Humidity monitoring of exhaled breath has emerged as a vital approach for noninvasive respiratory health assessment, underscoring the need for sensitive and reliable humidity sensors. Despite its high conductivity and hydrophilic functional groups, reduced graphene oxide (rGO) often undergoes irreversible moisture adsorption and gradual oxidation by residual water, resulting in sensitivity degradation and long-term instability during cycling. In this study, a montmorillonite/reduced graphene oxide (MMT/rGO) composite is developed as a room-temperature humidity-sensing material, exhibiting an optimized response of 115%, more than 14 times higher than that of pristine rGO. This superior performance originates from the synergistic interaction between the reversible MMT swelling and the conductive rGO network near the electrical percolation transition, which ensures excellent stability and repeatability under repeated humidity cycles. These findings suggest that the MMT/rGO composite provides a cost-effective and biocompatible platform for next-generation wearable humidity sensors capable of continuous respiratory monitoring.

Conductive inks are essential for developing flexible and wearable electronic devices, where printability and electrical performance must be finely balanced. However, achieving high conductivity while minimizing costly silver filler content remains a key challenge in ink formulation. In this work, we demonstrate that a simple ball-milling process transforms spherical silver particles into platelet-shaped fillers, dramatically enhancing conductivity at equivalent filler loading. The resulting inks show a reduction in sheet resistance from ~180 Ω/□ to ~ 0.57 Ω/□ at 70 wt% filler content, with improved performance attributed to surface-to-surface contact between platelets. Moreover, we show that filler content influences not only electrical conductivity but also ink viscosity, with the 53.8 wt% formulation achieving a practical balance between conductivity, processability, and cost. This morphology- and composition-controlled ink design offers a scalable strategy for manufacturing high-performance, cost-effective conductive inks suitable for next-generation printed electronics.

The growing demand for miniaturized, lightweight, and sustainable electronic devices has intensified the need for advanced bonding materials. Existing electrically conductive adhesives (ECAs) often rely on high silver (Ag) content, resulting in elevated costs and environmental concerns. This study successfully developed a novel ECA with significantly reduced Ag content without compromising essential electrical conductivity and adhesion performance. Experimental results revealed that the optimized ECA demonstrates electrical conductivity comparable to that of commercial products, with notable advantages in cost reduction and eco-friendliness. These advancements position the developed ECA as a promising solution for next-generation electronic manufacturing, contributing to low-carbon technologies and sustainable practices. Future applications could further broaden its use across diverse electronic systems, driving progress in environmentally conscious technologies.

In this study, the electrical properties of zinc oxide (ZnO) thin-film transistors (TFTs) based on oxide semiconductors were analyzed. As interest in next-generation transparent and flexible displays grows, ZnO, which offers high field-effect mobility and transparency, has emerged as a promising material to overcome the limitations of amorphous silicon (a-Si)-based TFTs. ZnO has a wide bandgap and optical transparency and can be deposited on various substrates at low temperatures, making it a suitable channel material for future display devices. In this study, ZnO TFTs were fabricated with an inverted staggered structure using a p⁺⁺ Si wafer coated with SiO₂ as the substrate. The ZnO channel layer was deposited by RF magnetron sputtering, and the ITO source/drain electrodes were formed using an e-beam evaporator. The electrical characteristics was evaluated using Keithley 4200A-SCS parameter analyzer. Mobility, On/Off ratio, and subthreshold swing (SS) were calculated from the measurements.

(La0.7Sr0.3)(Mn1-xFex)O3 (LSMFO) (x = 0.03, 0.06, 0.09, 0.12) precursor solution are prepared by sol-gel method. LSMFO thin films are fabricated by the spin-coating method on Pt/Ti/SiO2/Si substrate, and the sintering temperature and time are 800℃ and 1 hr, respectively. The average thickness of the 6-times coated LSMFO films is about 181 to 190 nm and average grain size is about 18 to 20 nm. As the amount of Fe added in the LSMFO thin film increased, the resistivity decreased, and the TCR and B25/65-value increased. Electrical resistivity, TCR and B25/65-value of the (La0.7Sr0.3)(Mn0.88Fe0.12)O3 thin film are 0.0136 mΩ-cm, 0.358%/℃, and 328 K at room temperature, respectively. The resistivity properties of LSMFO thin films matched well with Mott’s VRH model.

