This review introduces Corning’s Ribbon Ceramic process and the broader idea of ribbon ceramics―continuous, ultra-thin ceramic sheets made by tape or slot-die casting and fast, continuous sintering―covering key materials such as Al₂O₃, YSZ/ScSZ, PZT, LLZO, and LCO. Motivated by the need for scalable, energy-efficient ceramic components for electrification (green-hydrogen SOECs), next-generation Li-metal batteries, and compact piezo devices, we summarize capabilities and use cases using only publicly available information. Our main contribution is a clear platform view: continuous roll-to-roll conveyance with minutes-scale firing produces fully dense, fine-grained, high-purity ceramics at ~10-100 μm thickness with smooth native surfaces and controlled shapes, delivered as long rolls (up to ~300 ft), panels (~100 mm wide), or narrow strips (~0.5 mm). Illustrative results include 20-40 μm 3YSZ electrolytes for SOECs (high oxygen-ion conductance, ~1 GPa bend strength), LLZO garnet separators that cycle at 25℃ with interlayers, and free-standing LCO cathode ribbons tunable from dense to ~30% porous. For piezo acoustics, 60-80 μm PZT sheets (d33 ~300 pC/N) enable fine metallization and on-screen speakers, while fast firing reduces volatile loss and yields smaller grains. Together, these advances point to high-volume, lower-footprint manufacturing and faster adoption of novel ceramic membranes and substrates in SOEC/green-hydrogen systems, solid-state or hybrid lithium batteries, RF/power electronics, and piezo applications.

The increasing global demand for renewable energy has accelerated the deployment of offshore wind farms, thereby highlighting the need for advanced development and performance assessment techniques for dynamic submarine cables used in floating offshore wind systems. These cables are continuously subjected to combined thermal, electrical, and mechanical stresses, with mechanical loading playing a particularly dominant role. As a result, dynamic submarine cables exhibit degradation behaviors that differ significantly from those of conventional fixed submarine cables. This paper presents the design and implementation of a comprehensive evaluation system capable of applying combined thermal, electrical, and mechanical stresses to dynamic submarine cables. The system was validated using a 66 kV wet type submarine cable through commissioning tests and insulation performance measurements. Electrical stress of 72 kV, thermal stress exceeding 95°C, and mechanical stress corresponding to a bending radius of 20 times the cable diameter over 20 cycles were applied to verify system reliability. The subsequent insulation assessments quantitatively confirmed performance variations induced by the combined stresses. The results demonstrate that the proposed platform is the first system capable of simultaneously applying thermal, electrical, and mechanical stresses to dynamic submarine cables, and its operational performance has been successfully validated. This platform enables realistic reliability evaluation of dynamic cables used in floating offshore wind farms and is expected to improve the overall operational reliability of offshore wind power systems.

To ensure high-voltage stability and thermal resistance of insulation paper used in transformers, this study evaluated the structural and electrical properties of four types of insulation paper samples fabricated using unbleached kraft pulp (UKP). The samples were prepared under controlled conditions with different freeness levels (300-700 ml). Tensile strength, dielectric constant, breakdown strength (dry and oil), volume resistivity, water absorption, and oil absorption were quantitatively measured. The sample with a beating degree of 300 exhibited the highest breakdown strength (53.85 kV/mm) and volume resistivity (1.49×10¹⁶ Ω·cm), whereas the samples with higher beating intensity showed improved fiber bonding and densification. These findings demonstrate the practical applicability of UKP-based insulation paper as a high-performance, eco-friendly insulating material for transformer systems, providing a scientific foundation for process optimization in insulation paper design.

Nozzle-printing dispensers, which utilize air pulsation as a dispensing principle, operate by transmitting air pressure to the liquid to push a constant amount of liquid. Nozzle printers have the advantage of precisely controlling energy based on liquid properties, such as viscosity and surface tension, enabling the precise application of liquid at specific locations and quantities. This study introduces a printing process sequence using a nozzle printer equipped with a high-resolution vision alignment system. It compares printing patterns according to key process variables (jet pressure, tip height, and travel speed) that affect coating quality. Experimental results showed that a coating standard deviation of 2.14 μm was achieved at a moving speed of 20 mm/s and a nozzle height of 0.2 mm, resulting in the most stable and uniform coating quality. Through these experiments, optimal conditions were identified based on factors such as coating width, uniformity, and presence of discontinuity, and the effects of these conditions on the precision manufacturing process are discussed.

