaxor phase can be transferred to the ferroelectric phase by application of the electric field. The stability of the induced ferroelectric phases strongly depends on the mole ratio of Bi3+, Na+ and K+. The maximum strain of 0.31% was observed in Bi0.51(Na0.78K0.22)0.47TiO3 ceramics sintered at 1,150℃ for 2 h.

A New Ag-pastes were developed for integrating the high efficiency mono-Si solar cell. The pastes were the mixture of 84 wt% Ag, 2 wt% glass frit, 11 wt% solvent of buthyl cabitol acetate, and 3 wt% additives. After fabricating the Ag-pastes by using a 3-roll mill, they were coated on a SiN_x/n+/p- stacks of a commercial mono-Si solar cell. And the post-thermal process was also optimized by varying the process conditions of peak temperature. The optimized solar cell efficiency on a 6-inch mono-Si wafer was 18.28%, which was the one of the world best performances. It meaned that the newly developed Aa-paste could be adopted to fabricate a commercial bulk Si solar cell.

In this study we aims to examine the co-doping effects of 1/3 mol% Mn3O4+Co3O4 (1:1) on the reaction, microstructure, and electrical properties such as the bulk defects and grain boundary properties of ZnO-Bi2O3-Sb2O3 (ZBS; Sb/Bi=0.5, 1.0, and 2.0) varistors. The sintering and electrical properties of Mn,Co-doped ZBS, ZBS(MCo) varistors were controlled by Sb/Bi ratio. Pyrochlore (Zn2Bi3Sb3O14) was decomposed and promoted densification at lower temperature on heating in Sb/Bi=1.0 by Mn rather than Co. Pyrochlore on cooling was reproduced in all systems however, spinel (α- or β-polymorph) did not formed in Sb/Bi=0.5. More homogeneous microstructure was obtained in Sb/Bi≥1.0. In ZBS(MCo), the varistor characteristics were improved drastically (non-linear coefficient, α=30∼49), and seemed to form (0.17 eV) and (0.33 eV) as dominant defects. From impedance and modulus spectroscopy (IS & MS), the grain boundaries have divided into two types, i.e. the one is tentatively assign to ZnO/Bi2O3(Mn,Co)/ZnO (0.47 eV) and the other ZnO/ZnO (0.80∼0.89 eV) homojunctions.

An LED (light emitting diode) has the advantages of lower power consumption, energy saving, high efficiency, long lifetime, and environmental friendliness so that it has been getting the spotlight as a next-generation light source. Thus, the application range of an LED has been extended to various fields including indoor and outdoor lighting, Recently, the high efficient LED lighting has been developed, an LED has been extended its market rapidly every year and is expected to replace the general light source within near future, In this study were measured electrical and optical properties for 6 types of LED bulbs which are being developed to replace the general incandescent lamps, and were analysed under the standard of the omnidirectional lamp required by the Energy Star.

In this study we aims to evaluate the effects of 1/3 mol% Co3O4 addition on the reaction, microstructure development, resultant electrical properties, and especially the bulk trap and grain boundary properties of ZnO-Bi2O3-Sb2O3 (Sb/Bi=2.0, 1.0, and 0.5) system (ZBS). The samples were prepared by conventional ceramic process, and characterized by XRD, density, SEM, I-V, impedance and modulus spectroscopy (IS & MS) measurement. In addition of Co3O4 in ZnO-Bi2O3-Sb2O3 (ZBSCo), the phase development, density, and microstructure were controlled by Sb/Bi ratio. Pyrochlore on cooling was reproduced in all systems. The more homogeneous microstructure was obtained in ZBSCo (Sb/Bi=1.0) system. In ZBSCo, the varistor characteristics were improved drastically (non-linear coefficient α=23∼50) compared to ZBS. Doping of Co3O4 to ZBS seemed to form V*o (0.33 eV) as dominant defect. From IS & MS, especially the grain boundary of Sb/Bi=0.5 system is composed of electrically single barrier (0.93 eV) and somewhat sensitive to ambient oxygen with temperature.

