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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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전기화학 기계적 연마를 이용한 Cu 배선의 평탄화

정석훈, 서헌덕, 박범영, 박재홍, 정해도

Planarizaiton of Cu Interconnect using ECMP Process

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J Electr Electron Mater 2007;20(3):213-217.
Published online: March 1, 2007
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Planarizaiton of Cu Interconnect using ECMP Process
J Electr Electron Mater. 2007;20(3):213-217.   Published online March 1, 2007
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:
Include:
Planarizaiton of Cu Interconnect using ECMP Process
J Electr Electron Mater. 2007;20(3):213-217.   Published online March 1, 2007
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