Multilayer ceramic capacitors (MLCCs) are essential for high-capacitance, miniaturized, and reliable electronic applications. This study examines the impact of layer stacking on the dielectric and electrical properties of MLCCs using a BaTiO₃-based dielectric with MgO, Mn₃O₄, Yb₂O₃, V₂O₅, and (BaCa)SiO₃ glass additives. MLCCs with 10 um-thick dielectric layers and varying Ni electrode layers (10, 30, 50, and 100 layers) were fabricated. The dielectric constant increases significantly up to 30 layers due to compressive stress and sintering densification but it becomes linear beyond 30 layers. Dissipation factor and ESR decrease with higher stacking due to improved sinterability, while breakdown voltage declines exponentially from defect accumulation and thermal stress. Insulation resistance decreases but stabilizes relative to capacitance. C-V results show stress-induced polarization suppression, which reduces the dielectric constant under high voltage. Optimized stacking and sintering conditions are crucial for MIL-PRF-32535 compliant MLCC designs.

This study investigates the insulation performance of a 66 kV dry-type submarine cable used in offshore wind farms under mechanical aging. During installation and operation, submarine cables are subjected to various mechanical stresses, including tension, compression, and bending, which can lead to insulation deterioration. In this study, XLPE samples extracted from a submarine cable were prepared and subjected to controlled tensile strain below the yield strain to evaluate their mechanical and electrical performance. Changes in tensile strength, elongation, and tan δ (dielectric loss factor) were measured to assess the extent of aging. The results indicate that as the applied strain and exposure duration increased, tensile strength and elongation decreased, while tan δ values increased, signifying a decline in electrical insulation performance. A strong negative correlation (R = -0.809) was observed between tan δ and tensile strength, demonstrating that mechanical aging significantly affects electrical properties. These findings highlight the importance of minimizing excessive mechanical stress during the installation and operation of submarine cables. The results provide valuable insights for enhancing the reliability of submarine cables in offshore wind farms and emphasize the necessity of optimized design and maintenance strategies to mitigate the effects of mechanical aging.

The increasing demand for renewable energy is driving the rapid expansion of the offshore wind industry, leading to intensified research on subsea cables. These cables endure combined thermal, electrical, and mechanical stresses, with mechanical stress being a critical failure factor. Environmental changes, such as seabed scouring, free spans, and seismic activity, accelerate cable degradation by introducing additional dynamic loads. Conventional monitoring systems primarily track thermal stress, lacking the ability to assess mechanical impacts. This study develops a system to simultaneously measure thermal and mechanical stress in subsea cables. Laboratory experiments confirm the system’s reliability, showing a temperature measurement error within 0.8% at 60℃ and a strain measurement error within 13% at 378 με. The proposed system aims to enhance failure prediction and maintenance strategies for offshore wind subsea cables.

The characteristics of each address discharge were investigated when the voltages of the scan and common electrodes were lowered simultaneously during an address period under the same address voltage conditions in an AC plasma display panel. It was confirmed that the delay time of address discharge shortened as the voltage decreased. However, the background light increased because the low scanning voltage generated more discharge between the electrodes of the upper and lower plates in the reset period. To lower the background light, a positive voltage was applied to the address electrode of the lower panel during the period when the rising ramp wave was applied, and a floating voltage was applied to the address electrode during the period when the falling ramp wave was applied during the reset period. As a result, the background light could be lowered by about 30%.

This review examines the principles, limitations, and recent advancements in elastic modulus measurement using nanoindentation. The importance of accurate contact area prediction is discussed, along with the Oliver-Pharr method and its limitations. The Continuous Stiffness Measurement (CSM) technique is presented as a significant improvement, allowing continuous measurement of mechanical properties throughout the indentation process. For ultra-thin films, the Li and Vlassak method, which incorporates Yu's solution and the concept of effective thickness, is highlighted as a means to correct for substrate effects. Recent developments in artificial neural network-based models for elastic modulus prediction are also explored. These advancements have greatly expanded the applicability of nanoindentation in semiconductor and MEMS device reliability assessment.