The sintering, defect and grain boundary characteristics of Bi-based ZnO chip varistor (1,608 mm size) have been investigated to know the possibility of lowering a manufacturing price by using 100 % Ag inner-electrode. The samples were prepared by general multilayer chip varistor process and characterized by shrinkage, SEM, current-voltage (I-V), admittance spectroscopy (AS), impedance and modulus spectroscopy (IS & MS) measurement. There are no problems to make a chip varistor with 100% Ag inner-electrode in the sintering temperature range of 850∼900℃ for 1 h in air. A good varistor characteristics (Vn= 9.3∼15.4 V, a= 23∼24, IL= 1.0∼1.6 μA) were revealed but formed Zn(i)·· (0.209 eV) as dominant defect, and increased the distributional inhomogeneity and the temperature instability in grain boundary barriers.

Two kind of Ag-pastes were prepared for integrating the bulk Si solar cell. One is the Ag-paste with Pb-based glass frit and the other is that with Bi-based glass frit. The pastes were the mixture of 84 wt% Ag, 2 wt% glass frit, 11 wt% solvent of buthyl cabitol acetate, and 2 wt% additives. After fabricating the Ag-pastes, they was coated on a SiN(x)/n+/p- stacks of a commercial mono-Si solar cell. The solar cell efficiency was 17.6% in the case of the Pb-based Ag-paste. However that was 16.2% in the solar cell integrated with the Bi-based Ag-paste. The lower performance in Bi-based Ag-paste was caused by the higher series resistance and the lower shunt resistance in comparison with the Pb-based Ag-paste.

In this study we aims to examine the effects of 0.5 mol% Cr2O3 addition on the reaction, microstructure development, resultant electrical properties, and especially the bulk trap and interface state levels of ZnO-Bi2O3-Sb2O3 (Sb/Bi=0.5, 1.0, and 2.0) systems (ZBS). The samples were prepared by conventional ceramic process, and characterized by XRD, density, SEM, I-V, impedance and modulus spectroscopy (IS & MS) measurement. The sintering and electrical properties of Cr-doped ZBS (ZBSCr) systems were controlled by Sb/Bi ratio. Pyrochlore (Zn2Bi3Sb3O14) was decomposed more than 100℃ lowered on heating in ZBS (Sb/Bi=1.0) by Cr doping. The densification of ZBSCr (Sb/Bi=0.5) system was retarded to 800℃ by unknown Bi-rich phase produced at 700℃. Pyrochlore on cooling was reproduced in all systems. And Zn7Sb2O12 spinel (α-polymorph) and δ-Bi(2)O(3) phase were formed by Cr doping. In ZBSCr, the varistor characteristics were not improved drastically (non-linear coefficient α=7~12) and independent on microstructure according to Sb/Bi ratio. Doping of Cr2O3 to ZBS seemed to form Zn(i) (0.16 eV) and Vo (0.33 eV) as dominant defects. From IS & MS, especially the grain boundaries of Sb/Bi=0.5 systems were divided into two types, i.e. sensitive to oxygen and thus electrically active one (1.1 eV) and electrically inactive intergranular one (0.95 eV) with temperature.

Forest fire can cause a serious damage to overhead conductors. Therefore, detailed investigation on the changes of mechanical and electrical properties of damaged conductors should be carried out to understand the effect of forest fires on conductors. This is of critical importance in maintaining transmission line safely. This paper examines the changes of mechanical and electrical properties of flame exposed conductor. Tensile strength (TS) decreased according to increase of forest fire temperature and conductivity changed according to forest fire temperature. Specimens were aluminum conductors of aluminium conductor steel reinforced (ACSR) 410, 240, 480 ㎟. In this paper, the electrical and mechanical characteristics of forest fires exposed overhead conductors depending on the diameter of aluminum conductors are presented. It was possible to estimate the degree of deterioration caused by forest fires. The detailed results are given in the paper.