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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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"Thermal property"

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"Thermal property"

Thermal Property of Mo-5~20 wt%. Cu Alloys Synthesized by Planetary Ball Milling and Spark Plasma Sintering Method
Han Chan Lee, Kyoung Il Moon, Paik Kyun Shin
J Electr Electron Mater 2016;29(8):516-521.   Published online August 1, 2016
Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile, and many other applications due to their excellent physical and electric properties. Especially, Mo-Cu composites with 5 ~ 20 wt.% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength, and prominent electrical and thermal conductivity. In most of the applications, highly-dense Mo-Cu materials with homogeneous microstructure are required for better performance. In this study, Mo-Cu alloys were prepared by PBM (planetary ball milling) and SPS (spark plasma sintering). The effect of Cu with contents of 5~20 wt.% on the microstructure and thermal properties of Mo-Cu alloys was investigated.
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Energy Materials : Microstructures and Thermal Properties of Water Quenched Thermoelectric Material in Bi2Te3-PbTe System
Ju Hyuk Yim, Kyoo Ho Jung, Hyun Woo You, Kwang Chon Kim, Jin Sang Kim
J Electr Electron Mater 2010;23(6):502-507.   Published online June 1, 2010
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