With the extensive industrial growth driven by the Fourth Industrial Revolution and the excessive use of fossil fuels, greenhouse gas emissions have accelerated global warming. Energy harvesting technologies have garnered significant attention as a potential solution to this issue. Among them, triboelectric nanogenerators (TENGs) have emerged as promising candidates for energy collection and conversion. However, TENGs typically face limitations in providing an efficient energy supply due to their high output voltage and low output current. To overcome these challenges, numerous studies have explored various methods to enhance the output performance by increasing the surface area of the triboelectric materials. Herein, we report a high-output TENG fabricated through a simple scratch process. By utilizing sandpaper, typically used for abrasion or polishing, the surface roughness of the triboelectric material PFA was increased through surface scratching. The surface-engineered TENG, prepared through this simple and rapid process, demonstrated enhanced output characteristics with a voltage of 276 V and a current of 72 μA, showing a 21% increase in voltage and a 41% increase in current compared to the non-engineered counterpart, providing sufficient energy to power an LED. These results indicate that the scratch-based surface modification process using sandpaper offers an effective solution for improving triboelectric output performance, establishing TENGs as a key contributor to sustainable energy supply.

Piezoelectric materials, which convert mechanical energy into electrical signals, are widely used in various industrial applications such as sensors, actuators, and energy harvesting devices. This study aims to enhance the performance of Pb(Mg_1/3Nb_2/3)O₃-Pb(Al_1/2Nb_1/2)O₃-Pb(Zr_0.52Ti_0.48)O₃ (PMN-PAN-PZT) piezoelectric ceramics by investigating the effects of varying PAN and PMN content and adding Nb₂O₅ on their piezoelectric properties. The results show that with 2 mol% of PMN and PAN, the morphotropic phase boundary (MPB) region exhibits the highest piezoelectric properties. Additionally, excess Nb₂O₅ positively influenced the piezoelectric properties, maximizing electro-mechanical coupling factor (k_p=63%, d₃₃=440 pC/N). These findings contribute to developing next-generation high-performance piezoelectric materials, with potential for improved efficiency and performance in various industries.

The laser (LASER), originating from the principle of stimulated emission proposed by Albert Einstein, has been a catalyst for substantial advancements across numerous industrial and scientific domains. Initially confined to research and laboratory applications, the scope of laser technology has expanded rapidly over time. This expansion is primarily due to the laser's unique characteristics, such as high-density energy output and precise beam control, which have facilitated its widespread integration into contemporary industrial practices. Specifically, laser materials processing technology enables the machining of diverse materials, including metals, ceramics, and polymers, in a non-contact manner, thereby achieving high precision without the risk of wear or contamination. As a result, laser processing has become indispensable in fields such as advanced electronics manufacturing, medical device production, aerospace, and the automotive industry. Furthermore, laser materials processing exhibits significant potential for high-precision applications that demand minimal thermal deformation of materials, such as microfabrication and the production of complex geometries. This paper provides a comprehensive examination of the development and necessity of laser processing technology, explores various laser types and their possible applications, and elucidates why laser technology has emerged as a fundamental component of modern manufacturing, alongside its trajectory for future development.

Physically Unclonable Functions (PUFs) provide a high level of security for private keys using unique physical characteristics of hardware. However, fabricating PUF chips requires numerous semiconductor processes, leading to high costs, which limits their applications. In this work, we introduce a low-cost manufacturing method for PUF security chips. First, surface roughening through wet-etching is utilized to create random variables. Additionally, physical vapor deposition is added to further enhance randomness. After PUF chip fabrication, both Hamming distance (HD) and Hamming weight (HW) are extracted and compared to verify the fabricated chip. It is confirmed that the PUF chip using two different multiple process variables demonstrates superior uniqueness and uniformity compared to the PUF security chip fabricated using only a single process variable.

This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.

Next-generation wide-bandgap semiconductors such as SiC, GaN, and Ga₂O₃ are being considered as potential replacements for current silicon-based power devices due to their high mobility, larger size, and production of high-quality wafers at a moderate cost. In this study, we investigate the gradual modulation of chemical composition in multi-stacked metal oxide semiconductor thin films to enhance the performance and bias stability of thin-film transistors (TFTs). It demonstrates that adjusting the Ga ratio in the indium gallium oxide (IGO) semiconductor allows for precise control over the threshold voltage and enhances device stability. Moreover, employing multiple deposition techniques addresses the inherent limitations of solution-processed amorphous oxide semiconductor TFTs by mitigating porosity induced by solvent evaporation. It is anticipated that solution-processed indium gallium oxide (IGO) semiconductors, with a Ga ratio exceeding 50%, can be utilized in the production of oxide semiconductors with wide band gaps. These materials hold promise for power electronic applications necessitating high voltage and current capabilities.

