Al-Mo thin films were fabricated using combinatorial sputtering system to realize highly sensitive surface acoustic wave (SAW) devices. The Al-Mo sample library was grown with various chemical compositions and electrical resistivities, which provided important information for selecting the most suitable materials for SAW devices. As the SAWs generated from piezoelectric materials are significantly affected by the resistivity and density of the interdigital transducer (IDT) electrodes, three types of Al-Mo thin films with different Al contents were fabricated. The thickness of the Al-Mo thin film used in the SAW-IDT electrode was fixed at 150 nm. As the Al content of the Al-Mo thin film decreased from 81.2 to 30.3 at%, the resistivity decreased slightly from 5.43±0.15 to 4.87±0.1×10^-5 Ω-cm, whereas the calculated density increased significantly from 4.1 to 7.9 g/㎤. The SAW device composed of Al-Mo IDT electrodes resonated at 143 MHz without frequency shifts; however, the selectivity of the resonant frequency and insertion loss deteriorated as the Al content decreased. This suggest that the resonant characteristics of the SAW devices fabricated with Al-Mo thin films were more strongly influenced by the material density rather than the electrical properties of the IDT electrodes.

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p- Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.