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단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정

이세일, 김우영, 정영기, 양종경, 박대희

Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package

Se Il Lee, Woo Young Kim, Young Gi Jeong, Jong Kyung Yang, Dae Hee Park
J Electr Electron Mater 2010;23(12):973-977.
Published online: December 1, 2010
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The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [℃] to 85 [℃], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [℃] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [℃] in ambient temperature.

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Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package
J Electr Electron Mater. 2010;23(12):973-977.   Published online December 1, 2010
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Regular Paper : Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package
J Electr Electron Mater. 2010;23(12):973-977.   Published online December 1, 2010
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