In this study, we propose Ti hole pattern structure on the transparent conductive oxide (TCO) lessdye-sensitized solar cells (DSSCs) using the lift-off process to improve the low light transmittance and lowefficiency caused by opaque Ti electrode. The formation of Ti hole patterns make it possible to move the dyeadsorption and electrolyte. The DSSCs with Ti hole patterns showed a higher photoelectric conversion efficiency(PCE) than those with general structure by 11.1%. As a result, The Ti hole pattern structure can be improved toincrease the light absorption of the dyes and PCE of the TCO-less DSSCs is also increased.

Stainless steel (SS) mesh was used to fabricate photo electrode for flexible dye-seisitzed solar cells(DSSCs) in order to evaluate them as replacements for more expensive transparent conductive oxide(TCO). We fabricated the DSSCs with new type of photo electrode, which consisted of flexible SS mesh coated with 100 nm thickness titanium (Ti) protective layer deposited using electron-beam deposition system. SS mesh DSSCs with protective layer showed higher efficiency than those without a protective layer. The best cell property in the present study showed the open circuit voltage (Voc) of 0.608 V, short-circuit current density (Jsc) of 5.73 mA cm-2, fill factor (FF) of 65.13%, and efficiency (η) of 2.44%. Compared with SS mesh based on DSSCs (1.66%), solar conversion of SS mesh based on DSSCs with protective layer improved about 47%.

In this study, a transparent conductive oxide (TCO)-less dye-sensitized solar cells (DSSCs)was fabricated by using titanium (Ti) electrode to replace the Fluorine-doped tin oxide (FTO) for thereduction of manufacturing cost. Ti film was formed by electron beam evaporation method and the resultsshowed the sheet resistance of Ti electrodes with a thikness of 500 nm similar to FTO. In case of powerconversion efficiency (PCE), a DSSC with Ti electrodes showed a lower value than that with FTO by0.38%. For the investigation of the difference, the DSSCs were measured and analyzed by usingelectrochemical impedance analyzer (EIS).