Recently, as interest in personal hygiene has increased due to the community spread of COVID-19 and variant viruses, fixed and potable UV germicidal equipment to sterilize indoor spaces and hand-held UV germicidal equipment to sterilize household items such as masks and mobile phones are continuously being developed and sold. However, the development and sales of the product are difficult because appropriate testing methods have not yet been established. In this situation, if an uncertified product is distributed in the market, it can cause serious harm to consumers. In this study, we investigate the photobiological risks and safety devices against UV exposure of UV germicidal equipment distributed domestically, and propose appropriate test methods for portable UV germicidal equipment based on the research results.

Carbon black with high purity and excellent conductivity is used as a conductive filler in the semiconductive compound for EHV (Extra High Voltage) power cables of 345 kV or higher. When carbon black and CNT (carbon nanotube) are applied together as a conductive filler of a semiconductive compound, stable electrical properties of the semiconductive compound can be maintained even though the amount of conductive filler is significantly reduced. In EHV power cables, since the semi-conductive layer is close to the conductor, stable electrical characteristics are required even under high-temperature conditions caused by heat generated from the conductor. In this study, the theoretical principle that a semiconductive compound applied with carbon black and CNT can maintain excellent electrical properties even under high-temperature conditions was studied. Basically, the conductive fillers dispersed in the matrix form an electrical network. The base polymer and the matrix of the composite, expands by heat under high temperature conditions. Because of this, the electrical network connected by the conductive fillers is weakened. In particular, since the conductive filler has high thermal conductivity, the semiconductive compound causes more thermal expansion. Therefore, the effect of CNT as a conductive filler on the thermal conductivity, thermal expansion coefficient, and volume resistivity of the semiconductive compound was studied. From this result, thermal expansion and composition of the electrical network under high temperature conditions are explained.

With the purpose of instilling an awareness of the safety of users of electrical equipment and inducing voluntary facility improvement through the safety rating system for general low voltage electrical equipment, simulation and field application of the safety rating of general low voltage electrical equipment were conducted. For the introduction and application of the safety rating system for general low-voltage electrical equipment, data related to domestic safety was investigated and analyzed, cases of introduction in other fields were reviewed, and for design, the 4M risk assessment method of the Korea Occupational Safety and Health Agency and the cases of safety index development in Korea were analyzed and standardized. Safety rating system simulations were conducted for general low-voltage electrical equipment, and problem improvement measures were prepared by analyzing the results through on-site verification and simulation applied to the initial design. Design standards for the introduction of the safety rating system for general low-voltage electrical equipment were prepared, and 394 youth training facilities were applied to the field to see if the design standards were practically applicable to the field. With the application of the safety rating system for low-voltage electrical equipment for general use, youth training facilities that had been classified as ‘appropriate’ were able to induce an upgrade to a higher level through voluntary facility improvement according to the application of grades (A to E). As a result of inducing voluntary repair projects based on the results of the 1st and 2nd inspection of youth training facilities, it was confirmed that 86 facilities received grade A, 225 facilities received grade B, and only 311 facilities received grade A to B out of a total of 394 facilities, and there was no grade E.

The utilization of scanning transmission electron microscopy (STEM) in conjunction with cathodoluminescence (CL) has emerged as a valuable tool for the investigation of material optical properties. In recent years, this technique has facilitated significant advancements in the fields of plasmonics and quantum emitters by surpassing prior technical restrictions. The review commences by providing an outline of the diverse STEM-CL operating modes and technical aspects of the instrumentation. The review explains the fundamental physics of light production under electron beam irradiation and the physical basis for interpreting STEM-CL experiments for different types of excitations. Additionally, the review compares STEM-CL to other related techniques such as scanning electron microscope CL, photoluminescence, and electron energy-loss spectroscopy.

