이 연구에서는, 비스페놀계 에폭시 수지에 모가 난 비결정 실리카 충전제를 배합하여 제작한 시료를 50℃의 온수에 0일~169일 간 침적시킨 시료의 흡수율, 충?방전전류의 측정, 정전용량, 유전정접을 측정하여 다음과 같은 결론을 얻었다. 충/방전전류는 침적일수가 길어질수록 커졌는데 이는 모가 난 실리카 계 면 사이로 물이 흡습했기 때문이라 생각한다. 모든 시료의 흡수율은 침적일수가 길어질수록 증가하며, 100일 이후부터 포화상태로 되는 것을 확인했다. 주파수가 커질수록 침적일수가 길수록 tanδ는 감소하였으며, 모가 난 충전제가 배합된 시료가 tanδ와 정전용량은 더 컸음을 확인했다.
In this study, the moisture content, charge?discharge current, electrostatic capacity and dielectric loss tangent are measured for the specimen of bisphenol type epoxy resin which is mixed with squared amorphous silica filler and dipped in hot water of 50℃ for 169 days. The results of this study are listed below. The longer of deposition day, the charge and discharge current was increased. It is considered that the reason is because there was water attack through the squared silica surface. The longer of deposition day, the absorption rate of all specimens was increased. It found that the absorption rate reached saturated state after 100 days. The higher frequency and the longer of deposition day, the tanδ was decreased. Also, It found that the tanδ and electrostatic capacity of the specimen which is mixed with squared filler are greater.