In this study, ITO thin films were fabricated on a glass substrate at different thicknesses without introducing oxygen using RF sputtering system. The structural, electrical, and optical properties were evaluated at various thicknesses ranging from 50 to 300 mm. As the thickness of deposited ITO thin film become thicker from 50 to 100 mm, carrier concentration, mobility, and band gap energy also increased while the resistivity and transmittance decreased in the visible light region. When the film thickness increased from 100 to 300 mm, the carrier concentration, mobility, and band gap energy decreased while the resistivity and transmittance increased. The optimum electrical properties were obtained for the ITO film 100 nm. After optimizing the thickness, the ITO thin films were post-annealed at different temperatures ranging from 100 to 300℃. As the annealing temperature increased, the ITO crystal phase became clearer and the grain size also increased. In particular, the ITO thin film annealed at 300℃ indicated high carrier concentration (4.32 × 10²¹ cm^-3), mobility (9.01 cm2/V·s) and low resistivity (6.22 × 10^-4 Ω·cm). This means that the optimal post-annealing temperature is 300℃ and this ITO thin film is suitable for use in solar cells and display application.

Low road lighting is a lighting device that complements the shortcomings of existing pillar-type street lights. It is a lighting device that emits light from the side of the road surface and adjusts the luminance of the road surface like a light carpet. In this paper, to achieve full commercialization, we analyzed the luminance of the installed road surface and studied whether lighting could replace existing road lighting. In this study, the LMK (Luminance Measurement Camera) LABSOFT program was used to measure and analyze the surface luminance of road lighting, and the RELUX program was used to evaluate and analyze the simulation performance to determine light-based lighting conditions. A study was conducted to determine whether replacing pillar-type road lighting with low-level road lighting in a real environment would ensure comfortable and safe night vision for drivers at night.

As complementary metal-oxide semiconductor (CMOS) is scaled down to achieve higher chip density, thin-film layers have been deposited iteratively. The poor film uniformity resulting from deposition or chemical mechanical planarization (CMP) significantly affects chip yield. Therefore, the development of novel fabrication processes to enhance film uniformity is required. In this context, high-pressure deuterium annealing (HPDA) is proposed to reduce the surface roughness resulting from the CMP. The HPDA is carried out in a diluted deuterium atmosphere to achieve cost-effectiveness while maintaining high pressure. To confirm the effectiveness of HPDA, time-of-flight secondary-ion mass spectrometry (ToF-SIMS) and atomic force microscopy (AFM) are employed. It is confirmed that the absorbed deuterium gas facilitates the diffusion of silicon atoms, thereby reducing surface roughness.

By introducing curing kinetics and chemo-rheology for the epoxy resin formulation for ultra-high voltage gas insulated switchgear (GIS) Insulating Spacers, a study was conducted to simulate the curing behavior, flow and warpage analysis for optimization of the molding process in automatic pressure gelation. The curing rate equation and chemo-rheology equation were set as fixed values for various factors and other physical property values, and the APG molding process conditions were entered into the Moldflow software to perform optimization numerical simulations of the three-phase insulating spacer. Changes in curing shrinkage according to pack pressure were observed under the optimized process conditions. As a result, it was confirmed that the residence time in the solid state was shortened due to the lowest curing reaction when the curing holding pressure was 3 bar, and the occurrence of deformation due to internal residual stress was minimized.

The advantage of OTFT technology is that large-area circuits can be manufactured on flexible substrates using a lowcost solution process such as inkjet printing. Compared to silicon-based inorganic semiconductor processes, the process temperature is lower and the process time is shorter, so it can be widely applied to fields that do not require high electron mobility. Materials that have utility as electrode materials include carbon that can be solution-processed, transparent carbon thin films, and metallic nanoparticles, etc. are being studied. Recently, a technology has been developed to facilitate charge injection by coating the surface of the Al electrode with solution-processable titanium oxide (TiOx), which can greatly improve the performance of OTFT. In order to commercialize OTFT technology, an appropriate method is to use a complementary circuit with excellent reliability and stability. For this, insulators and channel semiconductors using organic materials must have stability in the air. In this study, carbon-doped Mo (MoC) thin films were fabricated with different graphite target power densities via unbalanced magnetron sputtering (UBM). The influence of graphite target power density on the structural, surface area, physical, and electrical properties of MoC films was investigated. MoC thin films deposited by the unbalanced magnetron sputtering method exhibited a smooth and uniform surface. However, as the graphite target power density increased, the rms surface roughness of the MoC film increased, and the hardness and elastic modulus of the MoC thin film increased. Additionally, as the graphite target power density increased, the resistivity value of the MoC film increased. In the performance of an organic thin film transistor using a MoC gate electrode, the carrier mobility, threshold voltage, and drain current on/off ratio (I_on/I_off) showed 0.15 cm²/V·s, -5.6 V, and 7.5×10⁴, respectively.

