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J Electr Electron Mater : Journal of Electrical and Electronic Materials

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"Thermal deformation"

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"Thermal deformation"

Development of Three-Dimensional Deformable Flexible Printed Circuit Boards Using Ag Flake-Based Conductors and Thermoplastic Polyamide Substrates
Aram Lee, Minji Kang, Do Young Kim, Hee Yoon Jang, Ji-won Park, Tae-wook Kim, Jae-min Hong, Seoung-ki Lee
J Electr Electron Mater 2024;37(4):420-426.   Published online July 1, 2024
DOI: https://doi.org/10.4313/JKEM.2024.37.4.9
This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.
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Molding and Evaluation of Ultra-Precision Chalcogenide-Glass Lens for Thermal Inaging Can1era Using Thermal Deforn1ation Compensation
Du Hwan Cha, Jeong Ho Kim, Hye Jeong Kim
J Electr Electron Mater 2014;27(2):91-96.   Published online February 1, 2014
Aspheric lenses used in the thermal imaging are typically fabricated using expensive single-crystal materials (Ge and ZnS, etc.) by the costly single point diamond turning (SPDT) process. As a potential solution to reduce cost, compression molding method using chalcogenide glass has been attracted to fabricate IR optic. Thermal deformation of a molded lens should be compensated to fabricate chalcogenide aspheric lens with form accuracy of the submicron-order. The thermal deformation phenomenon of molded lens was analyzed ant then compensation using mold iteration process is followed to fabricate the high accuracy optic. Consequently, it is obvious that compensation of thermal deformation is critical and useful enough to be adopted to fabricate the lens by molding method.
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