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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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실리콘기판 직접접합기술을 이용한 SOI 홀 센서의 제작과 그 특성

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Fabrication of a SOI Hall Sensor Using Si - wafer Direct Bonding Technology and Its Characteristics

Gwiy Sang Chung
J Electr Electron Mater 1995;8(2):165-170.
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Fabrication of a SOI Hall Sensor Using Si - wafer Direct Bonding Technology and Its Characteristics
J Electr Electron Mater. 1995;8(2):165-170.
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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Fabrication of a SOI Hall Sensor Using Si - wafer Direct Bonding Technology and Its Characteristics
J Electr Electron Mater. 1995;8(2):165-170.
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