Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

Articles

Page Path

연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구

박기현, 박범영, 김형재, 정해도

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

, , ,

J Electr Electron Mater 2006;19(4):309-313.
Published online: April 1, 2006

5 Views
0 Download
0 Crossref
0 Scopus

Full Article

Download PDF

Keywords: Surface roughenss (R(pk); Reduced peak height) , Pad stiffness, Groove, Pad wear, Within wafer non-uniformity, WIWNU

Cite

CITE

export

Copy Download

Format

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
BibTeX — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

J Electr Electron Mater. 2006;19(4):309-313. Published online April 1, 2006

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

Format:

RIS — For EndNote, ProCite, RefWorks, and most other reference management software
bib — For JabRef, BibDesk, and other BibTeX-specific software

Include:

Citation for the content below
Citation and abstract for the content below

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

J Electr Electron Mater. 2006;19(4):309-313. Published online April 1, 2006

Articles

Page Path

연마불균일도에 영향을 미치는 패드 표면특성에 관한 연구

Effect of Pad Surface Characteristics on Within Wafer Non-uniformity in CMP

Full Article

CITE

Download Citation

Format:

Include:

Related articles

ABOUT

BROWSE ARTICLES

EDITORIAL POLICIES

FOR CONTRIBUTORS