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"Surface mounted device"

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"Surface mounted device"

Super Thin 0.25 mm Thickness White LED Lamp with PCB Type Lead Frame
Soon Jae Yu, Do Hyung Kim
J Korean Inst Electr Electron Mater Eng 2010;23(1):34-37.   Published online January 1, 2010
DOI: https://doi.org/10.4313/JKEM.2010.23.1.034

Citations

Citations to this article as recorded by  
  • Improvement of Deposition Performance of Ultrasonic Spray Pyrolysis Deposition System through Atomizer Shape Modification
    Kyu-Eon Kim, Jae-Hoo Lee, Jae-Keon Jeon, Sung-Hwan Park, Chibum Lee
    Journal of The Korean Society of Manufacturing Technology Engineers.2015; 24(4): 469.     CrossRef
  • Development of Control System for Ultrasonic Spray Pyrolysis Deposition
    Kyu-Eon Kim, Yeong-Heum Kim, Chibum Lee
    Journal of the Korean Society of Manufacturing Technology Engineers.2014; 23(4): 385.     CrossRef
  • Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties
    Il-Gwon Kim, Moon-Eui Son, Young-Sung Kim
    Journal of Welding and Joining.2014; 32(5): 80.     CrossRef
  • Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame
    Young-Sung Kim, Il-Gwon Kim
    Journal of the Korean Welding and Joining Society.2013; 31(5): 77.     CrossRef
  • Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame
    Chang-Hun Lee, Ki-Chul Kim, Young-Sung Kim
    Journal of Welding and Joining.2012; 30(3): 32.     CrossRef
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Manufacture of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package
J Korean Inst Electr Electron Mater Eng 2007;20(5):415-420.   Published online May 1, 2007
DOI: https://doi.org/10.4313/JKEM.2007.20.5.415
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