Skip to main navigation
Skip to main content
KIEEME
mobile search button
mobile menu button
Search
Advanced Search
ABOUT
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
E-SUBMISSION
ABOUT
Journal introduction
Aims and scope
Editorial board
Management team
Best practice
Subscription information
Contact us
BROWSE ARTICLES
All issues
Current issue
Most viewed
Most downloaded
Most cited
Search
Metrics
EDITORIAL POLICIES
Research ethics
Peer review policy
Copyright and open access policy
Article sharing policy
Archiving policy
Data sharing policy
Preprint policy
Crossmark policy
Advertising and sponsorship policy
Research misconduct-related regulations
FOR CONTRIBUTORS
Instructions for authors
Checklist
Copyright transfer agreement
Graphical abstract
Page Path
HOME
Search
Thermocompression bonding
WHERE t1.sid in(parameter_dbtbl_keyword '%Thermocompression bonding%') and t1.xml_status <> 99
2
results for
"Thermocompression bonding"
Filter
Keywords
Thermal shock test (2)
Thermocompression bonding (2)
Anisothtopic (1)
Anisotropic conductive adhesive films (1)
Conductive film (1)
More +
Publication year
2009 (2)
Authors
Young Eui Shin (2)
Il Jea Jo (1)
Jin Suk Pak (1)
Jin Suk Park (1)
Sun Eik Son (1)
Keywords
Thermal shock test (2)
Thermocompression bonding (2)
Anisothtopic (1)
Anisotropic conductive adhesive films (1)
Conductive film (1)
Conductive particle (1)
Fiat panel display (1)
Filp chip package (1)
Themosonic bonding (1)
Cancel
Close
authors
Young Eui Shin (2)
Il Jea Jo (1)
Jin Suk Pak (1)
Jin Suk Park (1)
Sun Eik Son (1)
Cancel
Close
Publication Year
2009 (2)
Cancel
Close
Funded articles
Cancel
Close
"Thermocompression bonding"
A Study on Thermosonic Bonding Process and Its Reliability Evaluation of Joints
Young Eui Shin, Jin Suk Park, Sun Eik Son
J Electr Electron Mater
2009;22(8):625-631.
Published online August 1, 2009
PDF
8
View
0
Download
Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application
Jin Suk Pak, Il Jea Jo, Young Eui Shin
J Electr Electron Mater
2009;22(3):199-204.
Published online March 1, 2009
PDF
8
View
0
Download
First
Prev
Page
of 1
Next
Last
×
TOP
First
Prev