This paper is an experimental study on the optimal operating conditions of direct charging type electrospray for particulate matter collection. To perform the research, a direct charging type electrospray visualization system was configured to photograph the spray shape of microdroplets, and experiments were performed with varying electrode distance, flow rate, and applied voltage, which are the main factors affecting the particulate matter collection efficacy. Through image processing, the total number of microdroplets according to each condition was analyzed, and the number of microdroplets with a diameter of 1.5 mm or less was confirmed. In addition, by calculating the number of microdroplets per power consumption according to the applied voltage, the optimal operating conditions were derived in terms of energy consumption efficacy, and the microdroplet size distribution was analyzed under the optimal operating conditions. As a result of the experiment, it was confirmed that the optimal operating condition was at a flow rate of 10 mL/min and a voltage of -20 kV in case of 5 mm electrode distance, and at a flow rate of 15 mL/min and a voltage of -30 kV in case of 100 mm electrode distance.

In recent years, the transparent amorphous oxide thin film transistor represented by indium-gallium-zinc-oxide (IGZO) has become the first choice of the next generation of integrated circuit control components. This article contributes an overview of IGZO thin-film transistors (TFTs), including their fundamental principles and recent advancements. The paper outlines various TFT structures and places emphasis on the fabrication process of the active layer. The result showed that the size of the active layer including the length-to-width ratio and the width could have a significant effect on the mobility. And the process of TFT could influence the crystal structure of IGZO thin film. Furthermore, the article presents an overview of recent applications of IGZO TFTs, such as their use in display drivers and TFT memories. At last, the future development of IGZO TFT is forecasted in this paper.

The value of experimentally obtained data becomes highest when they are properly analyzed based on valid logics. Many physical and chemical properties such as electrical and magnetic properties, chemical reaction rates, etc. are known to be thermally activated; thus, a proper understanding of thermally-activated processes is of importance. However, there are still a number of papers published with falsely analyzed data. In this contribution, we would like to revisit the meaning of thermally-activated processes, and then reanalyze a data set published misinterpreted. By showing a step-by-step procedure for the reanalysis, we would like to help researchers who may come across such data in the future not to make mistakes in their analysis.

Nano Pt particles were dispersed on carbon-based supports by a polyol process for a catalyst application in a polymer electrolyte fuel cell. We tried to optimize the effect of pH on the electrostatic forces between the support and the Pt colloids. We investigated the relationship among the surface charges on the carbon support, the solution pH, and the concentration of a glycolate, and the Pt particle size. The produced catalyst with nano Pt particles on the support was evaluated by the long-term cyclic voltammetry (CV) performance test and compared with the results from a commercial catalyst. Our experimental results reveal that the pH-control can modify the particle size distribution and the dispersion of the nano Pt particles. This resulted in a cost-effective method for the synthesis of highly Pt loaded Pt/C catalysts for fuel cells better than a commercial catalyst system.

Recently, the global demands for high voltage power semiconductors are increasing across various industrial fields. The use of electric cars with high safety and convenience is becoming practical, and IGBT modules of 3.3 kV and 1.2 kA or higher are used for electric locomotives. Delicate design and advanced process technology are required, and research on the optimization of high-voltage IGBT parts is urgently needed in the industry. In this study, we attempted to design a simulation process through TCAD (technology computer-aid design) software to optimize the process conditions of the fielding process among the core unit processes for an especial high yield voltage. As well, the prior circuit technology design and a ring pattern with a large number of ring formation structures outside the wafer similar to the chip structure of other companies were constructed for 3.3 kV NPT-IGBT through a unit process demonstration experiment. The ring pattern was designed with 21 rings and the width of the ring was 6.6 μm. By changing the spacing between patterns from 17.4 μm to 35.4 μm, it was possible to optimize the spacing from 19.2 μm to 18.4 μm.