La_0.7Sr_0.3-xMg_xMnO₃ (LSMMO) (x=0.05~0.20) specimens are fabricated by a solid phase sintering method, and the sintering temperature and time are 1,300℃ and 2 hours, respectively. The dependence of the crystalline structure according to the amount of Mg²⁺ contents is not observed, and all specimens show a polycrystalline rhombohedral crystal structure, the X-ray diffraction (110) peaks move to the high angle side with increasing the amount of Mg²⁺ contents. LSMMO specimens exhibit a granule-shaped microstructure with an average grain size of 1 μm or less. Resistivity gradually decrease as the amount of Mg²⁺ contents increased. And in the La_0.7Sr_0.1Mg_0.2MnO₃ specimen, resistivity and B_25/65-value are 36.7 Ω-cm and 394 K at room temperature, respectively. LSMMO specimens show a variable-range hopping (VRH) electrical conduction mechanism, and the negative temperature of coefficient of resistance (NTCR) is approximately 0.37~0.38%/℃.

La_0.7Sr_0.3MnO₃ precursor solution were prepared by a sol-gel method. La_0.7Sr_0.3MnO₃ thin films were fabricated by a spin-coating method on a Pt/Ti/SiO₂/Si substrate. Structural and electrical properties with the variation of sintering temperature were measured. All specimens exhibited a polycrystalline orthorhombic crystal structure, and the average thickness of the specimens coated 6 times decreased from about 427 nm to 383 nm as the sintering temperature increased from 740℃ to 830℃. Electrical resistance decreased as the sintering temperature increased. In the La_0.7Sr_0.3MnO₃ thin films sintered at 830℃, electrical resistivity, TCR, B-value, and activation energy were 0.0374 mΩㆍcm, 0.316%/℃, 296 K and 0.023 eV, respectively.

Defects in solids play a vital role on thermoelectric properties through the direct impacts of electronic band structure and electron/phonon transports, which can improve the electronic and thermal properties of a given thermoelectric semiconductor. Defects in semiconductors can be divided into four different types depending on their geometric dimensions, and thus understanding the effects on thermoelectric properties of each type is of a vital importance. This paper reviews the recent advances in the various thermoelectric semiconductors through defect engineering focusing on the charge carrier and phonon behaviors. First, we clarify and summarize each type of defects in thermoelectric semiconductors. Then, we review the recent achievements in thermoelectric properties by applying defect engineering when introducing defects into semiconductor lattices. This paper ends with a brief discussion on the challenges and future directions of defect engineering in the thermoelectric field.

(La_0.5Nd_0.2Sr_0.3)MnO₃ specimens were prepared by a solid-state reaction. In all specimens, X-ray diffraction patterns of an orthorhombic structure were shown. The fracture surfaces of (La_0.5Nd_0.2Sr_0.3)MnO₃ specimens showed a transgranular fracture pattern be possibly due to La ions (0.122 nm) as a perovskite A-site dopant substituting for Nd ions (0.115 nm) having a small ionic radius. The full-width at half maximum (FWHM) of the Mn 2p XPS spectra showed a value greater than that [8] of the single valence state, which is believed to be due to the overlapping of Mn²⁺, Mn³⁺, and Mn⁴⁺ ions. The dependence of Mn 2p spectra on the Mn³⁺/Mn⁴⁺ ratio according to sintering time was not observed. Electrical resistivity resulted in the minimum value of 100.7 Ω-cm for the specimen sintered for 9 hours. All specimens show a typical negative temperature coefficient of resistance (NTCR) characteristics. In the 9-hour sintered specimen, TCR, activation energy, and B25/65-value were -1.24%/℃, 0.19 eV, and 2,445 K, respectively.

