A Study on the Within Wafer Non-uniformity of Oxide Film in CMP

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CMP 패드 강성에 따른 산화막 불균일성(WIWNU)에 관한 연구

박기현, 정재우, 박범영, 서헌덕, 이현섭, 정해도

A Study on the Within Wafer Non-uniformity of Oxide Film in CMP

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J Electr Electron Mater 2005;18(6):521-526.
Published online: June 1, 2005

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Keywords: Within wafer non-uniformity, WIWNU, Chemical mechanical polishing, CMP, Groove, Stiffness, Apparent contact area, Edge effect

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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP

J Electr Electron Mater. 2005;18(6):521-526. Published online June 1, 2005

Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.

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A Study on the Within Wafer Non-uniformity of Oxide Film in CMP

J Electr Electron Mater. 2005;18(6):521-526. Published online June 1, 2005

Articles

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CMP 패드 강성에 따른 산화막 불균일성(WIWNU)에 관한 연구

A Study on the Within Wafer Non-uniformity of Oxide Film in CMP

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