Underwater wireless communication is a challenging issue for realizing the smart aqua-farm and various marine activities for exploring the ocean and environmental monitoring. In comparison to acoustic and radio frequency technologies, the visible light communication is the most promising method to transmit data with a higher speed in complex underwater environments. To send data at a speedier rate, high-performance photodetectors are essentially required to receive blue and/or cyan-blue light that are transmitted from the light sources in a light-fidelity (Li-Fi) system. Here, we fabricated high-performance organic phototransistors (OPTs) based on P-type donor polymer (PTO2) and N-type acceptor small molecule (IT-4F) blend semiconductors. Bulk-heterojunction (BHJ) PTO2:IT-4F photo-active layer has a broad absorption spectrum in the range of 450~550 nm wavelength. Solution-processed OPTs showed a high photo-responsivity >1,000 mA/W, a large photo-sensitivity >10³, a fast response time, and reproducible light-On/Off switching characteristics even under a weak incident light. BHJ organic semiconductors absorbed photons and generated excitons, and efficiently dissociated to electron and hole carriers at the donor-acceptor interface. Printed and flexible OPTs can be widely used as Li-Fi receivers and image sensors for underwater communication and underwater internet of things (UIoTs).

An analytical threshold voltage model is presented to observe the change in threshold voltage shift ΔV_th of a junctionless double gate MOSFET using ferroelectric-metal-SiO₂ as a gate oxide film. The negative capacitance transistors using ferroelectric have the characteristics of increasing on-current and lowering off-current. The change in the threshold voltage of the transistor affects the power dissipation. Therefore, the change in the threshold voltage as a function of theferroelectric thickness is analyzed. The presented threshold voltage model is in a good agreement with the results of TCAD. As a results of our analysis using this analytical threshold voltage model, the change in the threshold voltage with respect to the change in the ferroelectric thickness showed that the threshold voltage increased with the increase of the absolute value of charges in the employed ferroelectric. This suggests that it is possible to obtain an optimum ferroelectric thickness at which the threshold voltage shift becomes 0 V by the voltage across the ferroelectric even when the channel length is reduced. It was also found that the ferroelectric thickness increased as the silicon thickness increased when the channel length was less than 30 nm, but the ferroelectric thickness decreased as the silicon thickness increased when the channel length was 30 nm or more in order to satisfy ΔV_th=0.

Currently, semiconductor manufacturing industry heavily relies on a wide range of high global warming potential (GWP) gases, particularly during etching and cleaning processes, and their use and relevant carbon emissions are subject to global rules and regulations for achieving carbon neutrality by 2050. To replace high GWP gases in near future, dry etching using alternative low GWP gases is thus being under intense investigations. In this review, we report a current status and recent progress of the relevant research activities on dry etching processes using a low GWP gas. First, we review the concept of GWP itself and then introduce the difference between high and low GWP gases. Although most of the studies have concentrated on potentially replaceable additive gases such as C₄F₈, an ultimate solution with a lower GWP for main etching gases including CF₄ should be developed; therefore, we provide our own perspective in this regard. Finally, we summarize the advanced dry etch process research with low GWP gases and list up several issues to be considered in future research.

This paper is a study on frequency analysis and electronic noise reduction of energy storage system (ESS). We acquired 4 necessary data for about 2 minutes and 4 seconds using a sampling frequency of 10,000 Hz in ESS. Fast Fourier transform (FFT) was used for electronic noise analysis from the acquired data. As a result, it was confirmed that DC component, fundamental wave, second and higher harmonic component exist. For the attenuation of harmonics, low-pass filter (LPF) was applied. We confirmed that an attenuation of approximately 59.3% appears from the second harmonic. The presence of many harmonic components in the data of the ESS was expected to occur due to the insufficiency of optimization among the modules inside the ESS. Therefore, we propose that a national certification system for ESS should be introduced to settle down the issue properly.

YBa₂Cu₃O_7-y bulk as a high temperature oxide superconducting conductor has the high critical temperature of 92 K. YBa₂Cu₃O_7-y bulk superconductors have been fabricated by a seeded melting growth. Magnetic properties were studied by using superconductor of melted YBa₂Cu₃O_7-y oxides. It was demonstrated that Y₂BaCuO₅ particles acts as a pinning center which plays an important role on the magnetic properties. The thickness of the upper and lower pellets of the YBa₂Cu₃O_7-y bulk was formed at 40 mm with 55 g of the composition, and the YBa₂Cu₃O_7-y superconductor was manufactured through a heat treatment process. Manufacturing the superconducting bulk, it is possible to improve the pore density of the superconducting bulk by providing a path through which oxygen could be emitted.