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

As the demand for new and renewable energy increases due to the depletion of fossil fuels, solar power generation, a core energy source for new and renewable energy, requires research on solar modules for high output power generation. In this paper, the electrical characteristics of solar cell strip at the edge and in the center of single-crystal silicon having a semi-square shape were analyzed. The cell strip located in the center showed the efficiency increase by 0.26% compared to the cell strip at the edge of the solar cell. A shingled photovoltaic module was manufactured for each cell strip. As a result, the output power of the module using the cell strip located in the center was higher by 0.992%.

The Ti₃SiC₂ MAX phase was synthesized by arc-melting process under three different processing times. We confirmed that the reaction between the TiCX phase and Ti-Si liquid phase is important for the synthesis of the Ti₃SiC₂ MAX phase. Results suggest that the Ti₃SiC₂ MAX phase decomposed when the arc-melting time was greater than 80s. Herein, we aim to determine the detailed parameters for the reported arc-melting process, which can provide useful insights on the synthesis of the Ti₃SiC₂ MAX phase by arc-melting process. Furthermore, we compared the electrical characteristics and densities of the three samples.

We investigated the effect of a post-annealing process using ultraviolet (UV) light on the electrical properties of solution-processed InZnO (IZO) thin-film transistors (TFTs). UV light was irradiated on IZO TFTs for different time periods of 0s, 30s, and 90s. We measured transfer and retention stability curves to evaluate the performance of the fabricated TFTs. In addition, we measured height, amplitude, and phase AFM images to analyze changes in the surface and morphology of the devices. AFM measurements were performed by setting the drive amplitude of the cantilever tip to 47.9 mV in tapping mode, then dividing the device surface into 500 nm × 500 nm. In the case of IZO TFT irradiated with UV for 30s, the electron mobility and Ion/Ioff ratio were improved, the threshold voltage was reduced by approximately 2 V, and the subthreshold swing also decreased form 1.34 V/dec to 1.11 V/dec.

Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.

In this study, the volume resistivity of XLPE materials with various voltage ratings was discussed. The volume resistivity of the developed XPLE nanocomposite was measured, and the conductivity mechanism of the material was also examined. The ASTM D 257 and IEC 60093 measurement methods were used for these tests. The equipment was designed to measure up to a temperature of 200℃, and the electrode structure was designed to maintain the thickness and temperature uniformity of the sample. The conductivity of the sample decreased with temperature, and the samples reached saturation within 500s, after which the conductivity leveled off. By analyzing the current density and the electric field, we can well explain the electric conductivity behavior of our sample with the Schottky mechanism.

Pure BiFeO₃ (BFO) and (Eu, V) co-doped Bi_0.9Eu_0.1Fe_0.975V_0.025O_3+δ (BEFVO) thin films were deposited on Pt(111)/Ti/SiO₂/Si(100) substrates by chemical solution deposition. The effects of co-doping were observed by X-ray diffraction, Raman spectroscopy, and scanning electron microscopy (SEM). The electrical properties of the BEFVO thin film were improved as compared to those of the pure BFO thin film. The remnant polarization (2P_r) of the BEFVO thin film was approximately 26 μC/cm² at a maximum electric field of 1,190 kV/cm with a frequency of 1 kHz. The leakage current density of the co-doped BEFVO thin film (4.81×10^-5 A/cm² at 100 kV/cm) was two orders of magnitude lower than of that of the pure BFO thin film.

