The phase transition of Li₃PO₄ solid electrolyte for secondary batteries in vacuum has been studied by using real-time synchrotron X-ray scattering. According to the vacuum heating results, the crystal β-Li₃PO₄ phase was stable only from room temperature to 400°C. The crystal γ-Li₃PO₄ phase appeared at 410°C and the crystal β-Li₃PO₄ phase completely disappeared at 430°C. The transition from the β-Li₃PO₄ to the γ-Li₃PO₄ phases occurred primarily at 410°C, which is 40°C lower than the transition temperature of 450°C in air. The decrease in the phase transition temperature in vacuum, compared to that in air, is attributed to a relatively high concentration of oxygen vacancies. As the isothermal annealing time at 390°C was increased to 8 hours, the β-Li₃PO₄ phase was completely transitioned into the γ-Li₃PO₄ phase. Our study revealed the detailed transition behavior from the β-Li₃PO₄ to the γ-Li₃PO₄ phases during real-time annealing in vacuum.

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In52Agx (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn⁴⁸In⁵² (wt%) solder was 53.6 N/mm², and that of the Sn⁴⁸In⁵²Ag1 (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In⁵² (wt%) solder was 119.2℃, and that of the Sn48In52Ag1 (wt%) solder decreased to 114.0℃.

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn4 phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/㎟, and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/㎟, and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/㎟ that was the highest.