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Consumables
WHERE t1.sid in(parameter_dbtbl_keyword '%Consumables%') and t1.xml_status <> 99
2
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"Consumables"
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Keywords
Abrasive (2)
chemical mechanical polishing (2)
CMP (2)
COC (1)
Consumables (1)
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Publication year
2003 (2)
Authors
Sang Yong Kim (2)
Yong Jin Seo (2)
Un Sig Choe (1)
Woon Shik Choi (1)
Woo Sun Lee (1)
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Keywords
Abrasive (2)
chemical mechanical polishing (2)
CMP (2)
COC (1)
Consumables (1)
COO (1)
cost of consumables (1)
cost of Ownership (1)
Removal rate (1)
Reused slurry (1)
Slurry (1)
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authors
Sang Yong Kim (2)
Yong Jin Seo (2)
Un Sig Choe (1)
Woon Shik Choi (1)
Woo Sun Lee (1)
Gyeong Jin Lee (1)
U Seon Lee (1)
Chang Jun Park (1)
Jin Sung Park (1)
Jin Seong Park (1)
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2003 (2)
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"Consumables"
Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives
Yong Jin Seo, Gyeong Jin Lee, Un Sig Choe, Sang Yong Kim, Jin Seong Park, U Seon Lee
J Electr Electron Mater
2003;16(9):759-764.
Published online September 1, 2003
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Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding Of Alumina Abrasive in Diluted Silica Slurry
Yong Jin Seo, Chang Jun Park, Woon Shik Choi, Sang Yong Kim, Jin Sung Park, Woo Sun Lee
J Electr Electron Mater
2003;16(6):465-470.
Published online June 1, 2003
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