Most series arcs lead to electrical fires that cannot be interrupted by circuit breakers, because the arc’s current is outside the breaker’s operating range. In this paper, experiments were conducted on the detection and identification of series arcs to prevent electrical fires. Plugs and outlets specified in KS C 8305 were deteriorated to replicate arc faults commonly found in fields. The characteristics of series arcs resulting from various types of loose connections were determined by analyzing the frequency spectra and phase distributions of detected arc pulses. The results showed that the simulated arc defects used in this study were more similar to actual arc phenomena than the existing arc generator specified in UL 1699. In addition, loose connections, such as wire-wire, terminal-wire, and outlet-plug, can be identified by phases of 0°, 180° and 360°, respectively. These phases can be detected by a band pass filter with a frequency range of 5~10 MHz, which can be used as the trip signal for circuit breakers.

This study introduces a new investigation report on the microstructural and electrical property changes of ZnO-Zn₂BiVO₆-Mn₃O₄ (ZZMn), where 0.33 mol% of Mn₃O₄ and 0.5 mol% of Zn₂BiVO₆ were added to ZnO (99.17 mol%) as liquid phase sintering aids. Zn₂BiVO₆ contributes to the decrease of sintering temperatures by up to 800℃, and segregates its particles at the grain boundary, while Mn₃O₄ enhances α, the nonlinear coefficient, of varistor properties up to α＝62. In comparison, when the sintering temperature is increased from 800℃ to 1,000℃, the resistivity of ZnO grains decreases from 0.34 Ωcm to 0.16 Ωcm, and the varistor property degrades. Oxygen vacancy (V_o^·) (P1, 0.33~0.36 eV) is formed as a dominant defect. Two different kinds of grain boundary activation energies of P2 (0.51~0.70 eV) and P3 (0.70~0.93 eV) are formed according to different sintering temperatures, which are tentatively attributed to be ZnO/Zn₂BiVO₆-rich interface and ZnO/ZnO interface, respectively. Accordingly, this study introduces a progressive method of manufacturing ZnO chip varistors by way of sintering ZZMn-based varistor under 900℃. However, to procure a higher reliability, an in-depth study on the multi-component varistors with double-layer grain boundaries should be executed.

Pure BiFeO₃ (BFO) and codoped Bi_0.9A_0.1Fe_0.975Zn_0.025O_3-δ (A=Eu, Dy) thin films were prepared on Pt(111)/ Ti/SiO₂/Si(100) substrates by chemical solution deposition. The remnant polarizations (2Pr) of the Bi_0.9Eu_0.1Fe_0.975Zn_0.025O_3-δ (BEFZO) and Bi_0.9Dy_0.1Fe_0.975Zn_0.025O_3-δ (BDFZO) thin films were about 36 and 26 μC/cm² at the maximum electric fields of 900 and 917 kV/cm, respectively, at 1 kHz. The codoped BEFZO and BDFZO thin films showed improved electrical properties, and leakage current densities of 3.68 and 1.21×10^-6 A/cm², respectively, which were three orders of magnitude lower than that of the pure BFO film, at 100 kV/cm.

This study analyzed the change of electrical characteristics of a photocoupler when a narrow-band electromagnetic wave was combined with the photocoupler. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The EUT was Photocoupler (6N139) and the input signal was divided into two types: a square pulse and the second signal is 0 V. The malfunction of the photocoupler was confirmed by monitoring the variation in the output voltage of the photocoupler. As a result of the experiment, changes in the malfunctioning was observed as the electric field was increased. There are three types of malfunction modes: delay, output voltage off, and fluctuation. Bit errors were analyzed to verify the electrical characteristics of the photocoupler by narrow-band electromagnetic waves. The result of this study can be used as basic data for the effect analysis of photocoupler protection and impact analysis of high-power electromagnetic waves.

Electrical behaviors of plasma-sprayed Al₂O₃-TiO₂ coatings have been investigated in terms of their TiO₂ content. On increasing the TiO₂ content from 6 to 30 wt%, the DC electrical conductivity increased by several orders of magnitude. From impedance spectroscopy analysis, the total conductivity of the grains and grain boundaries and their respective activation energies were determined without the electrode effects that could impede ionic transfer. An electron transference number was also estimated, ranging between 6.5% and 7.3% for 13 wt% TiO₂ and between 0.4% and 0.7% for 30 wt% TiO₂ in the coating. Because of the high electronic contribution to the total conductivity, the Al₂O₃-TiO₂ coating could be a new candidate material to obtain superior electrical conductivity as well as corrosion and wear resistances.

