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유기절연재료 : 카본 도포에 따른 Cu - Epoxy 접촉면에서 발생하는 크랙방지에 관한 연구

송재주, 김성홍, 황종선, 박종광, 한병성

Organic Insulation Materials : A Study on the Prevention of Crack Generated in Interface Cu and Epoxy with Painting of Carbon

Jae Joo Song, Sung Hong Kim, Jong Sun Hwang, Jong Kwang Park, Byung Sung Han
J Korean Inst Electr Electron Mater Eng 2001;14(7):578-583.
Published online: July 1, 2001
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Organic Insulation Materials : A Study on the Prevention of Crack Generated in Interface Cu and Epoxy with Painting of Carbon
J Korean Inst Electr Electron Mater Eng. 2001;14(7):578-583.   Published online July 1, 2001
Download Citation

Download a citation file in RIS format that can be imported by all major citation management software, including EndNote, ProCite, RefWorks, and Reference Manager.
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Organic Insulation Materials : A Study on the Prevention of Crack Generated in Interface Cu and Epoxy with Painting of Carbon
J Korean Inst Electr Electron Mater Eng. 2001;14(7):578-583.   Published online July 1, 2001
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