We have evaluated the ferroelectric and electrical properties of pure BiFeO₃ (BFO) and Bi_0.9A_0.1Fe_0.975V_0.025O_3+α(A=Nd, Tb) thin films on Pt(111)/Ti/SiO₂/Si(100) substrates by using a chemical solution deposition method. The remnant polarization (2P_r) of the Bi_0.9Tb_0.1Fe_0.975V_0.025O_3+α (BTFVO) thin film was approximately 65 μC/㎠, with a maximum applied electric field of 950 kV/cm and a frequency of 10 kHz, where as that of the Bi_0.9Nd_0.1Fe_0.975V_0.025O_3+α (BNFVO) thin film was approximately 37 μC/㎠ with a maximum applied electric field of 910 kV/cm. The leakage current density of the co-doped BNFVO thin film was four orders of magnitude lower than that of the pure BFO thin film, at 2.75×10^-7 A/㎠ with an applied electric field of 100 kV/cm. The grain size and uniformity of the co-doped BNFVO and BTFVO thin films were improved, in comparison to the pure BFO thin film, through structural modificationsdue to the co-doping with Nd and Tb.

A soft baking process was used to enhance the electrical characteristics of solution-processed indium-zincoxide (IZO) thin-film transistors (TFTs). We demonstrate a stable soft baking process using a hot plate in air to maintain the electrical stability and improve the electrical performance of IZO TFTs. These oxide transistors exhibited good electrical performance; a field-effect mobility of 7.9 cm²/Vs, threshold voltage of 1.4 V, sub-threshold slope of 0.5 V/dec, and a current on/off ratio of 2.9×10⁷ were measured. To investigate the static response of our solutionprocessed IZO TFTs, simple resistor load type inverters were fabricated by connecting a resistor (5 or 10 MΩ). Our IZO TFTs, which were manufactured using the soft baking process at a baking temperature of 120℃, performed well at the operating voltage, and are therefore a good candidate for use in advanced logic circuits and transparent display backplanes.

The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were 8.57 MΩ (Vcc-GND), 14.14 MΩ (Vcc-Input1), 18.24 MΩ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as 2.5 Ω, 50 MΩ, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

We investigated solution-processed indium-zinc oxide (IZO) thin-film transistors (TFTs) by inserting a 2-(4- biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (PBD) buffer layer. This buffer layer efficiently tuned the energy level between the semiconducting oxide channel and metal electrode by increasing charge extraction, thereby enhancing the overall device performance: the IZO TFT with embedded PBD layer (thickness: 5 nm; width: 2,000 μm; length: 200 μm) exhibited a field-effect mobility of 1.31 cm²V^-1s^-1, threshold voltage of 0.12 V, subthreshold swing of 0.87 V decade^-1, and on/off current ratio of 9.28×10⁵.

We investigated the rewritable operation of a non-volatile memory device composed of Al (top)/TiO₂/ indium-zinc-oxide (IZO)/Al (bottom). The oxygen-deficient IZO layer of the device was spin-coated with 0.1 M indium nitrate hydrate and 0.1 M zinc acetate dehydrate as precursor solutions, and the TiO₂ layer was fabricated by atomic layer deposition. The oxygen vacancies IZO layer of an active component annealed at 400℃ using thermal annealing and it was proven to be in oxygen vacancies and oxygen binding environments with OH species and heavy metal ions investigated by X-ray photoelectron spectroscopy. The device, which operates at low voltages (less than 3.5 V), exhibits non-volatile memory behavior consistent with resistive-switching properties and an ON/OFF ratio of approximately 3.6×10³ at 2.5 V.